Publications – Page 11 – Stanford NanoHeat Lab

1997

Goodson, K.E., and Asheghi, M., 1997, “Near-Field Optical Thermometry,” Microscale Thermophysical Engineering, Vol. 1, pp. 225-235.

Ju, Y.S., and Goodson, K.E., 1997, “Size Effect on the Thermal Conductivity of Silicon-on-Insulator Devices under Electrostatic Discharge (ESD) Conditions,” Japanese Journal of Applied Physics, Part 2, Vol. 36, pp. L798-L800.

Chen, G., Goodson, K.E., Grigoropoulos, C., Hipwell, M.C., Liepmann, D., Majumdar, A., Maruyama, S., Thundat, T., Tien, C.L., Tien, N.C., 1997, “Report of Workshop: Thermophysical Phenomena in Microscale Sensors, Devices, and Structures,” Microscale Thermophysical Engineering, Vol. 1, pp. 267-274.

Ju, Y.S., and Goodson, K.E., 1997, "Impact of Phonon Dispersion upon the Size Effect on Thermal Conduction along Thin Semiconductor Films," Proceedings of the 1997 International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, in Microscale Energy Transport, K.E. Goodson et al., eds., HTD-Vol. 354, pp. 181-190.

Schuder, R.G., and Goodson, K.E., 1997, "Integrated Circuits and MicroElectroMechanical Systems in the Heat Transfer Teaching Laboratory," ASME Proceedings of the 32nd National Heat Transfer Conference, Baltimore, Maryland, August 7-10, in Innovations in Heat Transfer Education, HTD-Vol. 344, M. Bianchi et al., eds., pp. 83-92.

Kurabayashi, K., Touzelbaev, M.N., Asheghi, M., Ju, Y.S., and Goodson, K.E., 1997, "Measurement of the Anisotropic Thermal Conductivity in Polymer Thin Films for Low-Dielectric-Constant Passivation," Proc. 3rd International Workshop on Thermal Investigations of ICs and Microstructures, Cannes, France, September 21-23.

Asheghi, M., Ju, Y.S., and Goodson, K.E., 1997, "Thermal Conductivity of SOI Device Layers," Proceedings of the IEEE International SOI Conference, Tenaya Lodge at Yosemite, Fish Camp, California, October 6-9, IEEE Vol. 97CH36069, pp. 134-135.

Chui, B.W., Goodson, K.E., Kenny, T.W., Mamin, H.J., Terris, B.D, and Rugar, D. "Micromachined heaters with 1-us thermal time constants for AFM thermomechanical data storage," Proceedings of the International Conference on Solid-state Sensors and Actuators, Transducers, Chicago, Illinois, June, 1997.

Ju, Y.S., and Goodson, K.E., 1997, "Short-Timescale Thermal Mapping of Interconnects," Proceedings of the 35th IEEE International Reliability Physics Symposium, Denver, Colorado, April 8-10, IEEE Catalog No. 97CH35983, pp. 320-324.

Goodson, K.E., Kurabayashi, K., and Pease, R.F.W., 1997, “Improved Heat Sinking for Laser-Diode Arrays using Microchannels in CVD Diamond,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. B20, pp. 104-109.

1996

Chui, B.W., Stowe, T.D., Ju, Y. S., Soh, H.T., Minne, S.C., Goodson, K.E., Quate, C.F., Kenny, T.W., Mamin, H.J., Terris, B.D., Ried, R.P., and Rugar, D., 1996, "Improved Cantilevers for AFM Thermomechanical Data Storage," Proceedings of the Solid-State Sensor and Actuator Workshop, Hilton Head, South Carolina, June 2-6, pp. 219-224.

Ju, Y.S., and Goodson, K.E., 1996, "Short-Timescale Thermometry and Reliability Studies of Metal Interconnects in VLSI Circuits," Proceedings of the International Mechanical Engineering Congress and Exposition, Atlanta, GA, November 17-22, in Micro-Electro-Mechanical Systems (MEMS), DSC-Vol. 59, C. T. Avedisian et al., eds., pp. 31-36.

Touzelbaev, M.N., and Goodson K.E., 1996, "Impact of Nucleation Density on the Thermal Resistance near Diamond-Substrate Boundaries," Proceedings of the ASME/AIChE National Heat Transfer Conference, Houston, Texas, August 3-6, Vol. 5, R. L. Mahajan et al., eds., pp. 193-200.

Goodson, K.E., Ju., Y.S., Asheghi, M., Kading, O.W., Touzelbaev, M.N., Leung, Y.K., and Wong, S.S., 1996, "Microscale Thermal Characterization of High-Power Silicon-on-Insulator Transistors," Proceedings of the 31st ASME National Heat Transfer Conference, Houston, Texas, August 3-6,
Vol. 5, R. L. Mahajan et al., eds., pp. 1-9.

Goodson, K.E., 1996, “Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures,” ASME Journal of Heat Transfer, Vol. 118, pp. 279-286.

1995

Goodson, K.E., 1995, "Impact of CVD Diamond Layers on the Thermal Engineering of Electronic Systems," in the Annual Review of Heat Transfer, C.L. Tien, ed., Begell House, New York, NY, Vol. 6, pp. 323-353

Goodson, K.E., Kading, O.W., Rosler, M. and Zachai, R., 1995, “Thermal Conduction normal to Diamond-Silicon Boundaries,” Applied Physics Letters, Vol. 66, pp. 3134-3136.

Goodson, K.E., Kading, O.W., Rosler, M. and Zachai, R., 1995, “Experimental Investigation of Thermal Conduction normal to Diamond-Silicon Boundaries,” Journal of Applied Physics, Vol. 77, pp. 1385-1392.

