Wu, X., Khan, A. I., Ramesh, P., Perez, C., Kim, K., Lee, Z., Saraswat, K., Goodson, K. E., Philip Wong, H. S., Pop, E. “Understanding Interface-Controlled Resistance Drift in Superlattice Phase Change Memory”. IEEE Electron Device Lett. 2022, 2–5.

Khan, A. I., Wu, X., Perez, C., Won, B., Kim, K., Ramesh, P., Kwon, H., Tung, M. C., Lee, Z., Oh, I. K., Saraswat, K., Asheghi, M., Goodson, K. E., Wong, H. S. P., Pop, E. “Unveiling the Effect of Superlattice Interfaces and Intermixing on Phase Change Memory Performance”. Nano Letters, 2022, 22 (15), 6285–6291.

Perez, C., Jog, A., Kwon, H., Gall, D., Asheghi, M., Kumar, S., Park, W., Goodson, K. E., Dominant Energy Carrier Transitions and Thermal Anisotropy in Epitaxial Iridium Thin Films. Advanced Functional Materials 2022, 32, 2207781.

Liu, T., Mauter, M. S., 2022 “Heat transfer innovations and their application in thermal desalination processes,” Joule, 6, 6, 1199–1229.

Perez, C., Knepper, R., Marquez, M.P., Forrest, E.C., Tappan, A.S., Asheghi, M., Goodson, K.E., Ziade, E.O., 2021 “Non-Contact Mass Density and Thermal Conductivity Measurements of Organic Thin Films Using Frequency – Domain Thermoreflectance,” Advanced Materials Interfaces, 9, 2, 1–6.

Kwon, H., Perez, C., Park, W., Asheghi, M., and Goodson, K.E., 2021 “Thermal Characterization of Metal–Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers,” ACS Applied Materials Interfaces, 13, 48.

Scott, E. A., Perez, C., Saltonstall, C., Adams, D. P., Hodges, C., Asheghi, M., Goodson, K. E., Hopkins, P., Leonhardt, D., & Ziade, E.O. (2021). Simultaneous thickness and thermal conductivity determination of thinned silicon from 100 nanometers to 40 microns. Applied Physics Letters, 1–7.

Lee, H., Kang, M., Jung, K.W., Kharangate, C.R., Lee, S., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “An Artificial Neural Network Model for Predicting Frictional Pressure Drop in Micro-Pin Fin Heat Sink.” Applied Thermal Engineering, 2021, p. 117012., doi:10.1016/j.applthermaleng.2021.117012

Jung, D., Lee, H., Kong, D., Cho, E., Jung, K.W., Kharangate, C.R., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “Thermal Design and Management of Micro-Pin Fin Heat Sinks for Energy-Efficient Three-Dimensional Stacked Integrated Circuits.” International Journal of Heat and Mass Transfer, vol. 175, 2021, p. 121192., doi:10.1016/j.ijheatmasstransfer.2021.121192

Chen, M. E., Rojo, M. M., Lian, F., Koeln, J., Sood, A., Bohaichuk, S. M., Neumann, C. M., Garrow, S. G., Alleyne, A. G., Goodson, K. E., Pop, E., “Graphene-Based Electromechanical Thermal Switches”, 2D Materials, in press.

Xiong, F., Yalon, E., McClellan, C. M., Zhang, J., Aslan, O. B., Sood, A., Sun, J., Andolina, C., Al-Saidi, W., Goodson, K. E., Heinz, T. F., Cui, Y., Pop, E. 2021 “Tuning Electrical and Interfacial Thermal Properties of Bilayer MoS2 via Electrochemical Intercalation”, Nanotechnology, 32, 26520

Hinckley, A. C., Andrews, S. C., Dunham, M., Sood, A., Barako, M. T., Schneider, S., Toney, M. F., Goodson, K. E., Bao, Z., 2021 “Achieving High Thermoelectric Performance and Metallic Transport in Solvent-Sheared PEDOT:PSS”, Advanced Electronic Materials, 2001190.

Zhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Goodson, K. E. (2021). Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications. International Journal of Heat and Mass Transfer, 173, 121241

Kwon, H., Khan, A.I., Perez, C., Asheghi, M., Pop, E., Goodson, K.E., 2021 “Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films”, ACS Nano Letters, 21 (14), 5984-5990.

Kwon, H., Perez, C., Kim, H. K., Asheghi, M., Park, W., and Goodson, K. E. (2021). Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition. ACS Applied Materials & Interfaces.

Liu, T., Asheghi, M., and Goodson, K. E. (2021). Performance and Manufacturing of Silicon-Based Vapor Chambers. Applied Mechanics Reviews, 73(1), 010802.

Jung, K., Hazra, S., Kwon, H., Piazza, A., Jih, E., Asheghi, M., Gupta, M., Degner, M., Goodson, K.E., Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel 3D-Manifold Coolers (EMMC): Part 2 – Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~ 1 kW/cm2) Power Electronics Cooling, Journal of Electronic Packaging 202

Hazra, S., Jung, K., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel 3D-Manifold Coolers (EMMC): Part 3 – Addressing Challenges in Laser Micro-Machining based Manufacturing of 3D-Manifolded Micro-cooler Devices, Journal of Electronic Packaging, ASME 2020

Park, J., Bae, K., Kim, T. R., Perez, C., Sood, A., Asheghi, M., Goodson, K. E., Park, W (2020). “Direct Quantification of Heat Generation Due to Inelastic Scattering of Electrons Using a Nanocalorimeter”. Advanced Science, 2002876, 8

Liu, T., Palko, J. W., Katz, J. S., Zhou, F., Dede, E. M., Asheghi, M., & Goodson, K. E. (2020). Steady-State Parametric Optimization and Transient Characterization of Heat Flow Regulation With Binary Diffusion. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(12), 1996-2007.

