Publications – Page 3 – Stanford NanoHeat Lab

2017

US Patent 9,583,702. Issued 2017. “Graphene-Inserted Phase Change Memory Device and Method of Fabricating the Same,” Y. Kim, C., Ahn, A. Sood, E. Pop, H-S- Wong, K.E. Goodson, S. Fong, S. Lee, C.M. Neumann, and M. Asheghi.

US Patent 9,601,452. Issued 2017. “High-Conductivity Bonding of Metal Nanowire Arrays,” J.A. Starkovich, E.M. Silverman, J.B. Tice, H.-H. Peng, M.T. Barako, and K.E. Goodson.

Katz, J. S., Lai, H., Teo, Y. C., Asheghi, M., Xia, Y., and Goodson, K. E., "Thermal Conduction in Novel Polymers", Semiconductor Research Corporation (SRC) Techcon, September 2017, Austin, TX

Barako, M.T., Isaacson, S.G., Lian, F., Pop, E., Dauskardt, R.H., Goodson, K.E., and Tice, J., 2017, “Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials,” ACS Applied Materials & Interfaces, Vol. 9, article 42067.

Kodama, Ohnishi, Park, Shiga, Park, Shimada, Shinohara, Shiomi, Goodson, 2017, “Modulation of Thermal and Thermoelectric Transport in Individual Carbon Nanotubes by Fullerene Encapsulation,” Nature Materials, Vol. 16, pp. 892-897.

Palko, Lee, Zhang, Dusseault, Maitra, Won, Agonafer, Moss, Houshmand, Rong, Wilbur, Rockosi, Mykyta, Resler, Altman, Asheghi, Santiago, Goodson, 2017, “Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper,” Advanced Functional Materials, Vol. 27, 1703265.

Huang, S., Lingamneni, S., Xiaolin Zheng, et al., 2017, “Facile Thermal and Optical Ignition of Silicon Nanoparticles and Micron Particles,” Nano Letters, Vol. 17, pp. 5925–5930.

Yalon, E., Aslan, O.B., Smithe, K.K.H., McClellan, C.J., Suryavanshi, S.V., Xiong, F., Sood, A., Neumann, C.M., Xu, X., Goodson, K.E., Heinz, T.F., and Pop, E., 2017, “Temperature Dependent Thermal Boundary Conductance of Monolayer MoS2 by Raman Thermometry,” ACS Applied Materials & Interfaces, Vol. 9, pp. 43013-43020.

Park, W., Kodama, T., Park, J., Cho, J., Sood, A., Barako, M.T., Asheghi, M., and Goodson, K.E., 2017, “Thermal Conduction across Metal-Dielectric Sidewall Interfaces,” ACS Applied Materials & Interfaces, Vol. 9, pp. 30100-30106.

Flader, I. B., Chen, Y., Shin, D. D., Heinz, D. B., Oritz, L. C., Alter, A. L., Park, W., Goodson, K.E., and Kenny, T.W., “Micro-ththering for In-process Stiction Mitigation of Highly Compliant Structures”, The 30th IEEE International Conference on Micro Electro Mechanical Systems, Jan. 22-26 2017, Las Vegas, NV

Park, W., Ahn, E., Kodama, T., Park, J., Barako, M. T., Sohn, J., Cho, J., Kim, S., Marconnet, A. M., Asheghi, M., Sinclair, R., and Goodson, K. E., “Phonon Conduction in Silicon Nanobeam Labyrinths,” Scientific Reports, Vol. 7, article 6233.

Cheaito, R., Sood, A., Yates, L., Cheng, Z., Bougher, T.L., Asheghi, M., Graham, S., Goodson, K.E., "Thermal Conductivity Measurements on Suspended Diamond Membranes using Picosecond and Femtosecond Time-Domain Thermoreflectance", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), May 30-June 2 2017, Orlando, FL

Bougher, T.L., Yates, L., Cheng, Z., Cheaito, R., Sood, A., Asheghi, M., Goodson, K.E., Cola, B.A., Graham, S., "Experimental Considerations of CVD Diamond Film Measurements using Time Domain Thermoreflectance", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), May 30-June 2 2017, Orlando, FL

Sood, A., Xiong, F., Wang, H., Cui, Y., Pop, E., Goodson, K.E., “Understanding and Tuning Heat Conduction in MoS2: Cross-Plane Diffusive-Ballistic Transport, and Dynamic Electrochemical Tuning of Thermal Conductivity by Li Intercalation”, Materials Research Society (MRS) Spring Meeting, April 2017, Phoenix, AZ

Xiong, F., Yalon, E., McClellan, C.J., Sood, A., Zhang, J., Sun, J., Goodson, K.E., Cui, Y., Pop, E., “Probing Electrical and Thermal Properties in Electrochemically Li-Intercalated MoS2 Nanosheets with Raman Spectroscopy”, Materials Research Society (MRS) Spring Meeting, April 2017, Phoenix, AZ

