Publications – Page 3 – Stanford NanoHeat Lab

2016

Liu, T., Lingamneni, S., Palko, J., Asheghi, M., Goodson, K.E.., “Optimization of hybrid wick structures for extreme spreading in high performance vapor chambers”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2016, May 31 – June 3, Las Vegas, NV, USA.

Katz, J., Asheghi, M., Xia, Y., Goodson, K.E., "Thermal Conductivity Measurement of Polymer Thin Films by the 3w Method Using Nanostencil Patterning," SRC TechCon, September 2016, Austin, TX

Shin, Y.C., Sood, A., Smithe, K.K.H., Goodson, K.E., Pop, E., “Optical and Thermal Properties of
Heterogeneously Integrated CVD-Grown 2D Materials”, Materials Research Society (MRS) Fall Meeting, November 2016, Boston, MA

Yates, L., Sood, A., Cheng, Z., Bougher, T., Malcolm, K., Cho, J., Asheghi, M., Goodson, K.E., Goorsky, M., Faili, F., Twitchen, D., Graham, S., “Characterization of the Thermal Conductivity of CVD Diamond for GaN-on-Diamond Devices”, IEEE Compound Semiconductor IC Symposium (CSICS), October 2016, Austin, TX

Xiong, F., Wang, H., Sood, A., Liu, X., Sun, J., Brongersma, M., Goodson, K.E., Pop, E., Cui, Y., "Tuning Electrical, Optical and Thermal Properties in MoS2 Nanosheets via Li Intercalation," Materials Research Society (MRS) Spring Meeting, April 2016, Phoenix, AZ

Barako, M.T., Isaacson, S.G., Dauskardt, R.H., Goodson, K.E., and Tice, J.B., "Thermal and Mechanical Characterization of Polymeric Composites Containing Aligned Copper Nanowires as Flexible Thermal Conductors," Materials Research Society (MRS) Fall Meeting, November 2016, Boston, MA

Dunham, M. T., Lorenzi, B., Andrews, S., Sood, A., Asheghi, M., Narducci, D., Goodson, K.E., 2016, “Enhanced phonon scattering by nanovoids in high thermoelectric power factor polysilicon thin films,” Applied Physics Letters, Vol. 109, 253104.

Fong, S.W., Sood, A., Chen, L., Kumari, N., Asheghi, M., Goodson, K.E., Gibson, G.A., and H.S.P. Wong, 2016, “Thermal Conductivity Measurement of Amorphous Dielectric Multilayers for Phase-Change Memory Power Reduction,” Journal of Applied Physics, Vol. 120, 015103.

Sood, A., Cho, J., Hobart, K.D., Feygelson, T.I., Pate, B.B., Asheghi, M., Cahill, D.G., and Goodson, K.E., 2016, “Anisotropic and Inhomogeneous Thermal Conduction in Suspended Thin-Film Polycrystalline Diamond,” Journal of Applied Physics, Vol. 119, 175103.

Barako, M.T., Sood, A., Zhang, C., Wang, J., Kodama, T., Asheghi, M., Zheng, X.L., Braun, P.V., and Goodson, K.E., 2016, “Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals,” Nano Letters, Vol. 16, pp. DOI: 10.1021/acs.nanolett.6b00468

Lee, H., Agonafer, D. D., Won, Y., Houshmand, F., Gorle, C., Asheghi, M., Goodson, K. E., 2016, “Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices,” Journal of Electronic Packaging, Vol. 138, 010907.

Cho, J., Li, Z., Asheghi, M., and Goodson, K. E., 2014, “Near-Junction Thermal Management: Thermal Conduction in Gallium Nitride Composite Substrates,” Annual Review of Heat Transfer, Vol. 18, 2016.

2015

Won, Y., Lee, H., Barako, M. T., Jung, K-W, Zhang, C., Dusseault, T., Houshmand, F., Palko, J. W., Agonafer, D., Asheghi, M., Santiago, J. G., Goodson, K. E., “Structure Dependent Wettability on Copper Inverse Opals”, 9th International Conference on Boiling and Condensation Heat Transfer, 2015, April 26-29, Boulder, CO

Palko, J. W., Houshmand, F., Wilbur, J., Zhang, C., Dusseault, T., Won, Y., Lee, H., Barako, M., Agonafer, D., Jung, K-W, Asheghi, M., Santiago, J. G., Goodson, K. E., “Capillary Fed Two Phase Cooling Beyond 1kW/cm2 in Short Wicking Length, Joule‐Heated, Microporous Copper Layers,” 9th International Conference on Boiling and Condensation Heat Transfer, 2015, April 26-29, Boulder, CO

Palko, J. W., Dusseault, T., Zhang, C., Wilbur, J., Ashegi, M., Goodson, K. E., Santiago, J. G., “Localized, High Heat Flux, Two Phase Cooling Using Capillary Fed Porous Structures,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Cho, J., and Goodson, K.E., 2015, “Thermal Transport: Cool Electronics,” Nature Materials, Vol. 14, pp. 136-137.