Goodson, K.E., and Cooper P.T., 1995, "The Effect of High-Energy Electrons on Lattice Conduction in Semiconductor Devices," Proceedings of the Symposium on Thermal Science and Engineering in Honor of Chancellor Chang-Lin Tien, Berkeley, California, November 14, R. Buckius, ed., pp. 153-159.

Leung, Y.-K., Suzuki, Y., Goodson, K.E., and Wong, S.S., 1995, "Self-Heating Effect in Lateral DMOS on SOI," Proceedings of the Seventh International Symposium on Power Devices and Integrated Circuits, H. Ahashi, Y. Uchida, and Y. Sugawara, eds., Yokohama, Japan, May 23-25, pp. 136-140.

Goodson, K.E., and Touzelbaev, M. N., 1995, "Effective Thermal Resistance at Diamond Boundaries in MEMS," presented at the Micromechanical Systems Panel Symposium at the ASME International Congress and Exposition, San Francisco, California, November 12-17, in Proceedings of the ASME Dynamic Systems and Control Division, DSC-Vol. 57-2, T.E. Alberts, ed., ASME Press., New York, pp. 925-930.

Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1995, “Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits,” ASME Journal of Heat Transfer, Vol. 117, pp. 574-581.

1994

Kading, O.W., Skurk, H., and Goodson, K.E., 1994, “Thermal Conduction in Metallized Silicon-Dioxide Layers on Silicon,” Applied Physics Letters, Vol. 65, pp. 1629-1631.

Su, L.T., Chung, J.E., Antoniadis, D.A., Goodson, K.E., and Flik, M.I., 1994, “Measurement and Modeling of Self-Heating in SOI nMOSFETS,” IEEE Transactions on Electron Devices, Vol. 41, pp. 69-75.

Goodson, K.E., and Flik, M.I., 1994, "Thermal Conduction Processes with Sub-Micrometer Lengthscales in Electronic Circuits," Thermal Science and Engineering, Vol. 2, pp. 191-201.

Goodson, K.E., and Flik, M.I., 1994, “Solid-Layer Thermal-Conductivity Measurement Techniques,” Applied Mechanics Reviews, Vol. 47, pp. 101-112.

Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1994, “Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers,” ASME Journal of Heat Transfer, Vol. 116, pp. 317-324.

Goodson, K.E., Kading, O.W., and Zachai, R., 1994, "Thermal Resistances at the Boundaries of CVD Diamond Layers in Electronic Systems," Proceedings of the ASME International Mechanical Engineering Conference and Exposition, Chicago, Illinois, November 7-11, in Heat Transfer in Electronic Systems, R. A. Wirtz et al., eds., ASME HTD-Vol. 292, pp. 83-94.

1993

Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1993, “Annealing-Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide Layers,” IEEE Electron Device Letters, Vol. 14, pp. 490-492.

Flik, M.I., Zhang, Z.Z., and Goodson, K.E., 1993, “Intrinsic Superconducting Radiation Detector,” Applied Physics Letters, Vol. 62, pp. 2862-2864.

Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1993, "Annealing-Temperature Dependence of the Thermal Conductivity of CVD Silicon-Dioxide Layers," Proceedings of the 29th ASME National Heat Transfer Conference, Atlanta, GA, August 8-11, in Heat Transfer on the Microscale, F. M. Gerner and K. S. Udell, eds., ASME HTD-Vol. 253, pp. 21-28.

Goodson, K.E., and Flik, M.I., 1993, “Electron and Phonon Thermal Conduction in Epitaxial High-Tc Superconducting Films,” ASME Journal of Heat Transfer, Vol. 115, pp. 17-25.

1992

Goodson, K.E., and Flik, M.I., 1992, “Effect of Microscale Thermal Conduction on the Packing Limit of Silicon-on-Insulator Electronic Devices,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, pp. 715-722.

Flik, M.I., Zhang, Z.M., Goodson, K.E., Siegal, M.P., and Phillips, J.M., 1992, “The Electron Scattering Rate in Epitaxial YBa2Cu3O7 Superconducting Films,” Physical Review B, Vol. 46, pp. 5606-5614.

Goodson, K. E., and Flik, M. I., 1992, "Effect of Microscale Thermal Conduction on the Packing Limit of Silicon-on-Insulator Electronics," Proceedings of the Third Intersociety Conference on Thermal Phenomena in Electronic Systems, Austin, TX, February 5-8, A. Ortega and S. Oktay, eds., IEEE Catalog Number 92CH3096-5, pp. 122-126.

Flik, M.I., and Goodson, K.E., 1992, "Impact of Microscale Heat Conduction on the Design of Silicon-on-Insulator Electronic Circuits," Proceedings of the NSF/DITAC Collaborative Workshop on Thermal Conductance Enhancement in Microelectronics, Clayton, Australia, May 4-7, T.N. Veziroglu et al., eds., pp. 79-86.

Goodson, K.E., and Flik, M.I., 1992, "Microscale Phonon Transport in Dielectrics and Intrinsic Semiconductors," Proceedings of the ASME Winter Annual Meeting, Anaheim, CA, November 8-13, in Fundamental Issues in Small Scale Heat Transfer, Y. Bayazitoglu and G.P. Peterson, eds., HTD-Vol. 227, pp. 29-36.

Flik, M.I., Choi, B.I., and Goodson, K.E., 1992, “Heat Transfer Regimes in Microstructures,” ASME Journal of Heat Transfer, Vol. 114, pp. 666-674.

Flik, M.I., and Goodson, K.E., 1992, “Thermal Analysis of Electron-Beam Absorption in Low-Temperature Superconducting Films,” ASME Journal of Heat Transfer, Vol. 114, pp. 264-270.

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