Publications – Page 2 – Stanford NanoHeat Lab

2020

Kharangate, C.R., Libeer, W., Palko, J., Lee, H., Shi, J., Asheghi, M., Goodson, K.E., 2020, “Investigation of 3D Manifold Architecture Heat Sinks in Air-Cooled Condensers,” Applied Thermal Engineering, Vol. 167, 114700.

2019

Dunham, M.T., Hendricks, T.J., and Goodson, K.E., 2019, “Thermoelectric Generators: A Case Study in Multi-Scale Thermal Engineering Design,” Advances in Heat Transfer, Vol. 51, Ch. 5, pp. 299-350, Elsevier, New York.

Liu, T., Palko, J.W., Katz, J.S., Dede, E.M., Zhou, F., Asheghi, M., and Goodson, K.E., 2019, “Tunable, Passive Thermal Regulation through Liquid to Vapor Phase Change,” Applied Physics Letters, Vol. 115, 254102. DOI: 10.1063/1.5133795.

Sood, A., Xiong, F., Chen, S., Wang, H., Selli, D., Zhang, J., McClellan, C.J., Sun, J., Donadio, D., Cui, Y., Pop, E., Goodson, K.E., 2018, “Publisher Correction: An Electrochemical Thermal Transistor,” Nature Communications, Vol. 10, 4465, DOI: 10.1038/s41467-019-12471-4.

Jung, K.W., Kharangate, C.R., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E.M., Goodson, K.E., 2019, “Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance,” International Journal of Heat and Mass Transfer, Vol. 130, pp. 1108-1119.

Flader, I.B., Chen, Y.H., Yang, Y.S., Ng, E.J., Shin, D.D., Heinz, D.B., Ortiz, L.C., Alter, A.L., Park, W., Goodson, K.E., Kenny, T.W., 2019, “Micro-Tethering for Fabrication of Encapsulated Inertial Sensors With High Sensitivity,” J. MicroElectroMechanical Systems, Vol. 28, pp. 372-381.

Kong, D., Jung, K.W., Jung, S., Jung, D., Schaadt, J., Iyengar, M., Malone, C., Kharangate, C.R., Asheghi, M., Goodson, K.E., and Lee, H., 2019, “Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa,” International Journal of Heat and Mass Transfer, Vol., 141, pp. 145-155.

Xu, R.L., Rojo, M.M., Islam, S.M., Sood, A., Vareskic, B., Katre, A., Mingo, N., Goodson, K.E., Xing, H.G., Jena, D., Pop, E., 2019, “Thermal Conductivity of Crystalline AlN and the Influence of Atomic-Scale Defects,” Journal of Applied Physics, Vol. 126, 185105.

Okabe, K., Sood, A., Yalon, E., Neumann, C.M., Asheghi, M., Pop, E., Goodson, K.E., Wong, H.-S.P., 2019, “Understanding the Switching Mechanism of Interfacial Phase Change Memory,” Journal of Applied Physics, 184501, DOI: 10.1063/1.5093907.

Sood, A., Xiong, F., Chen, S., Cheaito, R., Lian, F., Asheghi, M., Cui, Y., Donadio, D., Goodson, K.E., Pop, E., 2019, “Quasi-Ballistic Thermal Transport Across MoS2 Thin Films,” Nano Letters, DOI: .

Chen, S., Sood, A., Pop, E., Goodson, K.E., Donadio, D., 2019, “Strongly Tunable Anisotropic Thermal Transport in MoS2 by Strain and Lithium Intercalation: First–Principles Calculations,” 2D Materials, Vol 6, 025033.

Kuo CY, Long JD, Campo-Fernandez B, … Hollis RP, Kohn DB. Site-Specific Gene Editing of Human Hematopoietic Stem Cells for X-Linked Hyper-IgM Syndrome. Cell Rep 23:2606-2616, 2018.

