Publications

2003

W.P. King and K.E. Goodson, 2003, "Modeling and Simulation of Nanometer-Scale Thermomechanical Nano-Indentation," ASME-JSME Joint Thermal Engineering Conference, March 2003, Hawaii, HI.

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Fletcher, D.A., Kino, D.S., and Goodson, K.E., 2003, “Thermal Microscopy with a Microfabricated Solid Immersion Lens,” Microscale Thermophysical Engineering, Vol. 7, pp. 267-273.

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2002

Chu, D., Bilir, D.T., Pease, R.F.W., and Goodson, K.E., 2002, “Submicron Thermocouple Measurements of Electron-Beam Resist Heating,” Journal of Applied Physics, Vol. 20, pp. 3044-3046.

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King, W.P., Kenny, T.W., Goodson, K.E., Cross, G.L.W., Despont, M., Durig, U.T., Rothuizen, H., Binnig, G.K., and Vettiger, P., 2002, “Design of Atomic Force Microscope Cantilevers for Combined Thermomechanical Writing and Thermal Reading in Array Operation,” IEEE/ASME Journal of MicroElectroMechanical Systems, pp. 765-774.

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Goodson, K.E., Santiago, J.G., Kenny, T., Jiang, L., Zeng, S., Koo, J.M., Zhang, L., Yao, S., and Wang, E., 2002, “Electroosmotic Microchannel Cooling System for Microprocessors,” Electronics Cooling, Vol. 8, pp. 46-47.

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Zhang L., Koo, J.M., Jiang L., Goodson K.E., Santiago J.G., Kenny T.W., 2002, “Measurements and Modeling of Two-Phase Flow in Microchannels with Nearly-Constant Heat Flux Boundary Conditions,” IEEE/ASME Journal of MicroElectroMechanical Engineering, Vol. 11, pp. 12-19.

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Jiang, Mikkelsen, Koo, Huber, Yao, Zhang, Zhou, Maveety, Prasher, Santiago, Kenny, Goodson, 2002, “Closed-Loop Electroosmotic Cooling System for VLSI Circuits,” IEEE Proc. Components, Packaging, & Manufacturing Technology, Vol. 25, pp. 347-355.  SEMITHERM Best Paper, 2001.  Our US patents based on this paper: 6942018, 6991024, 7131486, 7185697, & 7334630.

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Cahill, D., Goodson, K.E., and Majumdar, A., 2002, “Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures,” ASME Journal of Heat Transfer, Vol. 124, pp. 223-240.

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King, W.P., and Goodson, K.E., 2002, “Thermal Writing and Nanoimaging with a Heated Atomic Force Microscope Cantilever,” ASME Journal of Heat Transfer, Vol. 124, p. 597.

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Asheghi, M., Kurabayashi, K., Kasnavi, K., and Goodson, K.E., 2002, “Thermal Conduction in Doped Single-Crystal Silicon Films,” Journal of Applied Physics, Vol. 91, pp. 5079-5088.

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King, W.P., and Goodson, K.E., 2002, “Thermomechanical Formation and Thermal Imaging of Polymer Nanostructures” in Heat Transfer and Fluid Flow in Microscale and Nanoscale Devices, M. Faghri and B. Sunden, Eds., Southampton: WIT Press, pp. 131-171.

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W.P. King and K.E. Goodson, 2002, "Resolution Limits of Nanoscale Thermal Processing with the Atomic Force Microscope," ASME IMECE 2002 Symposium on Thermal Issues in Nanomaterials and Nanofabrication, November 2002, New Orleans, LA.

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Asheghi, M., Behkam, B., Keivan, Y., Joshi, R., and Goodson, K.E., 2002, "Thermal Conductivity Model for Silicon-on-Insulator Layers at High Temperatures," Proc. IEEE International SOI Conference, pp 51-52.

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Koo, J.-M., Jiang, L., Bari, A., Zhang, L., Wang, E., Kenny, W., Goodson, K.E., and Santiago, J.G., 2002, "Convective Boiling in Microchannel Heat Sinks with Spatially-varying Heat Flux," Proceedings of ITHERM 2002, San Diego, CA, USA, May, 2002.

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Jiang, L., Koo, J.-M., Bari, A., Wang, E., Prasher, R.S., Maveety, J., Kenny, T.W., Goodson, K.E., and Santiago J.G., 2002, "Cross-linked Microchannels for VLSI Hotspot Cooling," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22.

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Koo, J.-M., Im, S., Goodson, K.E., Cho, E., Prasher, R.S., Wang, E., Jiang, L., Bari, A., Campion, D., Fogg, D., Kim, M., Kenny, T.W., and Santiago, J.G., 2002, "VLSI Hotspot Cooling Using Two-phase Microchannel Convection," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22, MEMS-1, IMECE2002-39238.

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Pop, E., Sinha, S., and Goodson, K.E., 2002, "Monte Carlo Modeling of Heat Generation in Electronic Nanostructures," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22.

