2008
US Patent 7,334,630. Issued 2008. “Closed Loop Microchannel Cooling System,” K.E. Goodson, C.H. Chen, D. E. Huber, L. Jiang, T. W. Kenny, J. M. Koo, D. L. Laser, J. C. Mikkelsen, J. G. Santiago, E. N. Wang, S. Zeng, L. Zhang.
Read MoreUS Patent 7,316,543. Issued 2008. "Electroosmotic micropump with planar features," K. E. Goodson, T.W. Kenny, Juan G. Santiago, D.J. Laser, C.-H. Chen.
Read MoreUS Patent 7,402,029. Issued 2008. "Remedies to Prevent Cracking in a Liquid System," M. Munch, K. Goodson, D. Corbin, S. Zheng, T. Kenny, G. Shook.
Read More2007
Goodson, K.E., 2007, “Ordering up the Minimum Thermal Conductivity of Solids,” Science Vol. 315, 342-343.
Read MorePop, E., Mann, D.A., Goodson, K.E., and Dai, H., 2007, “Electrical and Thermal Transport in Metallic Single-Wall Carbon Nanotubes on Insulating Substrates,” Journal of Applied Physics, Vol. 101, 093710-093720.
Read MoreReifenberg, J.P., Panzer, M.A., Kim, S., Gibby, A.M., Zhang, Y., Wong, S., Wong, H.S., and Goodson, K.E., 2007, “Thickness and Stoichiometry Dependence of the Thermal Conductivity of GeSbTe Films,” Applied Physics Letters, Vol. 91, pp. 111904-111906.
Read MoreKing, W.P., and Goodson, K.E., 2007, “Thermomechanical Formation of Nanoscale Polymer Indents using a Heated Silicon Tip,” ASME Journal of Heat Transfer, Vol. 129, pp. 1600-1604.
Read MoreHu, X., Panzer, M.A., Goodson, K.E., 2007, “Infrared Microscopy Characterization of Opposing Carbon Nanotube Arrays,” ASME Journal of Heat Transfer, Vol. 129, pp. 91-93.
Read MoreWang, F.-M., Steinbrenner, J. E., Hidrovo, C. H., Kramer, T. A., Lee, E. S., Vigneron, S., Cheng, C.-H., Eaton, J. K. and Goodson, K. E., 2007, “Investigation of Two-Phase Transport Phenomena in Microchannels Using a Microfabricated Experimental Structure,” Applied Thermal Engineering, Vol. 27, pp. 1728-1733.
Read MoreSteinbrenner, J.E., Hidrovo, C.H., Wang, F.- M., Lee, E.S., Vigneron, S., Kramer, T.A., Cheng, C.-H., Eaton, J.K. and Goodson, K.E., 2007, “Measurement and Modeling of Liquid Film Thickness Evolution in Stratified Two-Phase Microchannel Flows,” Applied Thermal Engineering, Vol. 27, pp. 1722-1727.
Read MoreMilnes, D., Khurana, T., Hidrovo, C., Pruitt, B.L., and Goodson, K.E., 2007, "Vapor-Venting, Micromachined Heat Exchanger for Electronics Cooling," Proceedings of the ASME IMECE, Seattle, Washington.
Read MoreGharagozloo, P.E., Eaton, J.K , Goodson, K.E., 2007, "Heat Conduction and Thermal Diffusion in Stationary Nanofluids," Proceedings of ECI, Nanofluids: Fundamentals and Applications, September 16-20, Copper Mountain, Colorado, USA.
Read MorePettes, A., R. Melamud, S. Higuchi, and K. Goodson, "Impact of Contact Resistances on Dimensional Scaling of Thermoelectric Energy Conversion Devices," Proceedings of the 26th International Conference on Thermoelectrics, Jeju Island, South Korea, pp. 283-289, 2007.
Read MoreKodama, T., Jain, A., Goodson, K.E., 2007, "Nonmetallic conduction property of a DNA templated Gold Nanowire," Proceedings of IPACK2007, July 8-12, Vancouver, British Columbia, Canada.
Read MoreGharagozloo, P.E., Eaton, J.K., and Goodson, K.E., 2007, "Impact of Thermodiffusion on Temperature Fields in Stationary Nanofluids," Proceedings of IPACK2007, July 8-12, Vancouver, British Columbia, Canada.
Read MoreKim, D.R., Koo, J.R., Fang, C., Steinbrenner, J.E., Lee, E.S., Wang, F.M., Hidrovo, C.H., Eaton, J.K., and Goodson, K.E., 2007, "Compact Model of Slug Flow in Microchannels," Proceedings of the 5th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2007, June 18-20, Puebla, Mexico.
