Publications – Page 6 – Stanford NanoHeat Lab

2010

Fang, C., David, M., Rogacs, A., and Goodson, K.E., 2010, “Volume of Fluid Simulation of Boiling Flow in a Vapor-Venting Microchannel,” Frontiers of Heat and Mass Transfer, Vol. 1, 013002.

Fang, C., David, M., Wang, F.M., and Goodson, K.E., 2010, “Influence of Film Thickness and Cross-sectional Geometry on Hydrophilic Microchannel Condensation,” International Journal of Multiphase Flow, Vol 36, pp. 608-619.

Reifenberg, J.P., Chang, K.W., Panzer, M.A., Kim, S., Rowlette, J.A., Asheghi, M., Wong, H.S.P., and Goodson, K.E., 2010, “Thermal Boundary Resistance Measurements for Phase-Change Memory Devices,” IEEE Electron Device Letters, Vol. 31, pp. 56-58Phonon & Electron Transport at Interfaces

Fang, C., Steinbrenner, J.E., Wang, F.M., and Goodson, K.E., 2010, “Impact of Wall Hydrophobicity on Condensation Flow and Heat Transfer in Silicon Microchannels,” Journal of Micromechanics and Microengineering, Vol. 20, 045018.

Miler, J., Refai-Ahmed, G., Touzelbaev, M., David, M., Steinbrenner, J., Goodson, K., "Reduced-Order Fluidic Model for Flow Instabilities in Two-Phase Microfluidic Heat Exchangers," Proceedings of the 8th International Conference on Nanochannels, Microchannels, and Minichannels, FEDSM-ICNMM2010-30878, Montreal, Quebec, Canada., 2010.

Parikh, S., Chen, H., Goodson, K., Sheppard, S., 2010, "Engagement in an Undergraduate Heat Transfer Course Outside of the Classroom," In Proceedings, American Society for Engineering Education Annual Conference. June 20-23, Louisville, Kentucky.

SangBum Kim, Byoungil Lee, Mehdi Asheghi, G.A.M. Hurkx, John Reifenberg, Kenneth Goodson, and H.-S. Philip Wong, "Thermal Disturbance and its Impact on Reliability of Phase-Change Memory Studied by Micro-thermal Stage," accepted for presentation to IEEE International Reliability Physics Symposium (IRPS), Anaheim, CA, May 2-6, 2010.

E. Bozorg-Grayeli, J. P. Reifenberg, K. W. Chang, M. Panzer, and K. E. Goodson, “Thermal Conductivity and Boundary Resistance Measurements of GeSbTe and Electrode Materials Using Nanosecond Thermoreflectance”, to be appear in the Proceedings of ITHERM, Las Vegas, Nevada, June, 2010.

J. Lee, J.P. Reifenberg, E. Elah Bozorg-Grayeli, L. Hom, Z. Li, M. Asheghi, H.S.P. Wong, K.E. Goodson, "Decoupled Thermal Resistances of Phase Change Material and Their Impact on PCM Devices," to be appear in the Proceedings of ITHERM, Las Vegas, Nevada, June, 2010.

Gao, Y. , Marconnet, A. , Panzer, M., LeBlanc, S., Dogbe, S., Ezzahri, Y., Shakouri, A. and Goodson, K.E., 2010 “Nanostructured Interfaces for Thermoelectrics,” Journal of Electronic Materials, Vol. 39, pp. 1456-1462.

Bozorg-Grayeli, E.</strong>; Reifenberg, J.P.</strong>; Chang, K.W.; Panzer, M.</strong>; Goodson, K.E</strong>.; , “Thermal conductivity and boundary resistance measurements of GeSbTe and electrode materials using nanosecond thermoreflectance,” Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on , vol., no., pp.1-7, 2-5 June 2010 doi: 10.1109/ITHERM.2010.5501263

US Patent 7,806,168. Issued 2010, "Optimal Spreader System, Device and Method for Fluid Cooled Micro-Scaled Heat Exchange," G. Upadhya, R. Herms, P. Zhou, K. E. Goodson, J. Hom

2009

Rowlette, J.A., Kekatpure, R.D., Panzer, M.A., Brongersma, M.L., and Goodson, K.E., 2009, “Nonradiative Recombination in Strongly Interacting Silicon Nanocrystals Embedded in Amorphous Silicon-Oxide Films,” Physical Review B, Vol. 80, 045314.

Kodama, T., Jain, A., and Goodson K.E., 2009, “Heat Conduction through a DNA-Gold Composite,” Nano Letters, Vol. 9, pp 2005-2009.

