Jung, K., Hazra, S., Kwon, H., Piazza, A., Jih, E., Asheghi, M., Gupta, M., Degner, M., Goodson, K.E., Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel 3D-Manifold Coolers (EMMC): Part 2 – Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~ 1 kW/cm2) Power Electronics Cooling, Journal of Electronic Packaging 202