Roy-Panzer, S., Kodama, T., Lingamneni, S., Panzer, M. A., Asheghi, M., Goodson, K.E., 2015, “Thermal Characterization and Analysis of Microliter Liquid Volumes using the Three-Omega Method,” Review of Scientific Instruments (Featured Article, Cover Image), 86, 024901.

Palko, J.W., Zhang, C., Wilbur, J.D., Dusseault, T.J., Asheghi, M., Goodson, K.E., and Santiago, J.G., 2015, “Approaching the Limits of Two-Phase Boiling Heat Transfer: High Heat Flux and Low Superheat,” Applied Physics Letters, Vol. 107, 253903.

Won, Y., Gao, Y., Guzman de Villoria, R., Wardle, B.L., Xiang, R., Maruyama, S., Kenny, T.W., and Goodson, K.E., 2015, “Nonhomogeneous morphology and the elastic modulus of aligned carbon nanotube films,” J. Micromechanical Microengineering, Vol. 25, 115023.

Ahn, C., Fong, S., Kim, Y., Lee, S., Sood, A., Neumann, C., Asheghi, M., Goodson, K.E., Pop, E., Wong, H.S.P., 2015, “Energy-Efficient Phase-Change Memory with Graphene as Thermal Barrier,” Nano Letters, DOI: 10.1021/acs.nanolett.5b02661

Barako, M.T., Roy-Panzer, S., English, T.S., Kodama, T., Asheghi, M., Kenny, T.W., and Goodson, K.E., 2015, “Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites,” ACS Applied Materials & Interfaces Vol. . DOI: 10.1021/acsami.5b05147

Won, Y., Sood, A., Katz, J., Asheghi, M., Li, Y., Owen, G., Zhu, M., Goodson, K.E., “Thermal Management of QCL Devices & Packaging”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Gorle, C., Lee, H., Houshmand, F., Asheghi, M., Goodson, K.E., Parida, P.R., “Validation study for VOF simulations of boiling in a microchannel,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Scholl, S., Gorle, C., Houshmand, F., Asheghi, M., Goodson, K.E., Verstraete, T., “Numerical optimization of advanced monolithic microcoolers for high heat flux microelectronics,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Scholl, S., Gorle, C., Houshmand, F., Liu, T., Lee, H., Won, Y., Asheghi, M., Goodson, K.E., Kazemi, H., “Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Cho, J., Sood, A., Hayee, F., Asheghi, M., Goodson, K.E., “Thermal Characterization of Nanocrystalline Diamond Films on Silicon”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA.

Houshmand, F., Lee, H., Asheghi, M., Goodson, K.E., “High heat flux subcooled flow boiling of methanol in microtubes,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Zhang,C., Rong,G., Palko,J.W., Dusseault,T.J., Asheghi,M., Santiago,J.G., Goodson,K.E., “Tailoring of permeability in copper inverse opals for electronics cooling applications,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Lee, H., Won, Y., Houshmand, F., Gorle, C., Asheghi, M., Goodson, K.E., “Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Liu, T., Houshmand, F., Gorle, C., Scholl, S., Lee, H., Won, Y., Kazemi, H., Vanhille, K., Asheghi, M., Goodson, K.E., “Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density GaN-SiC chip”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Dunham, M.T., Barako, M.T., LeBlanc, S., Asheghi, M., Chen, B., and Goodson, K.E., 2015, “Power Density Optimization for Micro Thermoelectric Generators,” Energy, Vol. 93, pp. 2006-2017. DOI: 10.1016/j.energy.2015.10.032

Agonafer, D.D., Lopez, K., Palko, J.W., Won, Y., Santiago, J.G., and Goodson, K.E., 2015, “Burst behavior at a capillary tip: Effect of low and high surface tension,” Journal of Colloid and Interface Science, Vol. 455, pp. 1-5.

Barako, M.T., Roy-Panzer, S., Kodama, T., Asheghi, M., Goodson, K.E., “Thermal Conduction in Vertically-Aligned Copper Nanowire Arrays,” Materials Research Society (MRS) Spring Meeting, April 6-10, 2015, San Francisco, CA

Cho, J., Francis, D., Chao, P.C., Asheghi, M., and Goodson, K.E., 2015, “Cross-Plane Phonon Conduction in Polycrystalline Silicon Films,” Journal of Heat Transfer, Vol. 137, 071303.

Aly, M.M.S., Gao, M., Hills, G., Lee., C.-S., Pitner, G., Shulaker, M.M., Wu, T.F., Asheghi, M., Bokor, J., Franchetti., F., Goodson, K.E., Kozyrakis, C., Markov, I., Olukotin, K., Pileggi, L., Pop, E., Rabaey, J., Re, C., Wong, H.-S., Mitra, S., 2015, “Energy-Efficient Abundant-Data Computing: The N3XT 1,000X,” IEEE Computer, Vol. 48, pp. 24-33.