Lomova A, Clark DN, Miyahira EY, … and Kohn DB. Improving Gene Editing Outcomes in Human Hematopoietic Stem and Progenitor Cells by Temporal Control of DNA Repair. Stem Cells, In Press. PMID: 30372555

Masiuk KE, Laborada J, Roncarolo MG, Hollis RP and Kohn DB. Lentiviral Gene Therapy in HSCs Restores Lineage-Specific Foxp3 Expression and Suppresses Autoimmunity in a Mouse Model of IPEX Syndrome. Cell Stem Cells, In Press.

2018

Katz, J.S., Park, W., Barako, M.T., Sood, A., Asheghi, M., Goodson, K.E., “Nanostencil Fabrication with Double Exposure Optical Lithography for Scalable Resist-Free Patterning of Metal on Polymers”, Hilton Head Solid-State Sensor, Actuators, and Microsystems Workshop, June 3-7 2018, Hilton Head, SC

Katz, J. S., Barako, M. T., Park, W., Sood, A., Asheghi, M., & Goodson, K. E. (2018, May). Highly Anisotropic Thermal Conductivity in Spin-Cast Polystyrene Nano-Films. In 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 477-481). IEEE.

Barako, M.T., Lingamneni, S., Katz, J.S., Liu, T., Goodson, K.E., and Tice, J., 2018, “Optimizing the Design of Composite Phase Change Materials for High Thermal Power Density,” Journal of Applied Physics, Vol. 124, 145103.

Sood, Xiong, Chen, Wang, Selli, Zhang, McClellan, Sun, Donadio, Cui, Pop, Goodson, 2018, 2019, “An Electrochemical Thermal Transistor,” Nature Communications, Vol. 9, 4510. See also publisher’s correction, Vol. 10, 4465

Guo, P., Burrow, J.A., Sevison, G.A., Sood, A., Asheghi, M., Hendrickson, J.R., Goodson, K.E., Agha, I., Sarangan, A., 2018, “Improving the Performance of Ge2Sb2Te5 Materials via Nickel Doping: Towards RF-Compatible Phase-Change Devices,” Applied Physics Letters.113, 171903.

Zhang, C., Palko, J.W., Rong, G., Pringle, K.S., Barako, M.T., Dusseault, T.J., Asheghi, M., Santiago, J.G. and Goodson, K.E., 2018. “Tailoring permeability of microporous copper structures through template sintering,” ACS Applied Materials and Interfaces, Vol. 10, pp. 30487-30494.

Zhang, Palko, Barako, Asheghi, Santiago, Goodson, 2018, “Enhanced Capillary‐Fed Boiling in Copper Inverse Opals via Template Sintering,” Advanced Functional Materials, Vol. 10, 1803689. DOI: 10.1002/afm.201803689

Sood, A., Pop, E., Asheghi, M., Goodson, K.E., “The Heat Conduction Renaissance”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), May 29-June 1 2018, San Diego, CA

Park, W., Sohn, J., Giuseppe, R., Kodama, T., Sood, A., Katz, J., Kim, B., So, H., Ahn, E., Asheghi, M., Kolpak, A., Goodson, K.E., “Impact of Thermally Dead Volume on Phonon Conduction along Silicon Nanoladders,” Nanoscale, Vol. 10, pp. 11117- 11122.

Lorenzi, B., Dettori, R., Dunham, M.T., Melis, C., Tonini, R., Colombo, L., Sood, A., Goodson, K.E., Narducci, D., 2018, “Phonon Scattering in Silicon by Multiple Morphological Defects: A Multiscale Analysis,” Journal of Electronic Materials, Vol. 47, pp. 5148-5157.

Dunham, M.T., Barako, M.T., Cornett, J.E., Gao, Y., Haidar, S., Sun, N., Asheghi, M., Chen, B., Goodson, K.E., 2018, “Experimental Characterization of Microfabricated Thermoelectric Energy Harvesters for Smart Sensor and Wearable Applications,” Advanced Materials Technologies, Vol. 28, 1803689. DOI: 10.1002/admt.201700383.