Yalon, E., Smithe, K.K.H., Aslan, O.B., McClellan, C.J., Xiong, F., Shin, Y.C., Sood, A., Suryavanshi, S.V., Xu, R., Neumann, C., Goodson, K.E., Heinz, T., Pop, E., “Characterization of the Thermal Boundary Conductance between MoS2 and SiO2 via In-Situ Raman Spectroscopy of FunctioningTransistors”, Materials Research Society (MRS) Spring Meeting, April 2017, Phoenix, AZ

Barako, M.T., Katz, J., Lingamneni, S., Liu, T., Goodson, K.E., and J.B. Tice, "Transient Thermal Conduction in Nanoscale Copper Architectures with Embedded Phase Change Material," Materials Research Society (MRS) Spring Meeting, April 2017, Phoenix, AZ

Park, W., Shin, D. D., Kim, S. J., Katz, J. S., Park, J., Ahn, C. H., Kodama, T., Asheghi, M., Kenny, T. W., and Goodson, K.E., 2017, “Phonon Conduction in Silicon Nanobeams,” Applied Physics Letters, Vol. 110, article 213102.

Park, W., Sood, A., Park, J., Asheghi, M., Sinclair, R., and Goodson, K.E., 2017, “Enhanced Thermal Conduction through Nanostructured Interfaces,” Nanoscale and Microscale Thermophysical Engineering, pp. 134-144.

Cho, J., Francis, D., Altman, D.H., Asheghi, M., and Goodson, K.E., 2017, “Phonon Conduction in GaN-Diamond Composite Substrates,” Journal of Applied Physics, Vol. 121, 055105.

2016

Liu, T., Lingamneni, S., Palko, J., Asheghi, M., Goodson, K.E.., “Optimization of hybrid wick structures for extreme spreading in high performance vapor chambers”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2016, May 31 – June 3, Las Vegas, NV, USA.

Katz, J., Asheghi, M., Xia, Y., Goodson, K.E., "Thermal Conductivity Measurement of Polymer Thin Films by the 3w Method Using Nanostencil Patterning," SRC TechCon, September 2016, Austin, TX

Shin, Y.C., Sood, A., Smithe, K.K.H., Goodson, K.E., Pop, E., “Optical and Thermal Properties of
Heterogeneously Integrated CVD-Grown 2D Materials”, Materials Research Society (MRS) Fall Meeting, November 2016, Boston, MA

Yates, L., Sood, A., Cheng, Z., Bougher, T., Malcolm, K., Cho, J., Asheghi, M., Goodson, K.E., Goorsky, M., Faili, F., Twitchen, D., Graham, S., “Characterization of the Thermal Conductivity of CVD Diamond for GaN-on-Diamond Devices”, IEEE Compound Semiconductor IC Symposium (CSICS), October 2016, Austin, TX

Xiong, F., Wang, H., Sood, A., Liu, X., Sun, J., Brongersma, M., Goodson, K.E., Pop, E., Cui, Y., "Tuning Electrical, Optical and Thermal Properties in MoS2 Nanosheets via Li Intercalation," Materials Research Society (MRS) Spring Meeting, April 2016, Phoenix, AZ

Barako, M.T., Isaacson, S.G., Dauskardt, R.H., Goodson, K.E., and Tice, J.B., "Thermal and Mechanical Characterization of Polymeric Composites Containing Aligned Copper Nanowires as Flexible Thermal Conductors," Materials Research Society (MRS) Fall Meeting, November 2016, Boston, MA

Dunham, M. T., Lorenzi, B., Andrews, S., Sood, A., Asheghi, M., Narducci, D., Goodson, K.E., 2016, “Enhanced phonon scattering by nanovoids in high thermoelectric power factor polysilicon thin films,” Applied Physics Letters, Vol. 109, 253104.

Fong, S.W., Sood, A., Chen, L., Kumari, N., Asheghi, M., Goodson, K.E., Gibson, G.A., and H.S.P. Wong, 2016, “Thermal Conductivity Measurement of Amorphous Dielectric Multilayers for Phase-Change Memory Power Reduction,” Journal of Applied Physics, Vol. 120, 015103.

Sood, A., Cho, J., Hobart, K.D., Feygelson, T.I., Pate, B.B., Asheghi, M., Cahill, D.G., and Goodson, K.E., 2016, “Anisotropic and Inhomogeneous Thermal Conduction in Suspended Thin-Film Polycrystalline Diamond,” Journal of Applied Physics, Vol. 119, 175103.

Barako, M.T., Sood, A., Zhang, C., Wang, J., Kodama, T., Asheghi, M., Zheng, X.L., Braun, P.V., and Goodson, K.E., 2016, “Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals,” Nano Letters, Vol. 16, pp. DOI: 10.1021/acs.nanolett.6b00468

Lee, H., Agonafer, D. D., Won, Y., Houshmand, F., Gorle, C., Asheghi, M., Goodson, K. E., 2016, “Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices,” Journal of Electronic Packaging, Vol. 138, 010907.