Read MorePanzer, M.P., and Goodson, K.E., 2007, "Thermal Inteface Resistances in Nanostructures," Proceedings of the ASME-JSME Thermal Engineering Summer Heat Transfer Conference, July 8-12, Vancouver, British Columbia, Canada.
Read MoreLee, J-H., Flynn, R., Goodson, K.E., and Eaton, J.K., 2007, "Convective Heat Transfer of Nanofluids in Microchannels," Proceedings of the ASME-JSME Thermal Engineering Summer Heat Transfer Conference, July 8-12, Vancouver, British Columbia, Canada.
Read MoreLee, E.S., Hidrovo, C., Goodson, K.E., and Eaton, J.K., 2007, "Gas-Liquid Flow in Microchannels Bounded by a Porous Wall," 6th International Conference on Multiphase Flow, ICMF 2007, July 9-13, Leipzig, Germany.
Read MoreUS Patent 7,185,697. Issued 2007. "Electroosmotic Microchannel Cooling System," K.E. Goodson, C.H. Chen, D. E. Huber, L. Jiang, T. W. Kenny, J. M. Koo, D. L. Laser, J. C. Mikkelsen, J. G. Santiago, E. N. Wang, S. Zeng, L. Zhang.
Read More2006
Pop, E., Sinha, S., and Goodson, K.E., 2006, “Heat Generation and Transport in Nanometer Scale Transistors,” Proceedings of the IEEE, Vol. 94, pp. 1587-1601.
Read MoreHu, X., Padilla, A.A., Xu, J., Fisher, T.A., and Goodson, K.E., 2006, “3 omega Measurements of the Thermal Conductivity of Vertically Oriented Carbon Nanotubes on Silicon,” ASME Journal of Heat Transfer, Vol. 128, pp. 1109-1113.
Read MoreSinha, S., Pop, E., Dutton R.W., and Goodson, K.E., 2006, “Non-Equilibrium Phonon Distributions in Sub-100 nm Silicon Transistors,” ASME Journal of Heat Transfer, Vol. 128, pp. 638-647.
Read MoreSinha, S., and Goodson, K.E., 2006, “Thermal Conduction in Sub-100nm Transistors,” Microelectronics Journal, Vol. 37, pp. 1148-1157.
Read MorePop, E., Mann, D., Wang, Q., Goodson, K.E., and Dai, H., 2006, “Thermal Conductance of an Individual Single-Wall Carbon Nanotube above Room Temperature,” Nano Letters, Vol. 6, pp. 96-100.
Read MorePop, E., and Goodson, K.E., 2006, “Thermal Phenomena in Nanoscale Transistors,” Journal of Electronic Packaging, Vol. 128, pp. 102-108.
Read MoreMann, D., Pop, E., Cao, J., Wang, Q., Goodson, K.E., and Dai, H., 2006, “Thermal and Molecular Stimulated Relaxation of Hot Phonons in Suspended Carbon Nanotubes,” Journal of Physical Chemistry B, Vol. 110, pp. 1502-1505.
Read MoreWang, E.N., Devasenathipathy, S., Lin, H., Hidrovo, C., Santiago, J.G., Goodson, K.E., and Kenny, T.W., 2006, “A Hybrid Method for Bubble Reconstruction in Two-Phase Microchannels,” Experiments in Fluids, Vol. 40, pp. 847-858.
Read MoreFogg, D., Cheng, C.H., and Goodson, K.E., 2006, "Design Considerations for the Effects of Liquid Compressibility in Microchannel Flow Boiling," Proc. IMECE 2006, Paper No. IMECE2006-14380, Nov. 5-10, 2006, Chicago, IL, USA.
Read MoreFogg, D., and Goodson, K.E., 2006, "Bubble Growth, Departure, and Convection in Single Microchannels," Proc. IMECE, Paper No. IMECE2006-14382, Nov. 5-10, 2006, Chicago, IL, USA.
Read MoreFlynn, R.D., Fogg, D.W., Koo, J.M., Cheng, C.H., and Goodson, K.E., 2006, "Boiling Flow Interaction Between Two Parallel Microchannels," Proc. IMECE 2006, Paper No. IMECE2006-14696, Nov. 5-10, 2006, Chicago, IL, USA.
Read MoreOh, D., Jain, A., Eaton, J.K., Goodson, K.E., Lee, J.S., 2006, "Thermal Conductivity Measurement of Aluminum Oxide Nanofluids using the 3-Omega Method", Proc. ASME-IMECE-2006, Chicago.
Read MoreSinha, S., and Goodson, K.E., 2006, "Dissipation and Entropy Flow in Logic: Fundamental Limits and Engineering Challenges," International Workshop on Nanoscale Energy Conversion and Information Processing Devices, Nice, France.
