Kwon, H., Giglio, R., Kong, D., Shattique, M. R., Lee, H., Palko, J. W., Dede, E. M., Asheghi, M., Goodson, K. E. “Capillary-driven two-phase cooler for high-heat-flux electronics using copper wire mesh manifold and enhanced copper inverse opal wick heat sink.” Applied Thermal Engineering 303, Part 1 (2026): 131914. https://doi.org/10.1016/j.applthermaleng.2026.131914

Anderson, J., Hazra, S., Asheghi, M., Goodson, K. E. “Capillary Transport Enhancement in Hybrid Micropillar Wicks Fabricated with UV-Laser Ablation.” ACS Applied Engineering Materials 4(6) (2026): 3168–3175. https://doi.org/10.1021/acsaenm.6c00335

Jiang, K., Kwon, H., Asheghi, M., Goodson, K. E. “Experimental Optimization of Liquid–Vapor Phase Separation in High Heat Flux Capillary-Driven μ-Coolers.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(9) (September 2026): 2046–2053. https://doi.org/10.1109/TCPMT.2026.3697351

Lin, Y., Liu, H., Min, L. G., Turner, W., Wilson, J., Cader, T., Asheghi, M., Gray, C. T., Goodson, K. E. “High-Fidelity Package-Level Conjugate Thermal-Flow Simulation for a Memory-on-Logic 3D System with Embedded Liquid-Cooling.” 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, pp. 1308–1315 (2026). https://doi.org/10.1109/ECTC51846.2026.00216

Lin, Y., Kwon, H., He, Y., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics.” ASME J. Electron. Packag. 148(2) (2026): 021001. https://doi.org/10.1115/1.4071139

Tang, C., Lin, Y., Chen, H., Chen, Y., Gupta, M. P., Degner, M., Asheghi, M., Goodson, K. E., Mantooth, H. A. “High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler.” 2026 IEEE Applied Power Electronics Conference and Exposition (APEC), San Antonio, TX, USA, March 22–26, 2026, pp. 1094–1097. https://doi.org/10.1109/APEC51134.2026.11517173

Min, L. G., Kwon, H., Asheghi, M., Goodson, K. E. “Visualization of Spatial Thermal Conductivity and Boundary Conductance in Diamond Microparticles.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(7) (July 2026): 1513–1525. https://doi.org/10.1109/TCPMT.2025.3646970

Min, L. G., Kwon, H., Vaziri, S., Bao, X., Asheghi, M., Goodson, K. E. “Thermal Management of Three-Dimensional Chips and Monolithic Integrated Circuits Using Phase Change Materials–Si/Cu Composites.” ASME J. Electron. Packag. 148(3) (2026): 031002. https://doi.org/10.1115/1.4070160

Vaziri, S., Huang, X., Hou, S., Datye, I. M., He, C., Ying, J. F., Wu, X., Hsu, C. F., Min, L. G., Kwon, H., Chen, S., Chiang, C., Woon, W. Y., Liao, S. S., Asheghi, M., Goodson, K. E., Pop, E., Wong, H.-S. P., Bao, X. Y. “Sub-micron AlN Films with High Thermal Conductivity and Electrical Resistivity for Efficient Heat Dissipation in 3D ICs.” 2025 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, December 6–10, 2025, pp. 1–4. https://doi.org/10.1109/IEDM50572.2025.11353773

Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Thermofluidic Visualization of the Capillary-Driven Boiling for Design Optimization of Silicon-Embedded Evaporators.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(7) (July 2026): 1499–1512. https://doi.org/10.1109/TCPMT.2025.3636077

Kong, D., Giglio, R., Shattique, M. R., Wu, Q., Kwon, H., Palko, J. W., Lee, H., Dede, E. M., Asheghi, M., Goodson, K. E. “Development of a capillary-driven two-phase microcooler using copper wiremesh 3D manifold and silicon micropin fin wicks.” International Journal of Mechanical Sciences 305 (2025): 110781. https://doi.org/10.1016/j.ijmecsci.2025.110781

Kong, D., Kwon, H., Lee, H., Lee, H., Asheghi, M., Goodson, K. E. “Computational Fluid Dynamics Modeling and Optimization of Large-Scale (3 cm × 3 cm) Silicon-Based Embedded Microchannels With Three-Dimensional Manifold Microcoolers.” ASME J. Electron. Packag. 147(4) (2025): 041105. https://doi.org/10.1115/1.4069319

Song, Y. S., Su, H., Lee, Y.-M., Han, Z., Bennett, R. K. A., Wang, M. A., Min, L. G., Asheghi, M., Goodson, K. E., Wang, S. X., Pop, E. “Investigation and Reduction of Thermal Resistance in Gate-All-Around Indium Tin Oxide Nanosheet Field-Effect Transistors.” 2025 Device Research Conference (DRC), Durham, NC, USA, June 22–25, 2025, pp. 1–2. https://doi.org/10.1109/DRC66027.2025.11105746

Kwon, H., Kong, D., Palko, J., Dede, E. M., Asheghi, M., Goodson, K. E. “Enhanced Capillary-Driven Boiling in Two-Phase Micro-cooler with Engineered Copper Inverse Opals (CIOs) Wick and Silicon 3D Manifold for High Heat Flux Cooling Application.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025.

Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Performance Characterization of Capillary-driven Thin-Film Boiling under Sub-Atmospheric (25-100 kPa) Environment.” 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235588

Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Thermal Imaging and Flow Visualization of Capillary-Driven Two-Phase Boiling in Silicon Microchannels Coated with Porous Copper Wick.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235797 (Avram Bar-Cohen Best Paper Award)

Kong, D., Giglio, R., Zhang, C., Jiang, K., Palko, J. W., Lee, H., Asheghi, M., Goodson, K. E. “Comparison of Pumped vs. Capillary-driven Two-Phase Microcoolers for High Heat Flux Applications.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235580

Min, L. G., Kwon, H., Perez, C., Asheghi, M., Goodson, K. E. “Direct Visualization of Local Thermal Conductivity and Boundary Conductance of Diamond Particles.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235652

Dede, E. M., Zhou, F., Zhou, Y., Lohan, D. J., Asheghi, M., Goodson, K. E., Erickson, K. “Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics.” ASME J. Electron. Packag. 147(2) (2025): 021009. https://doi.org/10.1115/1.4067649

Lin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M., Asheghi , M., Mantooth, H. A., and Goodson, K. E. (September 20, 2023). “Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform.” ASME. J. Electron. Packag. June 2024; 146(2): 021003. https://doi.org/10.1115/1.4062924

Zhang, C., Hazra, S., Wu, Q., Asheghi, M., Goodson, K. E., Dede, E., Palko, J., Narumanchi, S. “Hardmask to substrate pattern transfer method for Microfabrication of micro to mesoscale, high aspect ratio, multi-level, 3D Structures”. US Patent App. 18/084,303, 2023

Chen, R., Fang, Z., Perez, C., Miller, F., Kumari, K., Saxena, A., Zheng, J., Geiger, S. J., Goodson, K. E., Majumdar, A. “Non-volatile electrically programmable integrated photonics with 5-bit operation.” Nature Communications 14.1 (2023): 3465.

Lin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M. Asheghi, M., Mantooth, H. A., and Goodson, K. E., (June 7, 2023). “Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module.” ASME. J. Electron. Packag. March 2024; 146(1): 011006. https://doi.org/10.1115/1.4062384

Chen, R., Fang, Z., Perez, C., Miller, F., Kumari, K., Saxena, A., Zheng, J., Geiger, S. J., Goodson, K. E., Majumdar, A. “Non-volatile electrically programmable integrated photonics with 5-bit operation based on phase-change material Sb2S3.” CLEO: Science and Innovations. Optica Publishing Group, 2023.

Liu, T., Mauter, M. S. “Comparative Infrared Microscopy for Measuring Membrane Thermal Conductivity and Validating Theoretical Heat Transport Models”. ACS ES&T Engineering, 2023

Wang, Y., Collinson, D. W., Kwon, H., Miller, R. D., Lionti, K., Goodson, K. E., Dauskardt, R. H. “Linking Interfacial Bonding and Thermal Conductivity in Molecularly‐Confined Polymer‐Glass Nanocomposites with Ultra‐High Interfacial Density.” Small (2023): 2301383.

Khan, A. I., Wu, X., Won, B., Lindgren, E., Perez, C., Goodson, K., Suzuki, Y., Oh, I-K., Wong, H-S. P., Pop, E. “Unconventional Resistivity Scaling in Polycrystalline NbP Thin Films,” Bulletin of the American Physical Society, 2023

Wahid, S., Islam, M., Perez, C., Brown, T., Chen, M., Marcus, M., Ohldag, H., Kumar, S., Pop, E. “Contact-Induced Oxygen Scavenging in Indium Tin Oxide Transistors”. Bulletin of the American Physical Society, 2023

Islam, M., Bohaichuk, S., Brown, T., Perez, C., Zhang, C., Park, T. J., Talin, A. A., Ramanathan, S., Kumar, S. “Origins of Visible Light Emission upon Resistive Switching in NbO2” Bulletin of the American Physical Society, 2023

Khan, A. I., Yu, H., Zhang, H., Goggin, J. R., Kwon, H., Wu, X., Perez, C., Neilson, K. M., Asheghi, M., Goodson, K. E., Vora, P. M., Davydov, A., Takeuchi, I., Pop, E. “Energy Efficient Neuro‐inspired Phase Change Memory Based on Ge4Sb6Te7 as a Novel Epitaxial Nanocomposite.” Advanced Materials (2023): 2300107.

Dede, E. M., Zhang, C., Wu, Q., Seyedhassantehrani, N., Shattique, M., Roy, S., Palko, J. W., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E., Giglio, R., Asheghi, M. “Techno-economic feasibility analysis of an extreme heat flux micro-cooler”. Iscience 26, no. 1 (2023).

Hazra, S., Zhang, C., Wu, Q., Asheghi, M., Goodson, K., Dede, E. M., Palko, J., Narumanchi, S.. “A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies”. Scientific Reports 12.1 (2022): 12180.