Welcome!

Welcome!  We study heat transfer in electronic nano-structures, microfluidic heat sinks, and packaging, focussing on basic transport physics.

We work closely with companies on novel cooling strategies for power devices, portables, ASICs, & data centers.

FEATURED PAPERS

Sood, Xiong, Chen, Wang, Selli, Zhang, McClellan, Sun, Donadio, Cui, Pop, Goodson, 2018, 2019, "An Electrochemical Thermal Transistor," Nature Communications, Vol. 9, 4510. See also publisher's correction, Vol. 10, 4465.

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Zhang, Palko, Barako, Asheghi, Santiago, Goodson, 2018, "Enhanced Capillary‐Fed Boiling in Copper Inverse Opals via Template Sintering," Advanced Functional Materials, Vol. 10, 1803689. DOI: 10.1002/afm.201803689

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Kodama, Ohnishi, Park, Shiga, Park, Shimada, Shinohara, Shiomi, Goodson, 2017, “Modulation of Thermal and Thermoelectric Transport in Individual Carbon Nanotubes by Fullerene Encapsulation,” Nature Materials, Vol. 16, pp. 892-897.

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Agonafer, Lee, Vasquez, Won, Jung, Lingamneni, Ma, Shan, Shuai, Du, Maitra, Palko, Goodson, 2018, "Porous Micropillar Structures for Retaining Low Surface Tension Liquids,” J. Colloid and Interface Science, Vol. 514, pp. 316-327.  COVER IMAGE

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Marconnet, A.M., Panzer, M.P., and Goodson, K.E., 2013, "Thermal Conduction Phenomena in Carbon Nanotubes and Related Nanostructured Materials," Reviews of Modern Physics, Vol. 85, pp. 1296-1327.

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Pop, E., Sinha, S., and Goodson, K.E., 2006, "Heat Generation and Transport in Nanometer Scale Transistors," Proceedings of the IEEE, Vol. 94, pp. 1587-1601.

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Jiang, Mikkelsen, Koo, Huber, Yao, Zhang, Zhou, Maveety, Prasher, Santiago, Kenny, Goodson, 2002, "Closed-Loop Electroosmotic Cooling System for VLSI Circuits," IEEE Proc. Components, Packaging, & Manufacturing Technology, Vol. 25, pp. 347-355.  SEMITHERM Best Paper, 2001.  Our US patents based on this paper: 6942018, 6991024, 7131486, 7185697, & 7334630. 

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