Publications – Page 5 – Stanford NanoHeat Lab

2012

Gao, Y., Kodama, T., Won, Y., Dogbe, S., Pan, L., and Goodson, K.E., 2012, “Impact of Nanotube Density and Alignment on the Elastic Modulus near the Top and Base Surfaces of Aligned Multi-Walled Carbon Nanotube Films,” Carbon, Vol. 50, pp. 3789-3798.

LeBlanc, S., Phadke, S., Kodama, T., Salleo, A., and Goodson, K.E., 2012, “Electrothermal Phenomena in Zinc Oxide Nanowires and Contacts,” Applied Physics Letters, Vol. 100, 163105.

Lee, J., Kim, S., Marconnet, A., in t’ Zandt, M.A.A., Asheghi, M., Wong, H.S.P., and Goodson, K.E., 2012, “Thermoelectric Characterization and Power Generation using a Silicon-on-Insulator Substrate,” Journal of MicroElectroMechanical Systems, Vol. 21, pp. 4-6.

Marconnet, A.M., Kodama, T., Asheghi, M., and Goodson, K.E., 2012, “Phonon Conduction in Periodically Porous Silicon Nanobridges,” Nanoscale and Microscale Thermophysical Engineering, Vol. 16, No. 4, pp. 199-219.

Lee, J., Kodama, T., Won, Y., Asheghi, M., and Goodson, K.E., 2012, “Phase and Temperature Dependent Thermoelectric Properties of Ge2Sb2Te5 Films down to 25 nm Thickness,” Journal of Applied Physics, Vol. 112, 014902.

Yoneoka, S., Lee, J., Liger, M., Yama, G., Kodama, T., Gunji, M., Provine, J., Howe, R.T., Goodson, K.E., and Kenny, T.W., 2012, “Electrical and Thermal Conduction in ALD Nanobridges Down to 7-nm Thickness,” Nano Letters, Vol. 12, pp. 683-686.

Marconnet, A., Panzer, M., Yerci, S., Minissale, S., Wang, X., Zhang, X., Negro, L.D., and Goodson, K.E., 2012, “Thermal Conductivity and Photoluminescence of Light-Emitting Silicon Nitride Films,” Applied Physics Letters, Vol. 100, 051908.

Ahn, C., Lee, B., Jeyasingh, R.G.D., Asheghi, M., Hurkx, F., and Goodson, K.E., Wong, H.-S.P., 2012, “Effect of Resistance Drift on the Activation Energy for Crystallization in Phase Change Memory,” Japanese Journal of Applied Physics, Vol. 51, 02BD06.

Cho, J., Bozorg-Grayeli, E., Altman, D.H., Asheghi, M., and Goodson, K.E., 2012, “Low Thermal Resistances at GaN-SiC Interfaces for HEMT Technology,” IEEE Electron Device Letters, Vol. 33, pp. 378-380.

Lee, J., Asheghi, M., Goodson, K.E., 2012, “Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling,” Nanotechnology, Vol. 23, 205201.

Won, Y., Gao, Y., Panzer, M.A., Dogbe, S., Pan, L., Kenny, T.W., and Goodson, K.E., 2012, “Mechanical Characterization of Aligned Multi-Wall Carbon Nanotube Films,” Carbon, Vol. 50, pp 347-355.

2011

Bozorg-Grayeli, E., Li, Z., Asheghi, M., Delgado, G., Pokrovsky, A., Panzer, M., Wack, D., Goodson, K.E., 2011, “High Temperature Thermal Properties of Thin Tantalum Nitride Films,” Applied Physics Letters, Vol. 99, 261906.

Ahn, C., Lee, B., Jeyasingh, R.G.D., Asheghi, M., Goodson, K.E., Wong, H.S.P., and Hurkx, G.A.M., 2011, “Crystallization Properties and their Drift Dependence in Phase-Change Memory Studied with a Micro-Thermal Stage,” Journal of Applied Physics, Vol. 110, 114520.

Jain, A., and Goodson, K.E., 2011, “Thermal microdevices for biological and biomedical applications,” Journal of Thermal Biology, Vol. 36, pp. 209-218.

Marconnet, A.M., Yamamoto, N., Panzer, M.A., Wardle, B.K., and Goodson, K.E., 2011, “Thermal Conduction in Aligned Carbon Nanotube-Polymer Nanocomposites with High Packing Density,” ACS Nano, Vol. 5, pp. 4818-4825.

David, M.P., Miler, J., Steinbrenner, J., Yang, Y., Touzelbaev, M., and Goodson, K.E., 2011, “Hydraulic and Thermal Characteristics of a Vapor Venting Two-phase Microchannel Heat Exchanger,” International Journal of Heat and Mass Transfer, Vol. 54, pp. 5504-5516.

Lee, J., Kim, S., Jeyasingh, R., Asheghi, M., Wong, H.S.P., and Goodson, K.E., 2011, “Micro Thermal Stage for Electrothermal Characterization of Phase Change Memory,” IEEE Electron Device Letters, Vol. 32, pp. 952-954.

