Goodson, K. E., and Flik, M. I., 1992, "Effect of Microscale Thermal Conduction on the Packing Limit of Silicon-on-Insulator Electronics," Proceedings of the Third Intersociety Conference on Thermal Phenomena in Electronic Systems, Austin, TX, February 5-8, A. Ortega and S. Oktay, eds., IEEE Catalog Number 92CH3096-5, pp. 122-126.

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