Publications – Page 10 – Stanford NanoHeat Lab

2000

Durig, U., Cross, G., Despont, M., Drechsler, U., Haeberle, W., Lutwyche, M.I., Rothuizen, H., Stutz, R., Widmer, R., Vettiger, P., Binnig, G.K., King, W.P., and Goodson, K.E., 2000, “Millipede – An AFM Data Storage System at the Frontier of Nanotribology,” Tribology Letters, Vol. 9, pp. 25-32.

Goodson, K.E., 2000, "Thermal Conduction in Electronic Microstructures," in the Thermal Engineering Handbook, F. Kreith, ed., CRC Press, Boca Raton, Florida, pp. 4.458 – 4.504.

McConnell, A.D., Uma, S., and Goodson, K.E., 2000, "Thermal Conductivity of Doped Polysilicon Layers," Proc. International Conference on Heat Transfer and Transport Phenomena in Microscale Structures, G. P. Celata et al., eds., Begell House, New York, pp. 413-419.

Zeighami, R.M., Laser, D., Zhou, P., Asheghi, M., Devasenathipathy, S., Kenny, T.W., Santiago, J.G., and Goodson, K.E., 2000, "Experimental Investigation of Flow Transition in Microchannels using Micron Resolution Particle Image Velocimetry," Proc. ITherm, Las Vegas, Nevada, May.

Zhou, P., and Goodson, K.E., 2000, "Thermomechanical Diagnostics of BGA Packages using Digital Image/Speckle Correlation (DISC)," Proc. ITherm, Las Vegas, Nevada, May.

Zhang, L., Koo, J.M., Jiang, L., Banerjee, S.S., Asheghi, M., Goodson, K.E., Santiago, J.G., Kenny, T.W., 2000, "Measurements and Modeling of Two-phase Flow in Mirochannels with Nearly-Constant Heat Flux Boundary Conditions," Proceedings of International Mechanical Engineering Congress & Exposition, Orlando, Florida, USA, November, pp. 129-135.

Sverdrup, P. G., Banerjee, K., Dai, C., Shih, W.K., Dutton, R. W., and Goodson, K. E., 2000, "Sub-Continuum Thermal Simulations of Deep Sub-Micron Devices Under ESD Conditions," International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 54-57.

Zhang L., Banerjee S.S., Koo J.M., Laser D.J., Asheghi M., Goodson K.E., Santiago J.G., Kenny T.W., 2000, "A Micro Heat Exchanger with Integrated Heaters and Thermometers," Proc. Hilton Head Solid-State Sensor & Actuator Workshop, Hilton Head, South Carolina, June 4-8.

King, W.P., Kenny, T.W., Goodson, K.E., Cross, G., Despont, M., Drechsler, U., Durig, U., Haberle, W., Lutwyche, M., Rothuizen, H., Stutz, R., Widmer, R., Binnig, G.K., and Vettiger, P. "Design of AFM Cantilevers for Combined Thermomechanical Data Writing and Reading," Proc. of the Hilton Head Solid-State Sensors and Actuators Workshop, pp. 1-5, 2000.

Sverdrup, P.G., Tornblad, O., Banerjee, K., Yergeau, D., Yu, Z., Dutton, R.W., and Goodson, K.E., 2000, "Advanced Electro-Thermal Modeling and Simulation Techniques for Deep Sub-Micron Devices," Proc. TechCon, Phoenix, AZ, September 21-23.

Tornblad, O., Sverdrup, P. G., Yergeau, D., Yu, Z., Goodson, K. E., and Dutton, R. W., 2000, "Modeling and Simulation of Phonon Boundary Scattering in PDE-based Device Simulators," Proc. International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 58-61.

K. Banerjee, D-Y Kim, A. Amerasekera, C. Hu, S. Wong, and K. E. Goodson, 2000, "Microanalysis of VLSI Interconnect Failure Modes under Short-Pulse Stress Conditions," Proceedings of the 38th Annual IEEE International Reliability Physics Symposium, April 10-13, San Jose, CA, pp. 283-288.

K. Banerjee, A. Mehrotra, W. H. Hunter, K. C. Saraswat, K. E. Goodson, and S. Wong, 2000, "Quantitative Projections of Reliability and Performance for Low-k/Cu Interconnect Systems," Proc. of the 38th Annual IEEE International Reliability Physics Symposium, April 10-13, San Jose, CA, pp. 354-358.

Fletcher, D.A., Crozier, K.B., Kino, G.S., Quate, C.F., and Goodson, K.E., 2000, "Scanning Refractive Microlens," Technical Digest of the Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 263-265.

Fletcher, D.A., Simanovskii, D., Palanker, D.V., Crozier, K.B., Quate, C.F., Kino, G.S., and Goodson, K.E., 2000, "Microfabricated Solid Immersion Lens with Metal Aperture," Proc. IEEE/LEOS International Conference on Optical MEMS, Kauai, Hawaii.

