Publications – Page 4 – Stanford NanoHeat Lab

2014

Cho, J., Chu, K.K., Chao, P.C., McGray, C., Asheghi, M., and Goodson, K.E., “Thermal Conduction Normal to Thin Silicon Nitride Films on Diamond and GaN”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.

Park, W., Marconnet, A. M., Kodama, T., Park, J., Sinclair, R., Asheghi, M., Goodson, K.E., “Phonon Thermal Conduction in Periodically Porous Silicon Nanobeams”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.

Sood, A., Cho, J., Hobart, K.D., Feygelson, T., Pate, B., Asheghi, M., Goodson, K.E., “Anisotropic and Nonhomogeneous Thermal Conduction in 1 µm Thick CVD Diamond”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.

Sood, A., Eryilmaz, S.B., Jeyasingh, R., Cho, J., Asheghi, M., Wong, -H.S.P, Goodson, K.E., “Thermal Characterization of Nanostructured Superlattices of TiN/TaN: Applications as Electrodes in Phase Change Memory” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.

Lingamneni, S., Asheghi, M., and Goodson, K.E., “A Parametric Study of Microporous Metal Matrix-Phase Change Material Composite Heat Spreaders for Transient Thermal Applications,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.

Guzman, P.A.V., Sood, A., Mleczko, M.J., Wang, B., Wong, -H.S.P., Nishi, Y., Asheghi, M., Goodson, K.E., “Cross Plane Thermal Conductance of Graphene-Metal Interfaces,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.

Barako, M.T., Weisse, J.M., Roy, S., Kodama, T.,Dusseault, T.J., Motoyama, M., Asheghi, M., Prinz, F.B., Zheng, X., and Goodson, K.E., “Thermal Conduction in Nanoporous Copper Inverse Opal Films,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.

T.J. Dusseault, J. Gires, M.T. Barako, Y. Won, D.D. Agonafer, M. Asheghi, J.G. Santiago, K.E. Goodson, “Inverse Opals for Fluid Delivery in Electronics Cooling Systems,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.

Dunham, M. T., Lorenzi, B., Sood, A., Tonini, R., Ottaviani, G., Asheghi, M., Narducci, D., and Goodson, K. E., "Impact of nanovoids on the thermal conductivity of heavily-doped nanosilicon thin films," ASME International Mechanical Engineering Congress and Exposition (IMECE) 2014, November 14-20, Montreal, Canada.

Cahill, D.G., Braun, P.V., Chen, G., Clarke, D.R., Fan, S., Goodson, K.E., Keblinski, P., King, W.P., Mahan, G.D., Majumdar, A., Maris, H.J., Phillpot, S.R., Pop, E., and Shi, L., 2014, “Nanoscale Thermal Transport. II. 2003-2012,” Applied Physics Reviews, Vol., 1, 011305.

2013

S. Roy, T. Kodama, S. Lingamneni, M. A. Panzer, M. Asheghi, and K. E. Goodson, “Toward Thermal Characterization of Pico-Liter Volumes Using the 3omega Method,” ASME International Mechanical Engineering Congress and Exposition (IMECE) 2013, November 15-21, San Diego, CA.

Lingamneni, S., Marconnet, A. M., and Goodson, K. E., “3D Packaging Materials based on Graphite Nanoplatelet and Aluminum Nitride Nanocomposites,” ASME International Mechanical Engineering Congress and Exposition (IMECE) 2013, November 15-21, San Diego, CA.

Cho, J., Chao, P.C., Asheghi, M., and Goodson, K.E., “Phonon Conduction Normal to Polysilicon Films on Diamond,” ASME 4th Micro/Nanoscale Heat & Mass Transfer (MNHMT) International Conference 2013, Dec. 11-14, Hong Kong, China.

Won, Y.*, Cho, J.*, Agonafer, D., Asheghi, M., and Goodson, K.E., “Cooling Limits to GaN HEMT Technology,” IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) 2013, Oct. 13-16, Monterey, CA, USA.

Cho, J., Kodama, T., Ishiwata, H., Dahl, J., Melosh, N., Shen, Z.-X., and Goodson, K.E., “Thermal Conductance in Diamondoid Self-assembled Monolayers”, Materials Research Society (MRS) Spring Meeting, April 1-5, San Francisco, CA

Cho, J., Li, Z., Asheghi, M., and Goodson, K.E., “Phonon-Defect Scattering and the Thermal Resistance of the Transition Layers for GaN Heteroepitaxy”, Materials Research Society (MRS) Spring Meeting, April 1-5, San Francisco, CA

Won, Y., Gao, Y., Panzer, M.A., Xiang, R., Maruyama, S., Kenny, T.W., Cai, W., and Goodson, K.E., 2013, “Zipping Entanglement, and the Elastic Modulus of Aligned Single-Walled Carbon Nanotube Films,” Proceedings of the National Academy of Sciences, Vol. 110, pp 20426-20430.

