2004
Hu, X., Jiang, L., and Goodson, K., "Thermal characterization of eutectic alloy thermal interface materials with void-like inclusions", Proceedings of the IEEE SEMI-THERM Conference, March 9-11, 2004, San Jose, CA.
Read MoreJain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K.E.. "Microfabrication and cell culturing on a large temperature gradient microdevice for studying nerve cell growth." Proceedings of NSF DSM Grantees and Research Conference, Dallas, TX, Jan. 5-8, 2004.
Read MoreSinha, S., Pop E., and Goodson, K.E., 2004, "A Split-Flux Model for Phonon Transport Near Hotspots," Proceedings of the International Mechanical Engineering Congress and Exposition, Anaheim, CA.
Read MoreSinha, S., Schelling, P.K., Phillpot S.R., and Goodson, K.E., "Nanoscale simulation of heat conduction in semiconductor devices," The Ninth Intersociety Conference on Thermal and Thermo-mechanical Phenomena In Electronic Systems, June 1-4 2004, Las Vegas, Nevada, USA.
Read MoreT.A. Kramer, R.D. Flynn, D.W. Fogg, E.N. Wang, C.H. Hidrovo, R.S. Prasher, D.S. Chau, S. Narasimhan, K.E. Goodson, 2004, "Microchannel Experimental Structure for Measuring Temperature Fields During Convective Boiling," ASME International Mechanical Engineering Congress & Exposition, Anaheim, CA, USA, November 13-19, 2004, IMECE2004-61936.
Read MoreWang, E.N., Devasenathipathy, S., Santiago, J.G., Goodson, K.E., and Kenny T.W., 2004, “Nucleation and Growth of Vapor Bubbles in a Heated Silicon Microchannel,” ASME Journal of Heat Transfer, Vol. 128, p. 497.
Read MoreNess, K., Wheeler E., Benett, W., Stratton. P., Christian, A., Chen, A., Weisgrabber, T., Goodson, K.. 2004, "Buoyancy-driven polymerase chain reaction (PCR) devices," Proceedings of ECI: Transport Phenomena in Micro and NanoDevices, Kona, Hawaii, 2004.
Read MoreUS Patent 6,678,168. Issued 2004. "System Including Power Conditioning Module," T.W. Kenny, K.E. Goodson, J.G. Santiago, C. K, Everett, R. Chaplinsky, and J. Kim.
Read More2003
Cahill, D.G., Ford, W.K., Goodson, K.E., Mahan, G.D., Majumdar, A., Maris, H.J., Merlin, R., and Phillpot, S.R., 2003, “Nanoscale Thermal Transport,” Journal of Applied Physics, Vol. 93, 793-818.
Read MoreL. Zhang, Goodson, K.E., and Kenny, T.W., 2003, Book: "Silicon Microchannel Heat Sinks: Theories and Phenomena," Springer-Verlag Microtechnology and MEMS Series, ISBN 3-540-40181-4.
Read MoreE. Pop, K. E. Goodson, R. W. Dutton, 2003, "Thermal Analysis of Ultra-Thin Body Device Scaling," Proceedings of the International Electron Devices Meeting, Dec. 2003, Washington DC.
Read MoreE. Pop, K. E. Goodson, R. W. Dutton, 2003, "Detailed Heat Generation Simulations via the Monte Carlo Method," Proceedings of SISPAD, Sep. 2003, Boston MA.
Read MoreE. Pop, K. E. Goodson, R. W. Dutton, 2003, "Monte Carlo Simulation of Heat Generation in Silicon Nano-Devices," SRC TechCon, Aug. 2003, Dallas TX (Best Paper in Session Award).
Read MoreSinha, S., Schelling, P.K., Phillpot S.R., and Goodson, K.E., "Atomistic simulations of non-equilibrium phonons in nanotransistors," Proceedings of the Semiconductor Research Corporation – TECHCON, August 2003, Dallas, Texas, USA.
Read MoreJain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K.E., "Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth." Proceedings of IMECE-2003, Washington D.C., Nov 16-21, 2003.
Read MoreG. Upadhya, P. Zhou, K. Goodson, M. Munch, and T.W. Kenny, "Closed-Loop Cooling Technologies for Microprocessors," Proceedings of the 2003 International Electron Devices Meeting, Washington, (2003).
Read MoreGoodson K., Jiang L., Sinha S., Pop E., Im S., Fletcher D., King W., Koo, J. and Wang E., "Microscale thermal engineering of electronic systems," Invited Paper for the Proceedings of the Rohsenow Symposium on Future Trends of Heat Transfer, Massachusetts Institute of Technology, Cambridge, Massachusetts, May 16, 2003.
Read MoreChu, D., Bilir, D., Goodson, K.E., and Pease, R.F.W., 2003, "Thin Film Nano Thermocouple Sensors for Applications in Laser and Electron Beam Irradiation" presented at the 12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducersf03), Boston, MA, 2003, the corresponding paper published in the conference Proceeding, Vol. 2, pp. 1112.
