Publications

2021

Perez, C., Knepper, R., Marquez, M.P., Forrest, E.C., Tappan, A.S., Asheghi, M., Goodson, K.E., Ziade, E.O., 2021 “Non-Contact Mass Density and Thermal Conductivity Measurements of Organic Thin Films Using Frequency – Domain Thermoreflectance,” Advanced Materials Interfaces, 9, 2, 1–6.

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Kwon, H., Perez, C., Park, W., Asheghi, M., and Goodson, K.E., 2021 “Thermal Characterization of Metal–Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers,” ACS Applied Materials Interfaces, 13, 48.

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Scott, E. A., Perez, C., Saltonstall, C., Adams, D. P., Hodges, C., Asheghi, M., Goodson, K. E., Hopkins, P., Leonhardt, D., & Ziade, E.O. (2021). Simultaneous thickness and thermal conductivity determination of thinned silicon from 100 nanometers to 40 microns. Applied Physics Letters, 1–7.

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Lee, H., Kang, M., Jung, K.W., Kharangate, C.R., Lee, S., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “An Artificial Neural Network Model for Predicting Frictional Pressure Drop in Micro-Pin Fin Heat Sink.” Applied Thermal Engineering, 2021, p. 117012., doi:10.1016/j.applthermaleng.2021.117012

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Jung, D., Lee, H., Kong, D., Cho, E., Jung, K.W., Kharangate, C.R., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “Thermal Design and Management of Micro-Pin Fin Heat Sinks for Energy-Efficient Three-Dimensional Stacked Integrated Circuits.” International Journal of Heat and Mass Transfer, vol. 175, 2021, p. 121192., doi:10.1016/j.ijheatmasstransfer.2021.121192

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Chen, M. E., Rojo, M. M., Lian, F., Koeln, J., Sood, A., Bohaichuk, S. M., Neumann, C. M., Garrow, S. G., Alleyne, A. G., Goodson, K. E., Pop, E., “Graphene-Based Electromechanical Thermal Switches”, 2D Materials, in press.

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Xiong, F., Yalon, E., McClellan, C. M., Zhang, J., Aslan, O. B., Sood, A., Sun, J., Andolina, C., Al-Saidi, W., Goodson, K. E., Heinz, T. F., Cui, Y., Pop, E. 2021 “Tuning Electrical and Interfacial Thermal Properties of Bilayer MoS2 via Electrochemical Intercalation”, Nanotechnology, 32, 26520

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Hinckley, A. C., Andrews, S. C., Dunham, M., Sood, A., Barako, M. T., Schneider, S., Toney, M. F., Goodson, K. E., Bao, Z., 2021 “Achieving High Thermoelectric Performance and Metallic Transport in Solvent-Sheared PEDOT:PSS”, Advanced Electronic Materials, 2001190.

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Zhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Goodson, K. E. (2021). Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications. International Journal of Heat and Mass Transfer, 173, 121241

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Kwon, H., Khan, A.I., Perez, C., Asheghi, M., Pop, E., Goodson, K.E., 2021 “Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films”, ACS Nano Letters, 21 (14), 5984-5990.

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Kwon, H., Perez, C., Kim, H. K., Asheghi, M., Park, W., & Goodson, K. E. (2021). Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition. ACS Applied Materials & Interfaces. https://doi.org/10.1021/acsami.0c19197

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Liu, T., Asheghi, M., & Goodson, K. E. (2021). Performance and Manufacturing of Silicon-Based Vapor Chambers. Applied Mechanics Reviews, 73(1), 010802

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Soroush, F., Liu, T., Wu, Q., Asheghi, M., Goodson, K. E., Marco, L., … & Martin, R. (2021, October). Contact Angle Tuning of Copper Microporous Structures. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T07A010). American Society of Mechanical Engineers.

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Soroush, F., Liu, T., Wu, Q., Zhang, C., Asheghi, M., Goodson, K. E., … & Martin, R. (2021, October). A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T05A001). American Society of Mechanical Engineers.

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A. Sood, C. Sievers, Y. C. Shin, V. Chen, S. Chen, K. K. H. Smithe, S. Chatterjee, D. Donadio, K. E. Goodson, E. Pop, “Engineering thermal transport across layered graphene-MoS2 superlattices”, ACS Nano, 15, 19503 (2021)

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2020

Hazra, S., Singh, Y., Asheghi, M., Goodson, K.E., Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn EutecticChip Bonding for Packaging and Integration of Extreme Heat Flux Micro-coolers, Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2020 October 27-29, 2020.

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Hazra, S., Liu, T., Asheghi, M., Goodson, K.E., Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure, Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2020, October 27-29, 2020.

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Piazza, A.,Hazra, S.Jung, K., Gupta, M., Jih, E., Asheghi, M., Goodson, K.E., Considerations and Challenges for Large Area Embedded Micro-channels with 3D Manifold in High Heat Flux Power Electronics Applications, ITHERM 2020, Florida, USA.