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Im, S., Goodson, K.E., and Banerjee, K., 2002, "Via Design and Scaling Strategy for Nanometer Scale Interconnect Technologies," Proc. IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, Dec. 9-11, pp. 587-590, 2002.

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Jiang, L., Mikkelsen, J., Koo, J-M, Zhang, L., Huber, D., Yao, S., Bari, A., Zhou, P., Santiago, J., and Kenny, T.W. and Goodson, K.E., 2002, "Transient and Sub-atmospheric Performance of A Closed-loop Electroosmotic Microchannel Cooling System", Proceeding of Thermal Challenges in Next Generation Electronic Systems, THERMES 2002, Santa Fe, New Mexico, USA, pp. 133-139, Jan. 13-16, 2002.

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Wang, E.N., Zhang, L., Jiang, L., Koo, J.-M., Maveety, J., Sanchez, E.A., Goodson, K.E., Santiago, J.G., and Kenny, T.W., "Micromachined Jet Arrays for Liquid Impingement Cooling of VLSI Chips", Hilton Head 2002: Solid-State Sensors & Actuator Workshop, Hilton Head, South Carolina, June 2002.

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W.P. King, T.W. Kenny, K.E. Goodson, M. Despont, U. Duerig, M. Lantz, H. Rothuizen, G. Binnig, and P. Vettiger, 2002, "Microcantilevers for Thermal NanoImaging and Thermomechanical Surface Modification," Proceedings 2002 Workshop on Solid State Sensors, Actuators and Microsystems, Hilton Head, p. 210.

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Pop, E., Sinha S., and Dutton, R. and Goodson, K.E., 2002, "Nanoscale Heat Generation in Silicon via the Monte Carlo Method," US-Japan NANOTHERM Workshop, Berkeley, CA, 2002.

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Chu, D. Goodson, K.E., and Pease, F., 2002, "Modeling Resist Heating in Mask Fabrication Using A Green's Function Approach" Proc. SPIE, Vol. 4689, pp. 206.

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Jiang, L., Koo, J. M., Zhang, L., Wang, E., Im, S., Yao, S., Zeng, S., Goodson, K., and Bari, A., "Progress on Two-Phase Convection in Microchannel Heat Sinks," Invited Keynote Lecture, Paper appeared in the Proceedings of Forth Pacific Rim Thermal Science and Energy Engineering Workshop, Kyoto, Japan, May 31-June 2, 2002.

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Im, S., Banerjee, K., and Goodson, K.E., 2002, "Modeling and Analysis of Via Hot Spots and Implications for ULSI Interconnect Reliability," 40th IEEE Annual International Reliability Physics Symposium (IRPS), Dallas, TX, April 8-11, 2002.

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Zhang, L., Wang, E.N., Koo, J.-M., Jiang, L., Goodson, K.E., Santiago, J. G., and Kenny, T. W., 2002, "Enhanced Nucleate Boiling in Microchannels", 2002 IEEE International Conference on MicroElectroMechanical Systems, Las Vegas, NV, P. 89.

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King, W.P., and Goodson, K.E., 2002, "Modeling Sub-Continuum Effects on the Mechanical Properties of Ultrathin Macromolecular Layers," invited paper, Conference on the Modeling and Simulation of Microsystems, San Juan, Puerto Rico, April 20-22.

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2001

Chu, D.C., Touzelbaev, M., Goodson, K.E., Babin, S., and Pease, R.F., 2001, “Thermal Conductivity Measurements of Thin-Film Resist,” Journal of Vacuum Science & Technology B, Vol. 19, pp. 2874-2877.

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McConnell, A.D., Srinivasan, U., Asheghi, M., and Goodson, K.E., 2001, “Thermal Conductivity of Doped Polysilicon,” IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 10, pp. 360-369.

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Zhou, P., and Goodson, K.E., 2001, “Subpixel Displacement and Deformation Gradient Measurement using Digital Image/Speckle Correlation (DISC),” Optical Engineering, Vol. 40, pp. 1613-1620.

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Fletcher, D.A., Crozier, K.B., Quate, C.F., Kino, G.S., Goodson, K.E., Simanovskii, D., Palanker, D.V., 2001, “Refraction Contrast Imaging with a Scanning Microlens,” Applied Physics Letters, Vol. 78, pp. 3589-3591.

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Fletcher, D.A., Crozier, K.B., Guarini, K.W., Minne, S.C., Kino, G.S., Quate, C.F., and Goodson, K.E., 2001, “Microfabricated Silicon Solid Immersion Lens,” IEEE/ASME Journal of MicroElectroMechanical Engineering, Vol. 10, pp. 450-459.

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Fletcher, D.A., Goodson, K.E., and Kino, G.S., 2001, “Focussing in Microlenses Close to a Wavelength in Diameter,” Optics Letters, Vol. 26, pp. 399-401.

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Touzelbaev, M.N., Zhou, P., Venkatasubramanian, R., Goodson, K.E., 2001, “Thermal Characterization of Bi2Te3/Sb2Te3 Superlattices,” Journal of Applied Physics, Vol. 90, pp. 763-767.