Read MoreFogg, D., and Goodson, K.E., 2006, "The Effects of Liquid Compressibility on the Nucleation and Growth of Bubbles in Forced Convective Flow Boiling Within Microchannels," 4th International Conference on Nanochannels, Microchannels, and Minichannels. June 19-21, 2006. Limerick, Ireland. Paper No. ICNMM2006-96208.
Read MoreDavid, M.P., Fogg, D.W., Hidrovo, C., Flynn, R., Goodson, K.E., 2006, "Development and Calibration of a two-dye fluorescence system for use in two-phase micro-flow thermometry," ITherm 2006, San Diego, USA, 29 May-2 June.
Read MoreReifenberg, J., Pop, E., Gibby, A., Wong, S., Goodson, K.E., 2006, "Multiphysics Modeling and Impact of Thermal Boundary Resistance in Phase Change Memory Devices," Proceedings of the ITHERM Conference, p. 106, San Diego, CA.
Read MoreJain, A., Goodson, K.E., 2006, "Thermal Phenomena in Biological Microdevices", Keynote paper at the ASME-ISHMT Heat & Mass Transfer Conference, IIT-Guwahati, India.
Read MorePanzer, M., Zhang, G., Mann, D., Hu, X., Pop, E., Dai H., and Goodson, K.E., 2006, "Thermal Properties of Metal-Coated Vertically-Aligned Single Wall Nanotube Films," Proceedings of the ITHERM Conference, p. 1306, May 2006, San Diego, CA.
Read MoreJain, A., Hu, X., Goodson, K.E., 2006, "A New Formulation for Thermal Transport Property Measurement of a Two-Dimensional Thin Film using the 3-Omega Method," ASME-ISHMT Heat & Mass Transfer Conference, Guwahati, India.
Read MoreHidrovo, C.H., Kramer, T.A., Wang, E.N., Vigneron, S., Steinbrenner, J.E., Koo, J.-M., Wang, F.-M., Fogg, D.W., Flynn, R.D., Lee, E.S., Cheng, C.-H., Kenny, T.W., Eaton, J.K. and Goodson, K.E., 2006, “Two-Phase Microfluidics for Semiconductor Circuits and Fuel Cells,” Heat Transfer Engineering, Vol. 27, pp. 53-63.
Read MoreUS Patent 7,104,312. Issued 2006. "Method and Apparatus for Achieving Temperature Uniformity and Hot Spot Cooling in a Heat Producing Device," K. E. Goodson, T. W. Kenny, P. Zhou, G. Upadhya, M. Munch, M. McMaster, J. Hom.
Read MoreUS Patent 7,090,001. Issued 2006. "Optimized Multiple Heat Pipe block for Electronics Cooling," P. Zhou, D. van der Heide, and K. Goodson.
Read MoreUS Patent 7,000,684. Issued 2006. "Method and Apparatus for Efficient Vertical Fluid Delivery for Cooling a Heat-Producing Device," T. Kenny, M. Munch, P. Zhou, J. Shook, K. Goodson, D. Corbin, M. McMaster, J. Lovette
Read MoreUS Patent 6,994,151. Issued 2006. "Vapor Escape Microchannel Heat Exchanger," P. Zhou, K. E. Goodson, T. Kenny, J. Santiago.
Read MoreUS Patent 6,988,535. Issued 2006. "Channeled flat plate fin heat exchange system, device and method," G. Upadhya, R. Herms, P. Zhou, K. E. Goodson.
Read MoreUS Patent 6,988,534. Issued 2006. "Method and Apparatus for Flexible Fluid Delivery for Cooling Desired Hot Spots in a Heat Producing Device," T. Kenny, J.G. Shook, D. Corbin, M. Munch, K. E. Goodson.
Read MoreUS Patent 6,986,382. Issued 2006. "Interwoven Manifolds for Pressure Drop Reduction in Microchannel Heat Exchangers," G. Upadhya, M. Munch, P. Zhou, G. Shook, T. Kenny, K. Goodson, D. Corbin.
Read MoreUS Patent 7,061,104. Issued 2006. "Apparatus for Conditioning Power and Managing Thermal Energy in an Electronic Device," T. Kenny, K. E. Goodson, J. G. Santiago, G. C. Everett.
Read MoreUS Patent 7,050,306. Issued 2006. "Power Conditioning Module," T. Kenny, K. E. Goodson, J. G. Santiago, G. C. Everett.
Read More2005
Jain, A., Goodson, K.E., 2005, "Measurement of Thermophysical Properties of Thin Film Shape Memory Alloys using the 3-Omega Method," ASME-IMECE-2005, Orlando, FL, Nov. 2005.
Read More