Sood, A., Rowlette, J., Asheghi, M., Goodson, K.E., “Thermal Conduction in Aperiodic Superlattices for Quantum Cascade Lasers”, Materials Research Society (MRS) Spring Meeting, April 1-5, San Francisco, CA

M.T. Dunham, M.T. Barako, S. LeBlanc, M. Asheghi, B. Chen, K.E. Goodson, “Modeling and optimization of small thermoelectric generators for low-power electronics,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2013, July 16 – July 18, Burlingame, CA

US Patent 8,389,119. Issued 2013, “Composite Thermal Interface Material including Aligned Nanofiber with Low Melting Temperature Binder,” M. Panzer, K.E. Goodson, X. Hu, D. Mann.

Yee, S., Leblanc, S., Goodson, K.E., and Dames, C., 2013, “A $/W Metric for Thermoelectric Power Generation: Beyond ZT,” Energy & Environmental Science, Vol. 6, 2561-2571.

Gao, Y., Marconnet, A.M., Xiang, R., Maruyama, S., and Goodson, K.E., 2013, “Heat Capacity, Thermal Conductivity, and Interface Resistance Extraction for Single Walled Carbon Nanotube Films using Frequency-Domain Thermoreflectance,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 3, pp. 1524-1532.

Bozorg-Grayeli, E., Sood, A., Asheghi, M., Gambin, V., Sandhu, R., Feygelson, T.I., Pate, B.B., Hobart, K., and Goodson, K.E., 2013, “Thermal Conduction Inhomogeneity of Nanocrystalline Diamond Films by Dual-Side Thermoreflectance,” Applied Physics Letters, Vol. 102, 111907.

Marconnet, A.M., Panzer, M.P., and Goodson, K.E., 2013, “Thermal Conduction Phenomena in Carbon Nanotubes and Related Nanostructured Materials,” Reviews of Modern Physics, Vol. 85, pp. 1296-1327.

Touzelbaev, M.N., Miler, J., Yang, Y., Refai-Ahmed, G., and Goodson, K.E., 2013, “High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices,” Journal of Electronic Packaging, Vol. 135, pp. 031001-1 to 031001-8.

Lee, J., Bozorg-Grayeli, E., Kim, S., Asheghi, M., Wong, H.-S., and Goodson, K.E., 2013, “Phonon and Electron Transport through Ge2Sb2Te5 Films and Interfaces Bounded by Metals,” Applied Physics Letters, Vol. 102, 191911.

Leblanc, S., and Goodson, K.E., 2013, “System and Material Parameter Effects on Thermoelectric Power Generation in Three Combustion Systems,” Energy Conversion and Management, submitted and under review.

Marconnet, A.M., Asheghi, M., and Goodson, K.E., 2013, “From the Casimir Limit to Phononic Crystals: Twenty Years of Phonon Transport Studies using Silicon-on-Insulator Technology,” Journal of Heat Transfer, Vol. 135, 061601 (Heat Transfer Divison Anniversary Issue).

Barako, M.T., Park, W., Marconnet, A.M., Asheghi, M., and Goodson, K.E., 2013, “Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module,” Journal of Electronic Materials, Vol. 42, pp. 272-381.

Cho., J., Li, Z., Bozorg-Gayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., and Goodson, K.E., 2013,”Improved Thermal Interfaces of GaN-Diamond Composute Substrates for HEMT Applications,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 3, pp. 79-84.

Miler, J., Etessam-Yazdani, K., Asheghi, M., Touzelbaev, M., and Goodson, K.E., 2012, “Temperature Sensor Distribution, Measurement Uncertainty, and Data Interpretation for Microprocessor Hotspots,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, under review.

Bozorg-Grayeli, E., Reifenberg, J.P., Asheghi, M., Wong, H.-S. P., and Goodson, K.E., 2013, “Thermal Transport in Phase Change Memory Materials,” Annual Review of Heat Transfer, Vol. 16, pp. 397-428.

2012

Lee, J., Kodama, T., Won, Y., Asheghi, M., and Goodson, K.E., 2012, “Phase and Temperature Dependent Thermoelectric Properties of Ge2Sb2Te5 Films down to 25 nm Thickness,” Journal of Applied Physics, Vol. 112, 014902.