A.I. Khan, H. Kwon, R. Islam, C. Perez, M.E. Chen, M. Asheghi, K.E. Goodson, H.-S.P. Wong, E. Pop, “Two-Fold Reduction of Switching Current Density in Phase Change Memory Using Bi2Te3 Thermoelectric Interfacial Layer,” IEEE Electron Dev. Lett. 41, 1657-1660 (2020).

Terzis, A., Ramachandranm A., Wang, K., Asheghi, M., Goodson, K.E., and Santiago, J.G., “High-Frequency Water Vapor Sorption Cycling Using Fluidization of Metal-Organic Frameworks,” Cell Reports Physical Science, Vol. 1., 100057.

Nguyen, T.K., Phan, H.P., Dowling, K.M., Yalamarthy, A.S., Dinh, T., Balakrishnan, V., Liu, T.Y., Chapin, C.A., Truong, Q.D., Dau, V.T., Goodson, K.E., Senesky, D.G., Dao, D.V., Nguyen, N.T., 2020, “Lithography and Etching-Free Microfabrication of Silicon Carbide on Insulator Using Direct UV Laser Ablation,” Advanced Engineering Materials, Vol. 22, 1901173.

Guo, P.F., Burrow, J.A., Sevison, G.A., Kwon, H., Perez, C., Hendrickson, J.R., Smith, E.M., Asheghi, M., Goodson, K.E., Agha, I., Sarangan, A.M., 2020,  Tungsten-doped Ge2Sb2Te5 phase change material for high-speed optical switching devices,” Applied Physics Letters, Vol. 116, 131901.

Liu, T.Y., Dunham, M.T., Jung, K.W., Chen, B.X., Asheghi, M., and Goodson, K.E., 2020, “Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution,” International Journal of Heat and Mass Transfer, Vol. 152, 119569.

Sevison, G., Farzinazar, S., Burrow, J., Perez, C., Kwon, Heungdong, Lee, J., Asheghi, M., Goodson, K.E., Hendrickson, J., Afha, I., 2020, “Phase Change Dynamics and 2-Dimensional 4Bit Memory in Ge2Sb2Te5 Via Telecom-Band Encoding,” ACS Photonics, Vol. 7, pp. 480-487.

Kharangate, C.R., Libeer, W., Palko, J., Lee, H., Shi, J., Asheghi, M., Goodson, K.E., 2020, “Investigation of 3D Manifold Architecture Heat Sinks in Air-Cooled Condensers,” Applied Thermal Engineering, Vol. 167, 114700.

Liu, T., Palko, J.W., Katz, J.S., Dede, E.M., Zhou, F., Asheghi, M., and Goodson, K.E., 2019, “Tunable, Passive Thermal Regulation through Liquid to Vapor Phase Change,” Applied Physics Letters, Vol. 115, 254102. DOI: 10.1063/1.5133795.

Sood, A., Xiong, F., Chen, S., Wang, H., Selli, D., Zhang, J., McClellan, C.J., Sun, J., Donadio, D., Cui, Y., Pop, E., Goodson, K.E., 2018, “Publisher Correction:  An Electrochemical Thermal Transistor,” Nature Communications, Vol. 10, 4465, DOI: 10.1038/s41467-019-12471-4.

Jung, K.W., Kharangate, C.R., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E.M., Goodson, K.E., 2019, “Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance,” International Journal of Heat and Mass Transfer, Vol. 130, pp. 1108-1119.

Flader, I.B., Chen, Y.H., Yang, Y.S., Ng, E.J., Shin, D.D., Heinz, D.B., Ortiz, L.C., Alter, A.L., Park, W., Goodson, K.E., Kenny, T.W., 2019, “Micro-Tethering for Fabrication of Encapsulated Inertial Sensors With High Sensitivity,” J. MicroElectroMechanical Systems, Vol. 28, pp. 372-381.

Kong, D., Jung, K.W., Jung, S., Jung, D., Schaadt, J., Iyengar, M., Malone, C., Kharangate, C.R., Asheghi, M., Goodson, K.E., and Lee, H., 2019, “Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa,” International Journal of Heat and Mass Transfer, Vol., 141, pp. 145-155.

Xu, R.L., Rojo, M.M., Islam, S.M., Sood, A., Vareskic, B., Katre, A., Mingo, N., Goodson, K.E., Xing, H.G., Jena, D., Pop, E., 2019, “Thermal Conductivity of Crystalline AlN and the Influence of Atomic-Scale Defects,” Journal of Applied Physics, Vol. 126, 185105.

Okabe, K., Sood, A., Yalon, E., Neumann, C.M., Asheghi, M., Pop, E., Goodson, K.E., Wong, H.-S.P., 2019, “Understanding the Switching Mechanism of Interfacial Phase Change Memory,” Journal of Applied Physics, 184501, DOI: 10.1063/1.5093907.

Sood, A., Xiong, F., Chen, S., Cheaito, R., Lian, F., Asheghi, M., Cui, Y., Donadio, D., Goodson, K.E., Pop, E., 2019, “Quasi-Ballistic Thermal Transport Across MoS2 Thin Films,” Nano Letters, DOI: .

Chen, S., Sood, A., Pop, E., Goodson, K.E., Donadio, D., 2019, “Strongly Tunable Anisotropic Thermal Transport in MoS2 by Strain and Lithium Intercalation: First–Principles Calculations,” 2D Materials, Vol 6, 025033.