Read MoreKoo, J., Im, S., Jiang, L., Goodson, K. E., 2003 "Integrated Microchannel Network for Cooling of 3D Circuit Architectures," Proceedings of ASME International Mechanical Engineering Congress & Exposition, Washington, D.C., Nov. 16-21, IMECE2003-42280.
Read MoreChu, D., Wong, W.K., Goodson, K.E., and Pease, R.F.W., 2003, “Transient Temperature Measurements of Resist Heating using Nano Thermocouples,” Journal of Vacuum Science and Technology B, Vol. 21, pp. 2985-2989.
Read MoreW.P. King and K.E. Goodson, 2003, "Modeling and Simulation of Nanometer-Scale Thermomechanical Nano-Indentation," ASME-JSME Joint Thermal Engineering Conference, March 2003, Hawaii, HI.
Read MoreFletcher, D.A., Kino, D.S., and Goodson, K.E., 2003, “Thermal Microscopy with a Microfabricated Solid Immersion Lens,” Microscale Thermophysical Engineering, Vol. 7, pp. 267-273.
Read More2002
Chu, D., Bilir, D.T., Pease, R.F.W., and Goodson, K.E., 2002, “Submicron Thermocouple Measurements of Electron-Beam Resist Heating,” Journal of Applied Physics, Vol. 20, pp. 3044-3046.
Read MoreKing, W.P., Kenny, T.W., Goodson, K.E., Cross, G.L.W., Despont, M., Durig, U.T., Rothuizen, H., Binnig, G.K., and Vettiger, P., 2002, “Design of Atomic Force Microscope Cantilevers for Combined Thermomechanical Writing and Thermal Reading in Array Operation,” IEEE/ASME Journal of MicroElectroMechanical Systems, pp. 765-774.
Read MoreGoodson, K.E., Santiago, J.G., Kenny, T., Jiang, L., Zeng, S., Koo, J.M., Zhang, L., Yao, S., and Wang, E., 2002, “Electroosmotic Microchannel Cooling System for Microprocessors,” Electronics Cooling, Vol. 8, pp. 46-47.
Read MoreZhang L., Koo, J.M., Jiang L., Goodson K.E., Santiago J.G., Kenny T.W., 2002, “Measurements and Modeling of Two-Phase Flow in Microchannels with Nearly-Constant Heat Flux Boundary Conditions,” IEEE/ASME Journal of MicroElectroMechanical Engineering, Vol. 11, pp. 12-19.
Read MoreJiang, Mikkelsen, Koo, Huber, Yao, Zhang, Zhou, Maveety, Prasher, Santiago, Kenny, Goodson, 2002, “Closed-Loop Electroosmotic Cooling System for VLSI Circuits,” IEEE Proc. Components, Packaging, & Manufacturing Technology, Vol. 25, pp. 347-355. SEMITHERM Best Paper, 2001. Our US patents based on this paper: 6942018, 6991024, 7131486, 7185697, & 7334630.
Read MoreCahill, D., Goodson, K.E., and Majumdar, A., 2002, “Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures,” ASME Journal of Heat Transfer, Vol. 124, pp. 223-240.
Read MoreKing, W.P., and Goodson, K.E., 2002, “Thermal Writing and Nanoimaging with a Heated Atomic Force Microscope Cantilever,” ASME Journal of Heat Transfer, Vol. 124, p. 597.
Read MoreAsheghi, M., Kurabayashi, K., Kasnavi, K., and Goodson, K.E., 2002, “Thermal Conduction in Doped Single-Crystal Silicon Films,” Journal of Applied Physics, Vol. 91, pp. 5079-5088.
Read MoreKing, W.P., and Goodson, K.E., 2002, “Thermomechanical Formation and Thermal Imaging of Polymer Nanostructures” in Heat Transfer and Fluid Flow in Microscale and Nanoscale Devices, M. Faghri and B. Sunden, Eds., Southampton: WIT Press, pp. 131-171.
Read MoreW.P. King and K.E. Goodson, 2002, "Resolution Limits of Nanoscale Thermal Processing with the Atomic Force Microscope," ASME IMECE 2002 Symposium on Thermal Issues in Nanomaterials and Nanofabrication, November 2002, New Orleans, LA.
Read MoreAsheghi, M., Behkam, B., Keivan, Y., Joshi, R., and Goodson, K.E., 2002, "Thermal Conductivity Model for Silicon-on-Insulator Layers at High Temperatures," Proc. IEEE International SOI Conference, pp 51-52.
Read MoreKoo, J.-M., Jiang, L., Bari, A., Zhang, L., Wang, E., Kenny, W., Goodson, K.E., and Santiago, J.G., 2002, "Convective Boiling in Microchannel Heat Sinks with Spatially-varying Heat Flux," Proceedings of ITHERM 2002, San Diego, CA, USA, May, 2002.
