Featured Publications
Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Thermofluidic Visualization of the Capillary-Driven Boiling for Design Optimization of Silicon-Embedded Evaporators.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(7) (July 2026): 1499–1512. https://doi.org/10.1109/TCPMT.2025.3636077
Liu, T., Mauter, M. S., 2022 “Heat transfer innovations and their application in thermal desalination processes,” Joule, 6, 6, 1199–1229.
Kwon, H., Perez, C., Park, W., Asheghi, M., and Goodson, K.E., 2021 “Thermal Characterization of Metal–Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers,” ACS Applied Materials Interfaces, 13, 48.
Kwon, H., Khan, A.I., Perez, C., Asheghi, M., Pop, E., Goodson, K.E., 2021 “Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films”, ACS Nano Letters, 21 (14), 5984-5990.
Scott, E. A., Perez, C., Saltonstall, C., Adams, D. P., Hodges, C., Asheghi, M., Goodson, K. E., Hopkins, P., Leonhardt, D., & Ziade, E.O. (2021). Simultaneous thickness and thermal conductivity determination of thinned silicon from 100 nanometers to 40 microns. Applied Physics Letters, 1–7.