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Jung, K., Hazra, S., Kwon, H., Piazza, A., Jih, E., Asheghi, M., Gupta, M., Degner, M., Goodson, K.E., Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel 3D-Manifold Coolers (EMMC): Part 2 – Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~ 1 kW/cm2) Power Electronics Cooling, Journal of Electronic Packaging 202

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Hazra, S., Jung, K., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel 3D-Manifold Coolers (EMMC): Part 3 – Addressing Challenges in Laser Micro-Machining based Manufacturing of 3D-Manifolded Micro-cooler Devices, Journal of Electronic Packaging, ASME 2020

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Hazra, S., Piazza, A., Jung, K., Asheghi, M., Gupta M, Jih E, Degner M, Goodson K, Microfabrication Challenges for Silicon-based large area (>500 mm2) 3D-manifolded embedded micro-cooler devices for high heat flux removal, ITHERM 2020, Florida, USA.

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Park, J., Bae, K., Kim, T. R., Perez, C., Sood, A., Asheghi, M., Goodson, K. E., Park, W (2020). “Direct Quantification of Heat Generation Due to Inelastic Scattering of Electrons Using a Nanocalorimeter”. Advanced Science, 2002876, 8

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Wu, Q, Zhang, C, Asheghi, M, & Goodson, K. “Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications.” Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK). .https://doi.org/10.1115/IPACK2020-2603.

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Liu, T., Palko, J. W., Katz, J. S., Zhou, F., Dede, E. M., Asheghi, M., & Goodson, K. E. (2020). Steady-State Parametric Optimization and Transient Characterization of Heat Flow Regulation With Binary Diffusion. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(12), 1996-2007.

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A.I. Khan, H. Kwon, R. Islam, C. Perez, M.E. Chen, M. Asheghi, K.E. Goodson, H.-S.P. Wong, E. Pop, “Two-Fold Reduction of Switching Current Density in Phase Change Memory Using Bi2Te3 Thermoelectric Interfacial Layer,” IEEE Electron Dev. Lett. 41, 1657-1660 (2020).

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U.S. Provisional Application 62,971,346. Issued 2020, "High Thermal Conductivity AlN Heat Spreader Films". Ueda, S., McLeod A., Kummel, A., Burkland, M., Chumbles, E., Kazior, T., Pop, E., Chen, M., Perez, C., and Rodwell, M.

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Soroush, F., Jung, K. W., Iyengar, M., Malone, C., Asheghi, M., and K. Goodson, “Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silicon-based Thermal Management Devices,” 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, 2020, pp. 957-962, doi: 10.1109/ITherm45881.2020.9190368.

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Terzis, A., Ramachandranm A., Wang, K., Asheghi, M., Goodson, K.E., and Santiago, J.G., “High-Frequency Water Vapor Sorption Cycling Using Fluidization of Metal-Organic Frameworks,” Cell Reports Physical Science, Vol. 1., 100057.

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Nguyen, T.K., Phan, H.P., Dowling, K.M., Yalamarthy, A.S., Dinh, T., Balakrishnan, V., Liu, T.Y., Chapin, C.A., Truong, Q.D., Dau, V.T., Goodson, K.E., Senesky, D.G., Dao, D.V., Nguyen, N.T., 2020, “Lithography and Etching-Free Microfabrication of Silicon Carbide on Insulator Using Direct UV Laser Ablation,” Advanced Engineering Materials, Vol. 22, 1901173.

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Guo, P.F., Burrow, J.A., Sevison, G.A., Kwon, H., Perez, C., Hendrickson, J.R., Smith, E.M., Asheghi, M., Goodson, K.E., Agha, I., Sarangan, A.M., 2020,  Tungsten-doped Ge2Sb2Te5 phase change material for high-speed optical switching devices,” Applied Physics Letters, Vol. 116, 131901.

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Liu, T.Y., Dunham, M.T., Jung, K.W., Chen, B.X., Asheghi, M., and Goodson, K.E., 2020, “Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution,” International Journal of Heat and Mass Transfer, Vol. 152, 119569.

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Sevison, G., Farzinazar, S., Burrow, J., Perez, C., Kwon, Heungdong, Lee, J., Asheghi, M., Goodson, K.E., Hendrickson, J., Afha, I., 2020, “Phase Change Dynamics and 2-Dimensional 4Bit Memory in Ge2Sb2Te5 Via Telecom-Band Encoding,” ACS Photonics, Vol. 7, pp. 480-487.

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Kharangate, C.R., Libeer, W., Palko, J., Lee, H., Shi, J., Asheghi, M., Goodson, K.E., 2020, “Investigation of 3D Manifold Architecture Heat Sinks in Air-Cooled Condensers,” Applied Thermal Engineering, Vol. 167, 114700.

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2019

Dunham, M.T., Hendricks, T.J., and Goodson, K.E., 2019, “Thermoelectric Generators: A Case Study in Multi-Scale Thermal Engineering Design,” Advances in Heat Transfer, Vol. 51, Ch. 5, pp. 299-350, Elsevier, New York.