Panzer, M.A., Shandalov, M., Rowlette, J.A., Oshima, Y., Chen, Y.W., McIntyre, P.C., and Goodson, K.E., 2009, “Thermal Properties of Ultrathin Hafnium Oxide Gate Dielectric Films,” IEEE Electron Device Letters, Vol. 30, pp. 1269-1271.

Fogg, D., David, M., and Goodson, K.E., 2009, “Non-Invasive Measurement of Void Fraction and Liquid Temperature in Microchannel Flow Boiling,” Experiments in Fluids, Vol. 46, pp. 725-736.

Fogg, D.W., and Goodson, K.E., 2009, “Bubble-Induced Water Hammer in Microchannel Flow Boiling,” ASME Journal of Heat Transfer, Vol. 131, 121006.

Chandorkar, S.A., Candler, R.N., Duwel, A., Melamud, R., Agarwal, M., Goodson, K.E., and Kenny, T. W., 2009, “MultiMode Thermoelastic Dissipation,” Journal of Applied Physics, Vol. 105, 043505.

Kolade, B., Goodson, K.E., and Eaton, J.K., 2009, “Convective Performance of Nanofluids in a Laminar Thermally Developing Tube Flow,” ASME Journal of Heat Transfer, Vol. 131, 052402.

Jain, A., Ness, K., and Goodson, K.E., 2009, “Theoretical and Experimental Investigation of Spatial Temperature Gradient Effects on Cells using a Microfabricated Microheater Platform,” Sensors and Actuators B-Chemical, Vol. 143, pp. 286-294.

Buongiorno, J., Gharagozloo, P.E., Goodson, K.E., et al., 2009, “A Benchmark Study on the Thermal Conductivity of Nanofluids,” Journal of Applied Physics, Vol. 106, 094312.

Patricia E. Gharagozloo, Kenneth E. Goodson. "Heat Conduction, Aggregation and Thermal Diffusion in Stationary Nanofluids," International Nanofluid Property Benchmark Exercise: Nanofluids Workshop, January 29-30, 2009, Beverly Hills, CA.

Patricia E. Gharagozloo, Kenneth E. Goodson. "Impact of Aggregation and Diffusion on Nanofluid Thermal Conductivity," ECI, Associations in Solution II: Structure, Function, and Performance, July 26-30, 2009 Tomar, Portugal.

A. Rogacs, J. E. Steinbrenner, X. L. Zheng, K. E. Goodson, "Characterization of the Wettability of Nanostructured Porous Films," Proceedings of the NIST Seventeenth Symposium on Thermophysical Properties, Boulder, CO, USA, June 2009.

Miler, J., Flynn, R.D., Refa-Ahmed, G., Touzelbaev, M., David, M.P., Steinbrenner, J., Goodson, K.E., "Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers," in Proceedings of the ASME 2009 Integration of Electronic and Photonic Systems, MEMS, and NEMS Conference (InterPACK), San Francisco, 2009.

Y. Won, J. Lee, E.N. Wang, K.E. Goodson, T.W. Kenny, "An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device" in ASME InterPACK '09, San Francisco, CA, USA, 2009.

Y. Won, D. Milnes, E.N.Wang, K.E.Goodson, T.W.Kenny , "3-D Visualization of Flow in Microscale Jet Impingement Cooling System" in ASME 7th International Conference on Nanochannels, Microchannels and Minichannels (ICNMM) '09, Pohang, South Korea, 2009.

E. Bozorg-Grayeli, C. Fang, A. Rogacs, and K. E. Goodson, "Computational Modeling of Vapor Chambers with Nanostructured Wicks," in Proceedings of the ASME 2009 Heat Transfer Summer Conference, San Francisco, 2009.

J. Lee, J. Reifenberg, Z. Li, L. Hom, M. Asheghi, S. Kim, H.-S. P. Wong, K.E. Goodson. "Measurement of Anisotropy in the Thermal Conductivity of Ge2Sb2Te5 Films," presented at the 10th Non-Volatile Memory Technology Symposium, October 2009, Portland, Oregon.

Pettes, A.M., Hodes, M.S., and Goodson, K.E., 2009, “Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance,” IEEE Transactions on Advanced Packaging, Vol. 32, pp. 423-430.

US Patent 7,591,302. Issued 2009, "Pump and Fan Control Concepts in a Cooling System," D. Lenehan, K.E. Goodson, T.W. Kenny, M. Munch, S. Sahu.

US Patent 7,504,453. Issued 2009. “Composite Thermal Interface Material Including Particles and Nanofibers,” X. Hu, L. Jiang, K. E. Goodson.

2008

Rowlette, J.A., and Goodson, K.E., 2008, “Fully-Coupled, Nonequilibrium, Electron-Phonon Transport in Nanometer-Scale Silicon FETs,” IEEE Transactions on Electronic Devices, Vol. 55, pp. 220-232.