1999

Zhou, P., and Goodson, K.E., 1999, "Diagnostics of FLIP-CHIP/BGA Structures using Phase-Shifting Speckle-Pattern Interferometry," Proc. Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK e99), Maui, Hawaii, June 13-19.

Kurabayashi, K., and Goodson, K.E., 1999, “Impact of Molecular Orientation on Thermal Conduction in Spin-Coated Polyimide Films,” Journal of Applied Physics, Vol. 86, pp. 1925-1931.

Ju, Y.S., and Goodson, K.E., 1999, “Phonon Scattering in Silicon Films of Thickness Below 100 nm,” Applied Physics Letters, Vol. 74, pp. 3005-3007.

Kurabayashi, K., Asheghi, M., Touzelbaev, M.N., and Goodson, K.E., 1999, “Measurement of the Thermal Conductivity Anisotropy in Polyimide Films,” IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 8, pp. 180-191.

Chui, B.W., Asheghi, M., Ju, Y.S., Goodson, K.E., Kenny, T.W., and Mamin, H.J., 1999, “Intrinsic-Carrier Thermal Runaway in Silicon Microcantilevers,” Microscale Thermophysical Engineering, Vol. 3, pp. 217-224.

Ju, Y.S., and Goodson, K.E., 1999, “Process-Dependent Thermal Transport Properties of Silicon Dioxide Films Deposited using Low-Pressure Chemical Vapor Deposited,” Journal of Applied Physics, Vol. 85, pp. 7130-7134.

Ju, Y.S., Kurabayashi, K., and Goodson K.E., 1999, “Thermal Characterization of Anisotropic Thin Dielectric Films using Harmonic Joule Heating,” Thin Solid Films, Vol. 339, pp. 160-164.

Goodson, K.E., and Ju, Y.S., 1999, “Heat Conduction in Novel Electronic Films,” in the Annual Review of Materials Science, E.N. Kaufmann et al., eds., Annual Reviews, Palo Alto, CA, Vol. 29, pp. 261-293.

Ju, Y.S., and Goodson, 1999, Book: "Microscale Heat Conduction in Integrated Circuits and their Constituent Films," Kluwer Academic Publishers, Boston.

Chui, B.W., Asheghi, M., Ju, Y.S., Mamin, H.J., Goodson, K.E., and Kenny, T.W., 1999, "Measurement and Modeling of Thermal-Electrical Runaway in Silicon Cantilevers," Proceedings 10th International Conference on Solid State Sensors and Actuators, p. 1862.

King, W.P., Santiago, J.G., Kenny, T.W., and Goodson, K.E., 1999, "Modeling and Simulation of Sub-Micrometer Heat Transfer in AFM Thermomechanical Data Storage," ASME MEMS-Vol. 1, pp. 583-588.

Asheghi, M., W.P. King, W.P., Chui, B.W., Kenny, T.W., and Goodson, K.E., 1999, "Thermal Engineering of Doped Single-Crystal Silicon Microcantilevers for High Density Data Storage," Proceedings 10th International Conference on Solid State Sensors and Actuators. P. 1840 (1999)

Goodson, K.E., "Microscale Thermal Engineering of Integrated Circuits," Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK 99), Maui, Hawaii, June 13-19.

Asheghi, M., Kurabayashi, K., Goodson, K.E., Kasnavi, R., and Plummer, J.D., 1999, "Thermal Conduction in Doped Silicon Layers," accepted for the 33rd ASME/AIChE National Heat Transfer Conference, Albuquerque, NM, August 8-14.

Ju, Y.S., and Goodson, K.E., 1999, "Measurements of the Thermal Conductivity of Monocrystalline Silicon Films," accepted for the 33rd ASME/AIChE National Heat Transfer Conference, Albuquerque, NM, August 8-14.

Kurabayashi, K., and Goodson, K.E., 1999, "Prediction of the Thermal Conductivity Anisotropy in Linear-Chain Polymer Films," accepted for the ASME/JSME Thermal Engineering Joint Conference, San Diego, CA, March 15-19.

Sverdrup, P.G., Ju, Y.S., and Goodson, K.E., 1999, "Impact of Heat Source Localization on Conduction Cooling of Silicon-on-Insulator Devices," Proc. International Conference on Modelling and Simulation of Microsystems, Puerto Rico, April 19-22.

1998

Touzelbaev, M.N., and Goodson, K.E., 1998, “Applications of Micron-Scale Passive Diamond Layers for the IC and MEMS Industries,” Diamond and Related Materials, Vol. 7, pp. 1 – 14.

