Publications – Page 6 – Stanford NanoHeat Lab

2009

Buongiorno, J., Gharagozloo, P.E., Goodson, K.E., et al., 2009, “A Benchmark Study on the Thermal Conductivity of Nanofluids,” Journal of Applied Physics, Vol. 106, 094312.

Patricia E. Gharagozloo, Kenneth E. Goodson. "Heat Conduction, Aggregation and Thermal Diffusion in Stationary Nanofluids," International Nanofluid Property Benchmark Exercise: Nanofluids Workshop, January 29-30, 2009, Beverly Hills, CA.

Patricia E. Gharagozloo, Kenneth E. Goodson. "Impact of Aggregation and Diffusion on Nanofluid Thermal Conductivity," ECI, Associations in Solution II: Structure, Function, and Performance, July 26-30, 2009 Tomar, Portugal.

A. Rogacs, J. E. Steinbrenner, X. L. Zheng, K. E. Goodson, "Characterization of the Wettability of Nanostructured Porous Films," Proceedings of the NIST Seventeenth Symposium on Thermophysical Properties, Boulder, CO, USA, June 2009.

Miler, J., Flynn, R.D., Refa-Ahmed, G., Touzelbaev, M., David, M.P., Steinbrenner, J., Goodson, K.E., "Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers," in Proceedings of the ASME 2009 Integration of Electronic and Photonic Systems, MEMS, and NEMS Conference (InterPACK), San Francisco, 2009.

Y. Won, J. Lee, E.N. Wang, K.E. Goodson, T.W. Kenny, "An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device" in ASME InterPACK '09, San Francisco, CA, USA, 2009.

Y. Won, D. Milnes, E.N.Wang, K.E.Goodson, T.W.Kenny , "3-D Visualization of Flow in Microscale Jet Impingement Cooling System" in ASME 7th International Conference on Nanochannels, Microchannels and Minichannels (ICNMM) '09, Pohang, South Korea, 2009.

E. Bozorg-Grayeli, C. Fang, A. Rogacs, and K. E. Goodson, "Computational Modeling of Vapor Chambers with Nanostructured Wicks," in Proceedings of the ASME 2009 Heat Transfer Summer Conference, San Francisco, 2009.

J. Lee, J. Reifenberg, Z. Li, L. Hom, M. Asheghi, S. Kim, H.-S. P. Wong, K.E. Goodson. "Measurement of Anisotropy in the Thermal Conductivity of Ge2Sb2Te5 Films," presented at the 10th Non-Volatile Memory Technology Symposium, October 2009, Portland, Oregon.

Pettes, A.M., Hodes, M.S., and Goodson, K.E., 2009, “Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance,” IEEE Transactions on Advanced Packaging, Vol. 32, pp. 423-430.

US Patent 7,591,302. Issued 2009, "Pump and Fan Control Concepts in a Cooling System," D. Lenehan, K.E. Goodson, T.W. Kenny, M. Munch, S. Sahu.

US Patent 7,504,453. Issued 2009. “Composite Thermal Interface Material Including Particles and Nanofibers,” X. Hu, L. Jiang, K. E. Goodson.

2008

Rowlette, J.A., and Goodson, K.E., 2008, “Fully-Coupled, Nonequilibrium, Electron-Phonon Transport in Nanometer-Scale Silicon FETs,” IEEE Transactions on Electronic Devices, Vol. 55, pp. 220-232.

Fang, C., Hidrovo, C., Wang, F.M., Eaton, J., and Goodson, K.E., 2008, “3-D Numerical Simulation of Contact Angle Hysteresis for Microscale Two-Phase Flow,” International Journal of Multiphase Flow, Vol. 34, pp. 690-705.

Oh, D.W., Jain, A., Eaton J.K., Goodson K.E., and Lee, J.S., 2008, “Thermal Conductivity Measurement and Sedimentation Detection of Aluminum Oxide Nanofluids by using the 3 Omega Method,” International Journal of Heat and Fluid Flow, Vol. 29, pp. 1456-1461.

Gharagozloo, P.E., Eaton, J.K., and Goodson, K.E., 2008, “Diffusion, Aggregation, and the Thermal Conductivity of Nanofluids,” Applied Physics Letters, Vol. 93, 103110.

Reifenberg, J.P., Kencke, D.L., and Goodson, K.E., 2008, “The Impact of Thermal Boundary Resistance in Phase-Change Memory Devices,” IEEE Electron Device Letters, Vol. 29, pp. 1112-1114.