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Sverdrup, P.G., Sinha, S., Uma, S., Asheghi, M., and Goodson, K.E., 2001, “Measurement of Ballistic Phonon Conduction Near Hotspots in Silicon,” Applied Physics Letters, Vol. 78, pp. 3331-3333.

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King, W.P., Kenny, T.W., Goodson, K.E., Cross, G., Despont, M., Durig, U., Rothuizen, H., Binnig, G.K., and Vettiger, P., 2001, “Atomic Force Microscope Cantilevers for Combined Thermomechanical Data Writing and Reading,” Applied Physics Letters, Vol. 78, pp. 1300-1302.

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Uma, S., McConnell, A.D., Asheghi, M., Kurabayashi, K., and Goodson, K.E., 2001, “Temperature Dependent Thermal Conductivity of Undoped Polycrystalline Silicon Layers,” International Journal of Thermophysics, Vol. 22, pp. 605-616.

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Laser, D., Goodson, K.E., Santiago, J.G., Kenny, T.W., 2001, "Impact of Pumping Surface Separation Distance on Micromachined Silicon Electrokinetic Pump Performance", 2001 ASME International Mechanical Engineering Congress and Exhibition, New York (2001).

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L. Zhang, E.N. Wang, J. Koch, J.Liu, J-M. Koo, L. Jiang, K.E. Goodson, J.G. Santiago, T.W. Kenny, "Microscale Liquid Impingement Cooling", 2001 ASME International Mechanical Engineering Congress and Exhibition, New York (2001).

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King, W.P., and Goodson, K.E., 2001, "Modeling and Simulation of Nanometer-Scale Thermomechanical Data Bit Formation," Proceedings of the ASME National Heat Transfer Conference, Anaheim, CA, June 10-12.

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Zhang, L., Koo, J.-M., Jiang, L., Goodson, K.E., Santiago, J.G., and Kenny, T.W., 2001, "Study of Boiling Regimes and Transient Signal Measurements in Microchannels," Proc. Solid State Sensors and Actuators Workshop (Transducers), Munich, Germany, June, pp. 1514-1517.

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Jiang, L., Koo, J.M., Zeng, S., Zhang, L., Banerjee S., Zhou P., Santiago J.G., Kenny T.W., Goodson K.E., 2001, "An Electrokinetic Closed-Loop Micro Cooler for High-Power VLSI Chips," presented at SEMI-THERM, San Jose, CA, USA, March.

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King, W.P., and Goodson, K.E., 2001, "Thermal Writing and Nanoimaging with Heated Atomic Force microscope Cantilevers," presented at the Heat Transfer Photogallery at the ASME International Mechanical Engineering Congress and Exposition, November 12-16.

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Cross, G.L.W., Despont, M., Drechsler, U., Durig, U., Vettiger, P., King, W.P., and Goodson, K.E, 2001, "Thermomechanical Formation and Thermal Sensing of Nanometer-Scale Indentations in PMMA Thin Films for Parallel and Dense AFM Data Storage," Fundamentals of Nanoindentation and Nanotribology II, Materials Research Society Symposium Proceedings, 649.

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Chu, D., Touzelbaev, M., Goodson, K.E., Babin, S., Pease, R.F., 2001, "Thermal Conductivity Measurements for Resist Thin Film," presented at the International Symposium on Electron, Ion and Photon Beam Technology and Nanofabrication, Washington DC.

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Laser, D., Yao, S., Chen, C.H., Mikkelsen, J., Goodson, K.E., Santiago, J.G., and Kenny, T.W., 2001, "A Micromachined Silicon Low-Voltage Parallel-Plate Electrokinetic Pump," Proc. Solid State Sensors and Actuators Workshop (Transducers), Munich, Germany, p. 330.

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Koo, J.M., Jiang, L., Zhang, L., Zhou, P., Banerjee, S., Santiago, J.G., Kenny, T.W., and Goodson, K.E., 2001, "Modeling of Two-Phase Microchannel Heat Sinks for VLSI Chips", Proc. 14th IEEE Conference on MEMS 2001, Interlaken, Switzerland, Jan 21-25, pp. 422-426.

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Touzelbaev, M.N., and Goodson, K.E, 2001, “Impact of Experimental Timescale and Geometry on Thin-Film Thermal Property Measurements,” International Journal of Thermophysics, Vol. 22, pp. 243-263.

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Sverdrup, P.G., Ju, Y.S.,and Goodson, K.E., 2001, “Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors,” ASME Journal of Heat Transfer, Vol. 123, pp. 30-37.

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2000

Fletcher, D.A., Crozier, K.B., Quate, C.F., Kino, K.S., Goodson, K.E., Simanovskii, D., and Palanker, D.V., 2000, “Near-Field Infrared Imaging with a Microfabricated Solid Immersion Lens,” Applied Physics Letters, Vol. 77, pp. 2109-2111.

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