Hazra, S., Singh, Y., Asheghi, M., Goodson, K.E., Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn EutecticChip Bonding for Packaging and Integration of Extreme Heat Flux Micro-coolers, Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2020 October 27-29, 2020.