Panzer, M.A., Zhang, G., Mann, D., Hu, X., Pop, E., Dai, H., and Goodson, K.E., 2008, “Thermal Properties of Metal-Coated Vertically-Aligned Single-Wall Nanotube Arrays,” ASME Journal of Heat Transfer, Vol. 130, 052401.

Jain, A., and Goodson, K.E., 2008, “Measurement of the Thermal Conductivity and Heat Capacity of Free-Standing Shape Memory Thin Films using the 3w Method,” ASME Journal of Heat Transfer, Vol. 130, 102402.

Panzer, M.P., and Goodson, K.E., 2008, “Thermal Resistance Between Low-Dimensional Nanostructures and Semi-Infinite Media,” Journal of Applied Physics, Vol. 103, pp. 094301.

Hidrovo, C., Goodson, K.E., 2008, “Active Microfluidic Cooling of Integrated Circuits,” in Electrical, Optical, and Thermal Interconnections for 3D Integrated Systems, J. Meindl and M. Bakir, eds., Artech, Boston, pp. 293-330.

Reifenberg, J.P., Gupta, H., Asheghi, M., and Goodson, K.E., 2008, "Closed Form Thermal Analysis of Phase Change Memory Devices," Proceedings of ECI Heat Transfer in Microscale, September 22-16, Whistler, British Columbia, Canada.

Marconnet, A.M., David, M.P., Rogacs, A., Flynn, R.D., and Goodson, K.E., 2008, “Temperature-Dependent Permeability of Microporous Membranes for Vapor Venting Heat Exchangers,” Proceedings of IMECE2008, October 31-November 6, Boston, Massachusetts, USA.

LeBlanc, S., Marconnet, A., Steinbrenner, J., David, M., Panzer, M., Rogacs, A., Gao, Y., Miler, J., Goodson, K., 2008, "Characterization of Nanostructured Materials," Micro/Nano Poster Forum, IMECE2008, October 31-November 6, Boston, Massachusetts, USA.

LeBlanc, S., Gao, Y., Goodson, K., 2008, "Thermoelectric Heat Recovery from a Tankless Water Heating System," Proceedings of IMECE 2008, October 31-November 6, Boston, Massachusetts, USA.

Steinbrenner, J.E., Lee, E.S., Wang, F.M., Fang, C., Hidrovo, C., Goodson, K.E., 2008, "Flow Regime Evolution in Long Serpentine Microchannels with a Porous Carbon Paper Wall," Proceedings of IMECE2008, October 31-November 6, Boston Massachusetts, USA.

S. A. Chandorkar, M. Agarwal, R. Melamud, R. N. Candler, K. E. Goodson, and T. W. Kenny, "Limits of Quality Factor in Bulk-Mode Micromechanical Resonators," Proceedings of MEMS 2008.

Reifenberg, J.P., and Goodson, K.E., 2008, "Electrothermal Transport Phenomena in Phase Change Memory Devices," Sixth US-Japan Joint Seminar on Nanoscale Transport Phenomena – Science and Engineering, July 13-16, Boston, MA.

Warren, R.H., Reifenberg, J.P., and Goodson, K.E., 2008, "Compact Thermal Model for Phase Change Memory Nanodevices," Proceedings of ITHERM, May 28-31, Orlando, FL.

Hu, X., Jain, A., and Goodson, K.E., 2008, “Investigation of the Natural Convection Boundary Condition in Microfabricated Structures,” International Journal of Thermal Sciences, Vol. 47, pp. 820-824.

US Patent 7,334,630. Issued 2008. “Closed Loop Microchannel Cooling System,” K.E. Goodson, C.H. Chen, D. E. Huber, L. Jiang, T. W. Kenny, J. M. Koo, D. L. Laser, J. C. Mikkelsen, J. G. Santiago, E. N. Wang, S. Zeng, L. Zhang.

US Patent 7,316,543. Issued 2008. "Electroosmotic micropump with planar features," K. E. Goodson, T.W. Kenny, Juan G. Santiago, D.J. Laser, C.-H. Chen.

US Patent 7,402,029. Issued 2008. "Remedies to Prevent Cracking in a Liquid System," M. Munch, K. Goodson, D. Corbin, S. Zheng, T. Kenny, G. Shook.

2007

Goodson, K.E., 2007, “Ordering up the Minimum Thermal Conductivity of Solids,” Science Vol. 315, 342-343.

Pop, E., Mann, D.A., Goodson, K.E., and Dai, H., 2007, “Electrical and Thermal Transport in Metallic Single-Wall Carbon Nanotubes on Insulating Substrates,” Journal of Applied Physics, Vol. 101, 093710-093720.