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Liu, T., Palko, J.W., Katz, J.S., Dede, E.M., Zhou, F., Asheghi, M., and Goodson, K.E., 2019, “Tunable, Passive Thermal Regulation through Liquid to Vapor Phase Change,” Applied Physics Letters, Vol. 115, 254102. DOI: 10.1063/1.5133795.

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Sood, A., Xiong, F., Chen, S., Wang, H., Selli, D., Zhang, J., McClellan, C.J., Sun, J., Donadio, D., Cui, Y., Pop, E., Goodson, K.E., 2018, “Publisher Correction:  An Electrochemical Thermal Transistor,” Nature Communications, Vol. 10, 4465, DOI: 10.1038/s41467-019-12471-4.

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Jung, K.W., Kharangate, C.R., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E.M., Goodson, K.E., 2019, “Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance,” International Journal of Heat and Mass Transfer, Vol. 130, pp. 1108-1119.

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Flader, I.B., Chen, Y.H., Yang, Y.S., Ng, E.J., Shin, D.D., Heinz, D.B., Ortiz, L.C., Alter, A.L., Park, W., Goodson, K.E., Kenny, T.W., 2019, “Micro-Tethering for Fabrication of Encapsulated Inertial Sensors With High Sensitivity,” J. MicroElectroMechanical Systems, Vol. 28, pp. 372-381.

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Kong, D., Jung, K.W., Jung, S., Jung, D., Schaadt, J., Iyengar, M., Malone, C., Kharangate, C.R., Asheghi, M., Goodson, K.E., and Lee, H., 2019, “Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa,” International Journal of Heat and Mass Transfer, Vol., 141, pp. 145-155.

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Xu, R.L., Rojo, M.M., Islam, S.M., Sood, A., Vareskic, B., Katre, A., Mingo, N., Goodson, K.E., Xing, H.G., Jena, D., Pop, E., 2019, “Thermal Conductivity of Crystalline AlN and the Influence of Atomic-Scale Defects,” Journal of Applied Physics, Vol. 126, 185105.

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Okabe, K., Sood, A., Yalon, E., Neumann, C.M., Asheghi, M., Pop, E., Goodson, K.E., Wong, H.-S.P., 2019, “Understanding the Switching Mechanism of Interfacial Phase Change Memory,” Journal of Applied Physics, 184501, DOI: 10.1063/1.5093907.

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Sood, A., Xiong, F., Chen, S., Cheaito, R., Lian, F., Asheghi, M., Cui, Y., Donadio, D., Goodson, K.E., Pop, E., 2019, “Quasi-Ballistic Thermal Transport Across MoS2 Thin Films,” Nano Letters, DOI: .

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Chen, S., Sood, A., Pop, E., Goodson, K.E., Donadio, D., 2019, “Strongly Tunable Anisotropic Thermal Transport in MoS2 by Strain and Lithium Intercalation: First–Principles Calculations,” 2D Materials, Vol 6, 025033.

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Kuo CY, Long JD, Campo-Fernandez B, … Hollis RP, Kohn DB. Site-Specific Gene Editing of Human Hematopoietic Stem Cells for X-Linked Hyper-IgM Syndrome. Cell Rep 23:2606-2616, 2018.

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Lomova A, Clark DN, Miyahira EY, … and Kohn DB. Improving Gene Editing Outcomes in Human Hematopoietic Stem and Progenitor Cells by Temporal Control of DNA Repair. Stem Cells, In Press. PMID: 30372555

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Masiuk KE, Laborada J, Roncarolo MG, Hollis RP and Kohn DB. Lentiviral Gene Therapy in HSCs Restores Lineage-Specific Foxp3 Expression and Suppresses Autoimmunity in a Mouse Model of IPEX Syndrome. Cell Stem Cells, In Press.

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2018

Katz, J.S., Park, W., Barako, M.T., Sood, A., Asheghi, M., Goodson, K.E., “Nanostencil Fabrication with Double Exposure Optical Lithography for Scalable Resist-Free Patterning of Metal on Polymers”, Hilton Head Solid-State Sensor, Actuators, and Microsystems Workshop, June 3-7 2018, Hilton Head, SC

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Katz, J. S., Barako, M. T., Park, W., Sood, A., Asheghi, M., & Goodson, K. E. (2018, May). Highly Anisotropic Thermal Conductivity in Spin-Cast Polystyrene Nano-Films. In 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 477-481). IEEE.

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Barako, M.T., Lingamneni, S., Katz, J.S., Liu, T., Goodson, K.E., and Tice, J., 2018, “Optimizing the Design of Composite Phase Change Materials for High Thermal Power Density,” Journal of Applied Physics, Vol. 124, 145103.

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Sood, Xiong, Chen, Wang, Selli, Zhang, McClellan, Sun, Donadio, Cui, Pop, Goodson, 2018, 2019, “An Electrochemical Thermal Transistor,” Nature Communications, Vol. 9, 4510. See also publisher’s correction, Vol. 10, 4465

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