Sood, A., Cheaito, R., Bai, T., Kwon, H., Wang, Y., Li, C., Yates, L., Bougher, T., Graham, S., Asheghi, M., Goorsky, M., Goodson, K.E., 2018, “Direct Visualization of Thermal Conductivity Suppression due to Enhanced Phonon Scattering Near Individual Grain Boundaries,” Nano Letters, Vol. 18, pp. 3466-3472.

Pallo, N., Kharangate, C., Modeer, T., Schaadt, J., Asheghi, M., Goodson, K.E., and Pilawa-Podgurski, R., “Modular Heat Sink for Chip Scale GaN Transistors in Multilevel Converters,” Proceedings of the Applied Power Electronics Conference, San Antonio, TX, March 4-8,

Kim, S.J., Kang, J.H., Mutlu, M., Park, J., Park, W., Goodson, K.E., Sinclair, R., Fan, S., Kik, P.G. and Brongersma, M.L., 2018, “Anti-Hermitian photodetector facilitating efficient subwavelength photon sorting,” Nature Communications, Vol. 9, article 316.

Agonafer, Lee, Vasquez, Won, Jung, Lingamneni, Ma, Shan, Shuai, Du, Maitra, Palko, Goodson, 2018, “Porous Micropillar Structures for Retaining Low Surface Tension Liquids,” J. Colloid and Interface Science, Vol. 514, pp. 316-327. COVER IMAGE

Barako, M.T., English, T.S., Roy-Panzer, S., Kenny, T.W., and Goodson, K.E., 2018, “Dielectric Barrier Layers by Low-Temperature Plasma-Enhanced Atomic Layer Deposition of Silicon Dioxide,” Thin Solid Films, Vol. 649, pp. 24-29.

2017

US Patent 9,583,702. Issued 2017. “Graphene-Inserted Phase Change Memory Device and Method of Fabricating the Same,” Y. Kim, C., Ahn, A. Sood, E. Pop, H-S- Wong, K.E. Goodson, S. Fong, S. Lee, C.M. Neumann, and M. Asheghi.

US Patent 9,601,452. Issued 2017. “High-Conductivity Bonding of Metal Nanowire Arrays,” J.A. Starkovich, E.M. Silverman, J.B. Tice, H.-H. Peng, M.T. Barako, and K.E. Goodson.

Katz, J. S., Lai, H., Teo, Y. C., Asheghi, M., Xia, Y., and Goodson, K. E., "Thermal Conduction in Novel Polymers", Semiconductor Research Corporation (SRC) Techcon, September 2017, Austin, TX

Barako, M.T., Isaacson, S.G., Lian, F., Pop, E., Dauskardt, R.H., Goodson, K.E., and Tice, J., 2017, “Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials,” ACS Applied Materials & Interfaces, Vol. 9, article 42067.

Kodama, Ohnishi, Park, Shiga, Park, Shimada, Shinohara, Shiomi, Goodson, 2017, “Modulation of Thermal and Thermoelectric Transport in Individual Carbon Nanotubes by Fullerene Encapsulation,” Nature Materials, Vol. 16, pp. 892-897.

Palko, Lee, Zhang, Dusseault, Maitra, Won, Agonafer, Moss, Houshmand, Rong, Wilbur, Rockosi, Mykyta, Resler, Altman, Asheghi, Santiago, Goodson, 2017, “Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper,” Advanced Functional Materials, Vol. 27, 1703265.

Huang, S., Lingamneni, S., Xiaolin Zheng, et al., 2017, “Facile Thermal and Optical Ignition of Silicon Nanoparticles and Micron Particles,” Nano Letters, Vol. 17, pp. 5925–5930.

Yalon, E., Aslan, O.B., Smithe, K.K.H., McClellan, C.J., Suryavanshi, S.V., Xiong, F., Sood, A., Neumann, C.M., Xu, X., Goodson, K.E., Heinz, T.F., and Pop, E., 2017, “Temperature Dependent Thermal Boundary Conductance of Monolayer MoS2 by Raman Thermometry,” ACS Applied Materials & Interfaces, Vol. 9, pp. 43013-43020.

