Grain boundary heating heat sink surface engineering We study heat transfer in electronic nano-structures, microfluidic heat sinks, and packaging, focusing on basic transport physics. We work closely with companies on novel cooling strategies for power devices, portables, ASICs, & data centers. Stanford NanoHeat

Featured Publications

Liu, T., Mauter, M. S., 2022 “Heat transfer innovations and their application in thermal desalination processes,” Joule, 6, 6, 1199–1229.

Kwon, H., Perez, C., Park, W., Asheghi, M., and Goodson, K.E., 2021 “Thermal Characterization of Metal–Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers,” ACS Applied Materials Interfaces, 13, 48.

Kwon, H., Khan, A.I., Perez, C., Asheghi, M., Pop, E., Goodson, K.E., 2021 “Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films”, ACS Nano Letters, 21 (14), 5984-5990.

Scott, E. A., Perez, C., Saltonstall, C., Adams, D. P., Hodges, C., Asheghi, M., Goodson, K. E., Hopkins, P., Leonhardt, D., & Ziade, E.O. (2021). Simultaneous thickness and thermal conductivity determination of thinned silicon from 100 nanometers to 40 microns. Applied Physics Letters, 1–7.

Kuo CY, Long JD, Campo-Fernandez B, … Hollis RP, Kohn DB. Site-Specific Gene Editing of Human Hematopoietic Stem Cells for X-Linked Hyper-IgM Syndrome. Cell Rep 23:2606-2616, 2018.

Featured News

Qianying and Chris win Techcon Awards!

Qianying and Chris got big recognition at the annual SRC Techcon earlier this month!  Both were honored with Top 10 Presenter Awards.  Qianying was chosen for her work on capillary-fed boiling, and Chris for his progress on interface controlled transport in GST superlattices. There were 150 student talks, top researchers from across the country, so these awards are a big […]

Tiwei Joins Purdue Faculty!

Our NanoHeat postdoc, Tiwei Wei, will be joining the Purdue University faculty in the Department of Mechanical Engineering starting in the Fall of 2022. During his time with our group, he made numerous advancements in the realms of packaging and convection: we are excited to see where his path continues from here! Congratulations Tiwei!