Goodson, K.E., "Microscale Thermal Engineering of Integrated Circuits," Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK 99), Maui, Hawaii, June 13-19.
Microscale Thermal Engineering of Integrated Circuits
Goodson, K.E., "Microscale Thermal Engineering of Integrated Circuits," Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK 99), Maui, Hawaii, June 13-19.