Ju, Y.S., and Goodson, K.E., 1998, “Short-Time-Scale Thermal Mapping of Microdevices using a Scanning Thermoreflectance Technique,” ASME Journal of Heat Transfer, Vol. 120, pp. 306-313.

Cahill, D., Chen, G., Dresselhaus, M.S., Goodson, K.E., Ho, C.M., Longtin, J., Majumdar, A., Phinney, L., Pohl, R., Tien, C.L., Wong, C., 1998, “Report of Workshop: 2nd Microthermal Workshop and Tutorial at the Albuquerque Convention Center,” Microscale Thermophysical Engineering, Vol. 2, pp. 215-244.

Ju, Y.S., Kurabayashi, K., and Goodson, K.E., 1998, “Thermal Characterization of IC Interconnect Passivation using Joule Heating and Optical Thermometry,” Microscale Thermophysical Engineering, Vol. 2, pp. 101-110.

Chaudhari, A., Woudenberg, T., Albin, M., and Goodson, K.E., 1998, “Transient Liquid-Crystal Thermometry of Microfabricated PCR Vessel Arrays,” IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 7, pp. 345-355.

Chui, B.W., Stowe, T.D., Ju, Y.S., Goodson, K.E., Kenny, T.W., Mamin, H.J., Terris, B.D., Ried, R.P., and Rugar, D., 1998, “Low-Stiffness Silicon Cantilevers with Integrated Heaters and Piezoresistive Sensors for High-Density AFM Thermomechanical Data Storage,” IEEE/ASME Journal of MicroElectroMechnical Systems, Vol. 7, pp. 69-78.

Goodson, K.E., Ju, Y.S., and Asheghi, M., 1998, "Thermal Phenomena in Semiconductor Devices and Interconnects," in Microscale Energy Transport, C.L. Tien et al., eds., Taylor & Francis, New York, NY, pp. 229-293.

Sverdrup, P.G., Kurabayashi, K., Ju, Y.S., Shieh, B.P., and Goodson, K.E., 1998, "Thermal Reliability Problems Posed by Novel Dielectrics," Proc. 15th International VLSI Multilevel Interconnection Conference (VMIC), Santa Clara, CA, June 16-18, VMIC Catalog No. 98 IMIC – 108, pp. 261-266.

Kurabayashi, K., Asheghi, M., Touzelbaev, M.N., and Goodson, K.E., 1998, "Measurement of the Thermal Conductivity Anisotropy in Polymer Films," Proceedings of the 1998 International Mechanical Engineering Congress and Exposition, Anaheim, California, November 15-20, S. Liu et al., eds.

Kurabayashi, K., Touzelbaev, M.N, Asheghi, M., Ju, Y.S., and Goodson, K. E., 1998, "Measurement of the Anisotropic Thermal Conductivities in Polymer Films," Proceedings of the 7th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, Albuquerque, NM, June 14-18, B.F. Armaly et al., eds., Vol. 3, pp.187-194.

Kurabayashi, K., and Goodson, K.E., 1998, “Precision Measurement and Mapping of Die-Attach Thermal Resistance,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. A21, pp. 506-514.

Asheghi, M., Touzelbaev, M.N., Goodson, K.E., Leung, Y.K., and Wong, S.S., 1998, “Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates,” ASME Journal of Heat Transfer, Vol. 120, pp. 31-36.

US Patent 5,843,224. Issued 1998. "Composite structure comprising a semiconductor layer arranged on a diamond or diamond-like layer and process for its production," R. Zachai, T. Gutheit, K.E. Goodson.

1997

Touzelbaev, M.N., and Goodson K.E., 1997, “Impact of Nucleation Density on Thermal Resistance Near Diamond-Substrate Boundaries,” AIAA Journal of Thermophysics and Heat Transfer, Vol. 11, pp. 506-512.

Ju, Y.S., and Goodson, K.E., 1997, “Thermal Mapping of Interconnects Subjected to Brief Electrical Stresses,” IEEE Electron Device Letters, Vol. 18, pp. 512-514.

Asheghi, M., Leung, Y.K., Wong, S.S., and Goodson, K.E., 1997, “Phonon-Boundary Scattering in Thin Silicon Layers,” Applied Physics Letters, Vol. 71, pp. 1798-1800.

Ju, Y.S., Kading, O.W., Leung, Y.K., Wong, S.S., and Goodson, K. E., 1997, “Short-Timescale Thermal Mapping of Semiconductor Devices,” IEEE Electron Device Letters, Vol. 18, pp. 169-171.

Leung, Y.-K., Paul, A.K., Goodson, K.E., Plummer, J.D., and Wong, S.S., 1997, “Heating Mechanisms of LDMOS and LIGBT in Ultrathin SOI,” IEEE Electron Device Letters, Vol. 18, pp. 414-416.

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