David, M.P., Steinbrenner, J.E., Miler, J., and Goodson, K.E., 2011, “Adiabatic and Diabatic Two-Phase Venting Flow in a Microchannel,” International Journal of Multiphase Flow, Vol. 37, pp. 1135-1146.

Li, Z., Lee, J., Reifenberg, J.P., Asheghi, M., Jeyasingh, R.G.D., Wong, H.S.P., and Goodson, K.E., 2011, “Grain Boundaries, Phase Impurities, and Anisotropic Thermal Conduction in Phase Change Memory,” IEEE Electron Device Letters, Vol. 32, pp. 961-963.

Lee, J., Li, Z., Reifenberg, J.P., Lee, S., Sinclair, R., Asheghi, M., and Goodson, K.E., 2011, “Thermal Conductivity Anisotropy and Grain Structure in Ge2Sb2Te5 Films,” Journal of Applied Physics, Vol. 109, 084902.

Steinbrenner, J.B., Lee, E.S., Hidrovo, C.H., Eaton, J.K., and Goodson, K.E., 2011, “Impact of channel geometry on two-phase flow in fuel cell microchannels,” Journal of Power Sources, Vol. 196, 5012-5020.

Gharagozloo, P.E., Goodson, K.E., 2011, “Temperature-dependent aggregation and diffusion in nanofluids,” International Journal of Heat and Mass Transfer, Vol. 54, pp. 797-806.

Won Y., Wang E.N., Goodson K.E., and Kenny, T.W., 2011, “3-D visualization of flow in microscale jet impingement systems,” International Journal of Thermosciences, Vol. 50, pp. 325-331.

Kim, S., Lee, B., Asheghi, M., Hurkx, F., Reifenberg, J.P., Goodson K.E., and Wong H.S.P., 2011, “Resistance and Threshold Switching Voltage Drift Behavior in Phase-Change Memory and Their Temperature Dependence at Microsecond Time Scales Studied Using a Micro-Thermal Stage,” Transactions on Electron Devices, Vol. 58, pp. 584-592.

Bozorg-Grayeli, E., Reifenberg, J.P., Panzer, M.A., Rowlette, J.A., and Goodson, K.E., 2011, “Temperature-Dependent Thermal Properties of Phase-Change Memory Electrode Materials,” IEEE Electron Device Letters, Vol. 32, pp.1281-1283.

2010

Wong, H.S.P., Raoux, S., Kim, S., Liang, J., Reifenberg, J.P., Rajendran, B., Asheghi, M., and Goodson, K.E., 2010, “Phase Change Memory,” Proceedings of the IEEE, Vol. 98, pp. 2201-2227.

Panzer, M.A., Duong H.M., Okawa, J., Shiomi, J., Wardle, B.L., Maruyama, S., Goodson, K.E., 2010, “Temperature-Dependent Phonon Conduction and Nanotube Engagement in Metallized Single-Wall Carbon Nanotube Films, ” Nano letters, Vol. 10, pp 2395-2400.

Lee, J., Gharagozloo, P.E., Kolade, B., Eaton, J.K., and Goodson, K.E., 2010, “Nanofluid Convection in Microtubes,” ASME Journal of Heat Transfer, Vol. 132, pp. 354-360.

Rogacs, A., Steinbrenner, J.E., Rowlette, J.A., Weisse J.M., Zheng, X.L.L., Goodson, K.E., 2010, “Characterization of the Wettability of Thin Nanostructured Films in the Presence of Evaporation,” Journal of Colloid and Interface Science, Vol. 349, pp. 354-360.

Gharagozloo, P.E., Goodson, K.E., 2010 “Aggregate Fractal Dimensions and Thermal Conduction in Nanofluids,” Journal of Applied Physics, Vol. 108, 074309.

Fang, C., David, M., Rogacs, A., and Goodson, K.E., 2010, “Volume of Fluid Simulation of Boiling Flow in a Vapor-Venting Microchannel,” Frontiers of Heat and Mass Transfer, Vol. 1, 013002.

Fang, C., David, M., Wang, F.M., and Goodson, K.E., 2010, “Influence of Film Thickness and Cross-sectional Geometry on Hydrophilic Microchannel Condensation,” International Journal of Multiphase Flow, Vol 36, pp. 608-619.

Reifenberg, J.P., Chang, K.W., Panzer, M.A., Kim, S., Rowlette, J.A., Asheghi, M., Wong, H.S.P., and Goodson, K.E., 2010, “Thermal Boundary Resistance Measurements for Phase-Change Memory Devices,” IEEE Electron Device Letters, Vol. 31, pp. 56-58Phonon & Electron Transport at Interfaces

Fang, C., Steinbrenner, J.E., Wang, F.M., and Goodson, K.E., 2010, “Impact of Wall Hydrophobicity on Condensation Flow and Heat Transfer in Silicon Microchannels,” Journal of Micromechanics and Microengineering, Vol. 20, 045018.