Read MoreJiang, L., Koo, J.-M., Bari, A., Wang, E., Prasher, R.S., Maveety, J., Kenny, T.W., Goodson, K.E., and Santiago J.G., 2002, "Cross-linked Microchannels for VLSI Hotspot Cooling," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22.
Read MoreKoo, J.-M., Im, S., Goodson, K.E., Cho, E., Prasher, R.S., Wang, E., Jiang, L., Bari, A., Campion, D., Fogg, D., Kim, M., Kenny, T.W., and Santiago, J.G., 2002, "VLSI Hotspot Cooling Using Two-phase Microchannel Convection," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22, MEMS-1, IMECE2002-39238.
Read MorePop, E., Sinha, S., and Goodson, K.E., 2002, "Monte Carlo Modeling of Heat Generation in Electronic Nanostructures," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22.
Read MoreIm, S., Goodson, K.E., and Banerjee, K., 2002, "Via Design and Scaling Strategy for Nanometer Scale Interconnect Technologies," Proc. IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, Dec. 9-11, pp. 587-590, 2002.
Read MoreJiang, L., Mikkelsen, J., Koo, J-M, Zhang, L., Huber, D., Yao, S., Bari, A., Zhou, P., Santiago, J., and Kenny, T.W. and Goodson, K.E., 2002, "Transient and Sub-atmospheric Performance of A Closed-loop Electroosmotic Microchannel Cooling System", Proceeding of Thermal Challenges in Next Generation Electronic Systems, THERMES 2002, Santa Fe, New Mexico, USA, pp. 133-139, Jan. 13-16, 2002.
Read MoreWang, E.N., Zhang, L., Jiang, L., Koo, J.-M., Maveety, J., Sanchez, E.A., Goodson, K.E., Santiago, J.G., and Kenny, T.W., "Micromachined Jet Arrays for Liquid Impingement Cooling of VLSI Chips", Hilton Head 2002: Solid-State Sensors & Actuator Workshop, Hilton Head, South Carolina, June 2002.
Read MoreW.P. King, T.W. Kenny, K.E. Goodson, M. Despont, U. Duerig, M. Lantz, H. Rothuizen, G. Binnig, and P. Vettiger, 2002, "Microcantilevers for Thermal NanoImaging and Thermomechanical Surface Modification," Proceedings 2002 Workshop on Solid State Sensors, Actuators and Microsystems, Hilton Head, p. 210.
Read MorePop, E., Sinha S., and Dutton, R. and Goodson, K.E., 2002, "Nanoscale Heat Generation in Silicon via the Monte Carlo Method," US-Japan NANOTHERM Workshop, Berkeley, CA, 2002.
Read MoreChu, D. Goodson, K.E., and Pease, F., 2002, "Modeling Resist Heating in Mask Fabrication Using A Green's Function Approach" Proc. SPIE, Vol. 4689, pp. 206.
Read MoreJiang, L., Koo, J. M., Zhang, L., Wang, E., Im, S., Yao, S., Zeng, S., Goodson, K., and Bari, A., "Progress on Two-Phase Convection in Microchannel Heat Sinks," Invited Keynote Lecture, Paper appeared in the Proceedings of Forth Pacific Rim Thermal Science and Energy Engineering Workshop, Kyoto, Japan, May 31-June 2, 2002.
Read MoreIm, S., Banerjee, K., and Goodson, K.E., 2002, "Modeling and Analysis of Via Hot Spots and Implications for ULSI Interconnect Reliability," 40th IEEE Annual International Reliability Physics Symposium (IRPS), Dallas, TX, April 8-11, 2002.
Read MoreZhang, L., Wang, E.N., Koo, J.-M., Jiang, L., Goodson, K.E., Santiago, J. G., and Kenny, T. W., 2002, "Enhanced Nucleate Boiling in Microchannels", 2002 IEEE International Conference on MicroElectroMechanical Systems, Las Vegas, NV, P. 89.
Read MoreKing, W.P., and Goodson, K.E., 2002, "Modeling Sub-Continuum Effects on the Mechanical Properties of Ultrathin Macromolecular Layers," invited paper, Conference on the Modeling and Simulation of Microsystems, San Juan, Puerto Rico, April 20-22.
Read More2001
Chu, D.C., Touzelbaev, M., Goodson, K.E., Babin, S., and Pease, R.F., 2001, “Thermal Conductivity Measurements of Thin-Film Resist,” Journal of Vacuum Science & Technology B, Vol. 19, pp. 2874-2877.
Read MoreMcConnell, A.D., Srinivasan, U., Asheghi, M., and Goodson, K.E., 2001, “Thermal Conductivity of Doped Polysilicon,” IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 10, pp. 360-369.
Read MoreZhou, P., and Goodson, K.E., 2001, “Subpixel Displacement and Deformation Gradient Measurement using Digital Image/Speckle Correlation (DISC),” Optical Engineering, Vol. 40, pp. 1613-1620.
Read More