Reifenberg, J.P., Panzer, M.A., Kim, S., Gibby, A.M., Zhang, Y., Wong, S., Wong, H.S., and Goodson, K.E., 2007, “Thickness and Stoichiometry Dependence of the Thermal Conductivity of GeSbTe Films,” Applied Physics Letters, Vol. 91, pp. 111904-111906.

King, W.P., and Goodson, K.E., 2007, “Thermomechanical Formation of Nanoscale Polymer Indents using a Heated Silicon Tip,” ASME Journal of Heat Transfer, Vol. 129, pp. 1600-1604.

Hu, X., Panzer, M.A., Goodson, K.E., 2007, “Infrared Microscopy Characterization of Opposing Carbon Nanotube Arrays,” ASME Journal of Heat Transfer, Vol. 129, pp. 91-93.

Wang, F.-M., Steinbrenner, J. E., Hidrovo, C. H., Kramer, T. A., Lee, E. S., Vigneron, S., Cheng, C.-H., Eaton, J. K. and Goodson, K. E., 2007, “Investigation of Two-Phase Transport Phenomena in Microchannels Using a Microfabricated Experimental Structure,” Applied Thermal Engineering, Vol. 27, pp. 1728-1733.

Steinbrenner, J.E., Hidrovo, C.H., Wang, F.- M., Lee, E.S., Vigneron, S., Kramer, T.A., Cheng, C.-H., Eaton, J.K. and Goodson, K.E., 2007, “Measurement and Modeling of Liquid Film Thickness Evolution in Stratified Two-Phase Microchannel Flows,” Applied Thermal Engineering, Vol. 27, pp. 1722-1727.

Milnes, D., Khurana, T., Hidrovo, C., Pruitt, B.L., and Goodson, K.E., 2007, "Vapor-Venting, Micromachined Heat Exchanger for Electronics Cooling," Proceedings of the ASME IMECE, Seattle, Washington.

Gharagozloo, P.E., Eaton, J.K , Goodson, K.E., 2007, "Heat Conduction and Thermal Diffusion in Stationary Nanofluids," Proceedings of ECI, Nanofluids: Fundamentals and Applications, September 16-20, Copper Mountain, Colorado, USA.

Pettes, A., R. Melamud, S. Higuchi, and K. Goodson, "Impact of Contact Resistances on Dimensional Scaling of Thermoelectric Energy Conversion Devices," Proceedings of the 26th International Conference on Thermoelectrics, Jeju Island, South Korea, pp. 283-289, 2007.

Kodama, T., Jain, A., Goodson, K.E., 2007, "Nonmetallic conduction property of a DNA templated Gold Nanowire," Proceedings of IPACK2007, July 8-12, Vancouver, British Columbia, Canada.

Gharagozloo, P.E., Eaton, J.K., and Goodson, K.E., 2007, "Impact of Thermodiffusion on Temperature Fields in Stationary Nanofluids," Proceedings of IPACK2007, July 8-12, Vancouver, British Columbia, Canada.

Kim, D.R., Koo, J.R., Fang, C., Steinbrenner, J.E., Lee, E.S., Wang, F.M., Hidrovo, C.H., Eaton, J.K., and Goodson, K.E., 2007, "Compact Model of Slug Flow in Microchannels," Proceedings of the 5th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2007, June 18-20, Puebla, Mexico.

Panzer, M.P., and Goodson, K.E., 2007, "Thermal Inteface Resistances in Nanostructures," Proceedings of the ASME-JSME Thermal Engineering Summer Heat Transfer Conference, July 8-12, Vancouver, British Columbia, Canada.

Lee, J-H., Flynn, R., Goodson, K.E., and Eaton, J.K., 2007, "Convective Heat Transfer of Nanofluids in Microchannels," Proceedings of the ASME-JSME Thermal Engineering Summer Heat Transfer Conference, July 8-12, Vancouver, British Columbia, Canada.

Lee, E.S., Hidrovo, C., Goodson, K.E., and Eaton, J.K., 2007, "Gas-Liquid Flow in Microchannels Bounded by a Porous Wall," 6th International Conference on Multiphase Flow, ICMF 2007, July 9-13, Leipzig, Germany.

US Patent 7,185,697. Issued 2007. "Electroosmotic Microchannel Cooling System," K.E. Goodson, C.H. Chen, D. E. Huber, L. Jiang, T. W. Kenny, J. M. Koo, D. L. Laser, J. C. Mikkelsen, J. G. Santiago, E. N. Wang, S. Zeng, L. Zhang.

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