Miler, J., Refai-Ahmed, G., Touzelbaev, M., David, M., Steinbrenner, J., Goodson, K., "Reduced-Order Fluidic Model for Flow Instabilities in Two-Phase Microfluidic Heat Exchangers," Proceedings of the 8th International Conference on Nanochannels, Microchannels, and Minichannels, FEDSM-ICNMM2010-30878, Montreal, Quebec, Canada., 2010.

Parikh, S., Chen, H., Goodson, K., Sheppard, S., 2010, "Engagement in an Undergraduate Heat Transfer Course Outside of the Classroom," In Proceedings, American Society for Engineering Education Annual Conference. June 20-23, Louisville, Kentucky.

SangBum Kim, Byoungil Lee, Mehdi Asheghi, G.A.M. Hurkx, John Reifenberg, Kenneth Goodson, and H.-S. Philip Wong, "Thermal Disturbance and its Impact on Reliability of Phase-Change Memory Studied by Micro-thermal Stage," accepted for presentation to IEEE International Reliability Physics Symposium (IRPS), Anaheim, CA, May 2-6, 2010.

E. Bozorg-Grayeli, J. P. Reifenberg, K. W. Chang, M. Panzer, and K. E. Goodson, “Thermal Conductivity and Boundary Resistance Measurements of GeSbTe and Electrode Materials Using Nanosecond Thermoreflectance”, to be appear in the Proceedings of ITHERM, Las Vegas, Nevada, June, 2010.

J. Lee, J.P. Reifenberg, E. Elah Bozorg-Grayeli, L. Hom, Z. Li, M. Asheghi, H.S.P. Wong, K.E. Goodson, "Decoupled Thermal Resistances of Phase Change Material and Their Impact on PCM Devices," to be appear in the Proceedings of ITHERM, Las Vegas, Nevada, June, 2010.

Gao, Y. , Marconnet, A. , Panzer, M., LeBlanc, S., Dogbe, S., Ezzahri, Y., Shakouri, A. and Goodson, K.E., 2010 “Nanostructured Interfaces for Thermoelectrics,” Journal of Electronic Materials, Vol. 39, pp. 1456-1462.

Bozorg-Grayeli, E.</strong>; Reifenberg, J.P.</strong>; Chang, K.W.; Panzer, M.</strong>; Goodson, K.E</strong>.; , “Thermal conductivity and boundary resistance measurements of GeSbTe and electrode materials using nanosecond thermoreflectance,” Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on , vol., no., pp.1-7, 2-5 June 2010 doi: 10.1109/ITHERM.2010.5501263

US Patent 7,806,168. Issued 2010, "Optimal Spreader System, Device and Method for Fluid Cooled Micro-Scaled Heat Exchange," G. Upadhya, R. Herms, P. Zhou, K. E. Goodson, J. Hom

2009

Rowlette, J.A., Kekatpure, R.D., Panzer, M.A., Brongersma, M.L., and Goodson, K.E., 2009, “Nonradiative Recombination in Strongly Interacting Silicon Nanocrystals Embedded in Amorphous Silicon-Oxide Films,” Physical Review B, Vol. 80, 045314.

Kodama, T., Jain, A., and Goodson K.E., 2009, “Heat Conduction through a DNA-Gold Composite,” Nano Letters, Vol. 9, pp 2005-2009.

Panzer, M.A., Shandalov, M., Rowlette, J.A., Oshima, Y., Chen, Y.W., McIntyre, P.C., and Goodson, K.E., 2009, “Thermal Properties of Ultrathin Hafnium Oxide Gate Dielectric Films,” IEEE Electron Device Letters, Vol. 30, pp. 1269-1271.

Fogg, D., David, M., and Goodson, K.E., 2009, “Non-Invasive Measurement of Void Fraction and Liquid Temperature in Microchannel Flow Boiling,” Experiments in Fluids, Vol. 46, pp. 725-736.

Fogg, D.W., and Goodson, K.E., 2009, “Bubble-Induced Water Hammer in Microchannel Flow Boiling,” ASME Journal of Heat Transfer, Vol. 131, 121006.

Chandorkar, S.A., Candler, R.N., Duwel, A., Melamud, R., Agarwal, M., Goodson, K.E., and Kenny, T. W., 2009, “MultiMode Thermoelastic Dissipation,” Journal of Applied Physics, Vol. 105, 043505.

Kolade, B., Goodson, K.E., and Eaton, J.K., 2009, “Convective Performance of Nanofluids in a Laminar Thermally Developing Tube Flow,” ASME Journal of Heat Transfer, Vol. 131, 052402.

Jain, A., Ness, K., and Goodson, K.E., 2009, “Theoretical and Experimental Investigation of Spatial Temperature Gradient Effects on Cells using a Microfabricated Microheater Platform,” Sensors and Actuators B-Chemical, Vol. 143, pp. 286-294.

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