Park, W., Kodama, T., Park, J., Cho, J., Sood, A., Barako, M.T., Asheghi, M., and Goodson, K.E., 2017, “Thermal Conduction across Metal-Dielectric Sidewall Interfaces,” ACS Applied Materials & Interfaces, Vol. 9, pp. 30100-30106.

Flader, I. B., Chen, Y., Shin, D. D., Heinz, D. B., Oritz, L. C., Alter, A. L., Park, W., Goodson, K.E., and Kenny, T.W., “Micro-ththering for In-process Stiction Mitigation of Highly Compliant Structures”, The 30th IEEE International Conference on Micro Electro Mechanical Systems, Jan. 22-26 2017, Las Vegas, NV

Park, W., Ahn, E., Kodama, T., Park, J., Barako, M. T., Sohn, J., Cho, J., Kim, S., Marconnet, A. M., Asheghi, M., Sinclair, R., and Goodson, K. E., “Phonon Conduction in Silicon Nanobeam Labyrinths,” Scientific Reports, Vol. 7, article 6233.

Cheaito, R., Sood, A., Yates, L., Cheng, Z., Bougher, T.L., Asheghi, M., Graham, S., Goodson, K.E., "Thermal Conductivity Measurements on Suspended Diamond Membranes using Picosecond and Femtosecond Time-Domain Thermoreflectance", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), May 30-June 2 2017, Orlando, FL

Bougher, T.L., Yates, L., Cheng, Z., Cheaito, R., Sood, A., Asheghi, M., Goodson, K.E., Cola, B.A., Graham, S., "Experimental Considerations of CVD Diamond Film Measurements using Time Domain Thermoreflectance", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), May 30-June 2 2017, Orlando, FL

Sood, A., Xiong, F., Wang, H., Cui, Y., Pop, E., Goodson, K.E., “Understanding and Tuning Heat Conduction in MoS2: Cross-Plane Diffusive-Ballistic Transport, and Dynamic Electrochemical Tuning of Thermal Conductivity by Li Intercalation”, Materials Research Society (MRS) Spring Meeting, April 2017, Phoenix, AZ

Xiong, F., Yalon, E., McClellan, C.J., Sood, A., Zhang, J., Sun, J., Goodson, K.E., Cui, Y., Pop, E., “Probing Electrical and Thermal Properties in Electrochemically Li-Intercalated MoS2 Nanosheets with Raman Spectroscopy”, Materials Research Society (MRS) Spring Meeting, April 2017, Phoenix, AZ

Yalon, E., Smithe, K.K.H., Aslan, O.B., McClellan, C.J., Xiong, F., Shin, Y.C., Sood, A., Suryavanshi, S.V., Xu, R., Neumann, C., Goodson, K.E., Heinz, T., Pop, E., “Characterization of the Thermal Boundary Conductance between MoS2 and SiO2 via In-Situ Raman Spectroscopy of FunctioningTransistors”, Materials Research Society (MRS) Spring Meeting, April 2017, Phoenix, AZ

Barako, M.T., Katz, J., Lingamneni, S., Liu, T., Goodson, K.E., and J.B. Tice, "Transient Thermal Conduction in Nanoscale Copper Architectures with Embedded Phase Change Material," Materials Research Society (MRS) Spring Meeting, April 2017, Phoenix, AZ

Park, W., Shin, D. D., Kim, S. J., Katz, J. S., Park, J., Ahn, C. H., Kodama, T., Asheghi, M., Kenny, T. W., and Goodson, K.E., 2017, “Phonon Conduction in Silicon Nanobeams,” Applied Physics Letters, Vol. 110, article 213102.

Park, W., Sood, A., Park, J., Asheghi, M., Sinclair, R., and Goodson, K.E., 2017, “Enhanced Thermal Conduction through Nanostructured Interfaces,” Nanoscale and Microscale Thermophysical Engineering, pp. 134-144.

Cho, J., Francis, D., Altman, D.H., Asheghi, M., and Goodson, K.E., 2017, “Phonon Conduction in GaN-Diamond Composite Substrates,” Journal of Applied Physics, Vol. 121, 055105.

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