Bozorg-Grayeli, E., Li, Z., Asheghi, M., Delgado, G., Pokrovsky, A., Panzer, M., Wack, D., and Goodson, K.E., 2012, “Thermal Conduction Properties of Mo/Si Multilayers for Extreme Ultraviolet Optics,” Journal of Applied Physics, Vol. 112, pp 083504-1 – 083504-7.

Weisse, J.M., Marconnet, A.M., Kim, D.R., Rao, P., Panzer, M.A., Goodson, K.E., Zheng, X., 2012, “Thermal conductivity in porous silicon nanowire arrays,” Nanoscale Research Letters, Vol. 7, Article 554.

Li, Z., Jeyasingh, R.G.D., Lee, J., Asheghi, M., Wong, H.S.P., and Goodson, K.E., 2012, “Electrothermal Modeling and Design Strategies for Multibit Phase Change Memory,” IEEE Transactions on Electron Devices, Vol. 59, pp. 3561-3567.

A.M. Marconnet, M. Motoyama, M.T. Barako, Y. Gao, S. Pozder, B. Fowler, K. Ramakrishna, G. Mortland, M. Asheghi, K.E. Goodson, “Nanoscale Conformable Coatings for Enhanced Thermal Conduction of Carbon Nanotube Films,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Dego, CA

Leblanc, S., Swartzenruber, Marinez, J., Christoforo, G., Kodama, T., and Goodson, K.E., 2012, “Nanoscale Manipulation, Heating, and Welding of Nanowires,” ASME Journal of Heat Transfer, Vol. 134, Article 080910-1.

Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K.E., “Thermal Characterization of GaN-on-Diamond Substrates for HEMT Applications,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Dego, CA

Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Altman, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K.E., “Thermal Characterization of Composite GaN Substrates for HEMT Applications,” Government Microcircuit Applications & Ctritical Technology (GomacTech) Conferfence 2012, March 18-20, Las Vegas, Nevada

Hom, L., Durieux, A., Miler, J., Asheghi, M., Ramani, K., Goodson, K.E. “Calibration Methodology for Interposing Liquid Coolants for Infrared Thermography of Microprocessors”. IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA

T. Kodama, W. Park, A. Marconnet, J. Lee, M. Asheghi, K. E. Goodson, 2012, “In-plane thermal conductivity measurement on nanoscale conductive materials with on-substrate device configurations”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA

Park, W., Barako, M.T., Marconnet, A.M., Asheghi, M., and Goodson, K.E. “Effect of Thermal Cycling on Commercial Thermoelectric Modules”. IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA

Li, Z., Tan, S., Kodama, T., Bozorg-Grayeli, E., Asheghi, M., Goodson, K.E., “Electron-Phonon Coupled Two-Dimensional Heat Transfer in Nanoscale Metal/Dielectric Multilayers,” Proceedings of the ASME Summer Heat Transfer Conference, 2012, July 8-12, Rio Grande, Puerto Rico

Barako, M.T., Gao, Y., Marconnet, A.M., Asheghi, M., Goodson, K.E. “Solder-Bonded Carbon Nanotube Thermal Interface Materials.” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA.

Aminfar, A., Bozorg-Grayeli, E., Asheghi, M., and Goodson, K.E., “Analysis of HEMT Multilayered Structures Using a 2D Finite Volume Model”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA

Bozorg-Grayeli, E., Li, Z., Gambin, V., Asheghi, M., and Goodson, K.E., “Thermal Conductivity, Anisotropy, and Interface Resistances of Diamond on Poly-AlN”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May i30 – June 1, San Dego, CA

Barako, M.T., Park, W., Marconnet, A.M., Asheghi, M., and Goodson, K.E. “A Reliability Study with Infrared Imaging of Thermoelectric Modules under Thermal Cycling”. IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 – June 1, San Diego, CA

Li, Z., Tan, S., Bozorg-Grayeli, E., Kodama, T., Asheghi, M., Delgado, G., Panzer, M., Pokrovsky, A., Wack, D., and Goodson, K.E., 2012, “Phonon Dominated Heat Conduction Normal to Mo/Si Multilayers with Period below 10 nm,” Nano Letters, Vol. 12, pp. 3121-3126.

Won, Y., Lee, J., Asheghi, M., Kenny, T.W., and Goodson, K.E., 2012, “Phase and Thickness Dependent Modulus of Ge2Sb2Te5 Films down to 25 nm Thickness,” Applied Physics Letters, Vol. 100, 161905.

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