Cho, J., Li, Z., Asheghi, M., and Goodson, K. E., 2014, “Near-Junction Thermal Management: Thermal Conduction in Gallium Nitride Composite Substrates,” Annual Review of Heat Transfer, Vol. 18, 2016.

2015

Won, Y., Lee, H., Barako, M. T., Jung, K-W, Zhang, C., Dusseault, T., Houshmand, F., Palko, J. W., Agonafer, D., Asheghi, M., Santiago, J. G., Goodson, K. E., “Structure Dependent Wettability on Copper Inverse Opals”, 9th International Conference on Boiling and Condensation Heat Transfer, 2015, April 26-29, Boulder, CO

Palko, J. W., Houshmand, F., Wilbur, J., Zhang, C., Dusseault, T., Won, Y., Lee, H., Barako, M., Agonafer, D., Jung, K-W, Asheghi, M., Santiago, J. G., Goodson, K. E., “Capillary Fed Two Phase Cooling Beyond 1kW/cm2 in Short Wicking Length, Joule‐Heated, Microporous Copper Layers,” 9th International Conference on Boiling and Condensation Heat Transfer, 2015, April 26-29, Boulder, CO

Palko, J. W., Dusseault, T., Zhang, C., Wilbur, J., Ashegi, M., Goodson, K. E., Santiago, J. G., “Localized, High Heat Flux, Two Phase Cooling Using Capillary Fed Porous Structures,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Cho, J., and Goodson, K.E., 2015, “Thermal Transport: Cool Electronics,” Nature Materials, Vol. 14, pp. 136-137.

Roy-Panzer, S., Kodama, T., Lingamneni, S., Panzer, M. A., Asheghi, M., Goodson, K.E., 2015, “Thermal Characterization and Analysis of Microliter Liquid Volumes using the Three-Omega Method,” Review of Scientific Instruments (Featured Article, Cover Image), 86, 024901.

Palko, J.W., Zhang, C., Wilbur, J.D., Dusseault, T.J., Asheghi, M., Goodson, K.E., and Santiago, J.G., 2015, “Approaching the Limits of Two-Phase Boiling Heat Transfer: High Heat Flux and Low Superheat,” Applied Physics Letters, Vol. 107, 253903.

Won, Y., Gao, Y., Guzman de Villoria, R., Wardle, B.L., Xiang, R., Maruyama, S., Kenny, T.W., and Goodson, K.E., 2015, “Nonhomogeneous morphology and the elastic modulus of aligned carbon nanotube films,” J. Micromechanical Microengineering, Vol. 25, 115023.

Ahn, C., Fong, S., Kim, Y., Lee, S., Sood, A., Neumann, C., Asheghi, M., Goodson, K.E., Pop, E., Wong, H.S.P., 2015, “Energy-Efficient Phase-Change Memory with Graphene as Thermal Barrier,” Nano Letters, DOI: 10.1021/acs.nanolett.5b02661

Barako, M.T., Roy-Panzer, S., English, T.S., Kodama, T., Asheghi, M., Kenny, T.W., and Goodson, K.E., 2015, “Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites,” ACS Applied Materials & Interfaces Vol. . DOI: 10.1021/acsami.5b05147

Won, Y., Sood, A., Katz, J., Asheghi, M., Li, Y., Owen, G., Zhu, M., Goodson, K.E., “Thermal Management of QCL Devices & Packaging”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Gorle, C., Lee, H., Houshmand, F., Asheghi, M., Goodson, K.E., Parida, P.R., “Validation study for VOF simulations of boiling in a microchannel,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Scholl, S., Gorle, C., Houshmand, F., Asheghi, M., Goodson, K.E., Verstraete, T., “Numerical optimization of advanced monolithic microcoolers for high heat flux microelectronics,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Scholl, S., Gorle, C., Houshmand, F., Liu, T., Lee, H., Won, Y., Asheghi, M., Goodson, K.E., Kazemi, H., “Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Cho, J., Sood, A., Hayee, F., Asheghi, M., Goodson, K.E., “Thermal Characterization of Nanocrystalline Diamond Films on Silicon”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA.

Houshmand, F., Lee, H., Asheghi, M., Goodson, K.E., “High heat flux subcooled flow boiling of methanol in microtubes,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Zhang,C., Rong,G., Palko,J.W., Dusseault,T.J., Asheghi,M., Santiago,J.G., Goodson,K.E., “Tailoring of permeability in copper inverse opals for electronics cooling applications,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Lee, H., Won, Y., Houshmand, F., Gorle, C., Asheghi, M., Goodson, K.E., “Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Liu, T., Houshmand, F., Gorle, C., Scholl, S., Lee, H., Won, Y., Kazemi, H., Vanhille, K., Asheghi, M., Goodson, K.E., “Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density GaN-SiC chip”, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA

Prev 1 2 3 4 … 11 12 Next