Fang, C., Hidrovo, C., Wang, F.M., Eaton, J., and Goodson, K.E., 2008, “3-D Numerical Simulation of Contact Angle Hysteresis for Microscale Two-Phase Flow,” International Journal of Multiphase Flow, Vol. 34, pp. 690-705.

Oh, D.W., Jain, A., Eaton J.K., Goodson K.E., and Lee, J.S., 2008, “Thermal Conductivity Measurement and Sedimentation Detection of Aluminum Oxide Nanofluids by using the 3 Omega Method,” International Journal of Heat and Fluid Flow, Vol. 29, pp. 1456-1461.

Gharagozloo, P.E., Eaton, J.K., and Goodson, K.E., 2008, “Diffusion, Aggregation, and the Thermal Conductivity of Nanofluids,” Applied Physics Letters, Vol. 93, 103110.

Reifenberg, J.P., Kencke, D.L., and Goodson, K.E., 2008, “The Impact of Thermal Boundary Resistance in Phase-Change Memory Devices,” IEEE Electron Device Letters, Vol. 29, pp. 1112-1114.

Panzer, M.A., Zhang, G., Mann, D., Hu, X., Pop, E., Dai, H., and Goodson, K.E., 2008, “Thermal Properties of Metal-Coated Vertically-Aligned Single-Wall Nanotube Arrays,” ASME Journal of Heat Transfer, Vol. 130, 052401.

Jain, A., and Goodson, K.E., 2008, “Measurement of the Thermal Conductivity and Heat Capacity of Free-Standing Shape Memory Thin Films using the 3w Method,” ASME Journal of Heat Transfer, Vol. 130, 102402.

Panzer, M.P., and Goodson, K.E., 2008, “Thermal Resistance Between Low-Dimensional Nanostructures and Semi-Infinite Media,” Journal of Applied Physics, Vol. 103, pp. 094301.

Hidrovo, C., Goodson, K.E., 2008, “Active Microfluidic Cooling of Integrated Circuits,” in Electrical, Optical, and Thermal Interconnections for 3D Integrated Systems, J. Meindl and M. Bakir, eds., Artech, Boston, pp. 293-330.

Reifenberg, J.P., Gupta, H., Asheghi, M., and Goodson, K.E., 2008, "Closed Form Thermal Analysis of Phase Change Memory Devices," Proceedings of ECI Heat Transfer in Microscale, September 22-16, Whistler, British Columbia, Canada.

Marconnet, A.M., David, M.P., Rogacs, A., Flynn, R.D., and Goodson, K.E., 2008, “Temperature-Dependent Permeability of Microporous Membranes for Vapor Venting Heat Exchangers,” Proceedings of IMECE2008, October 31-November 6, Boston, Massachusetts, USA.

LeBlanc, S., Marconnet, A., Steinbrenner, J., David, M., Panzer, M., Rogacs, A., Gao, Y., Miler, J., Goodson, K., 2008, "Characterization of Nanostructured Materials," Micro/Nano Poster Forum, IMECE2008, October 31-November 6, Boston, Massachusetts, USA.

LeBlanc, S., Gao, Y., Goodson, K., 2008, "Thermoelectric Heat Recovery from a Tankless Water Heating System," Proceedings of IMECE 2008, October 31-November 6, Boston, Massachusetts, USA.

Steinbrenner, J.E., Lee, E.S., Wang, F.M., Fang, C., Hidrovo, C., Goodson, K.E., 2008, "Flow Regime Evolution in Long Serpentine Microchannels with a Porous Carbon Paper Wall," Proceedings of IMECE2008, October 31-November 6, Boston Massachusetts, USA.

S. A. Chandorkar, M. Agarwal, R. Melamud, R. N. Candler, K. E. Goodson, and T. W. Kenny, "Limits of Quality Factor in Bulk-Mode Micromechanical Resonators," Proceedings of MEMS 2008.

Reifenberg, J.P., and Goodson, K.E., 2008, "Electrothermal Transport Phenomena in Phase Change Memory Devices," Sixth US-Japan Joint Seminar on Nanoscale Transport Phenomena – Science and Engineering, July 13-16, Boston, MA.

Warren, R.H., Reifenberg, J.P., and Goodson, K.E., 2008, "Compact Thermal Model for Phase Change Memory Nanodevices," Proceedings of ITHERM, May 28-31, Orlando, FL.

Hu, X., Jain, A., and Goodson, K.E., 2008, “Investigation of the Natural Convection Boundary Condition in Microfabricated Structures,” International Journal of Thermal Sciences, Vol. 47, pp. 820-824.

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