Shi, L., Dames, C., Likes, J.R., Reddy, P.S., Duda, J., Cahill, D.G., Lee, J., Marconnet, A., Goodson, K.E., Bahk, J.-H., Shakouri, A., Prasher, R.S., Felts, J., King, W.P., Han, B., Bischof, J.C., 2015, “Evaluating Broader Impacts of Nanoscale Thermal Transport Research,” Nanoscale and Microscale Thermophysical Engineering, Vol. 19, pp. 127-165.

Chiriac, V., Malloy, S., Anderson, J., and Goodson K.E., 2015, “A Figure of Merit for Smart Phone Thermal Management,” Electronics Cooling, Vol. 17, pp. 18-23.

Won, Y., Cho, J., Agonafer, D., Asheghi, M., Goodson, K.E., 2015, “Fundamental Cooling Limits for High Power Density GaN Electronics,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, pp. 737-744.

2014

Agonafer, D.D., Palko, J., Won, Y., Lopez, K., Dusseault, T.J., Gires, J., Asheghi, M., Santiago, J.G., Goodson, K.E., “Progress on Phase Separation Microfluidics”, Compound Semiconductor Integrated Circuit Symposium (CSICS), 2014, IEEE, Oct 20-21, La Jolla, CA, USA.

Cho, J., Won, Y., Francis, D., Asheghi, M., and Goodson, K.E., “Thermal Interface Resistance Measurements for GaN-on-Diamond Composite Substrates,” IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) 2014, Oct. 19-22, La Jolla, CA, USA.

Tyhach, M., Altman, D., Bernstein, S., Korenstein, R., Cho, J., Goodson, K.E., Francis, D., Faili, F., Ejeckam, F., Kim, S., and Graham, S., “S2-T3: Next generation gallium nitride HEMTs enabled by diamond substrates,” IEEE Lester Eastman Conference on High Performance Devices (LEC) 2014, Aug. 5-7, Ithaca, NY, USA.

Cho, J., Li, Y., Hoke, W., Altman, D.A., Asheghi, M., and Goodson, K.E., 2014, “Phonon scattering in strained transition layers for GaN heteroepitaxy,” Physical Review B, Vol. 89, 115301.

LeBlanc, S., Yee, S. K., Scullin, M. L., Dames, C., and Goodson, K. E., 2014, “Material and manufacturing cost considerations for thermoelectrics,” Renewable and Sustainable Energy Reviews, Vol. 32, pp 313-327.

Yee, S.K., Leblanc, S., Goodson, K.E., Dames, C., 2014, “Reply to the comment on “$ per W metrics for thermoelectric power generation: beyond ZT” by G. Nunes, Jr., Energy Environ. Sci., 2014, 7 DOE:10.1039/C3EE43700K,” Energy and Environmental Science, Vol. 7., 3441.

Barako, M.T., Gao, Y., Won, Y., Marconnet, A.M., Asheghi, M., and Goodson, K.E., 2014, “Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 4, Issue 12, pp 1906-1913.

Jeyasingh, R., Fong, S., Lee, J., Li, Z., Chang, K.W., Mantegazza, D., Asheghi, M., Goodson, K.E., and Wong, H.S.P., 2014, “Ultrafast Characterization of Phase-Change Material Crystallization Properties in the Melt-Quenched Amorphous Phase,” Nano Letters, Vol. 14, pp. 3419-3426

Sood, A., Rowlette, J.A., Caneau, C.G., Bozorg-Grayeli, E., Asheghi, M., and Goodson, K.E., 2014, “Thermal Conduction in Lattice-Matched Superlattices of InGaAs/InAlAs,” Applied Physics Letters, Vol. 105, 051909.

Lee, J., Yoon, Y.J., Eaton, J.K., Goodson, K.E., and Bai, S.J., 2014, “Analysis of oxide (Al2O3, CuO, and ZnO) and CNT nanoparticles disaggregation effect on the thermal conductivity and the viscosity of nanofluids,” International Journal of Precision Engineering and Manufacturing, ” Vol. 15, pp. 703-710.

Won, Y., Barako, M., Agonafer, D. A., Asheghi, M., Goodson, K. E., “Mechanical Properties of Nanostructured Porous Layers for Two-Phase Convection Enhancement”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.

Agonafer, D.A., Lopez, K., Won, Y., Palko, J., Asheghi, M., Santiago, J.G., Goodson, K.E., “Phase-Separation of Wetting Fluids Using Nanoporous Alumina Membranes and Micro-GLASS Capillaries,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.

Prev 1 2 3 4 … 10 11 Next