2023
Lin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M., Asheghi , M., Mantooth, H. A., and Goodson, K. E. (September 20, 2023). “Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform.” ASME. J. Electron. Packag. June 2024; 146(2): 021003. https://doi.org/10.1115/1.4062924
Read MoreZhang, C., Wu, Q., Shattique, M., Seyedhassantehrani, N., Roy, S., Palko, J., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E, Giglio, R., Dede, E. M., Asheghi, M. “Heat flux micro coolers having multi-stepped features and fluid wicking”. U.S. Patent No. 11,729,951. 15 Aug. 2023.
Read MoreZhang, C., Hazra, S., Wu, Q., Asheghi, M., Goodson, K. E., Dede, E., Palko, J., Narumanchi, S. “Hardmask to substrate pattern transfer method for Microfabrication of micro to mesoscale, high aspect ratio, multi-level, 3D Structures”. US Patent App. 18/084,303, 2023
Read MoreChen, R., Fang, Z., Perez, C., Miller, F., Kumari, K., Saxena, A., Zheng, J., Geiger, S. J., Goodson, K. E., Majumdar, A. “Non-volatile electrically programmable integrated photonics with 5-bit operation.” Nature Communications 14.1 (2023): 3465.
Read MoreLin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M. Asheghi, M., Mantooth, H. A., and Goodson, K. E., (June 7, 2023). “Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module.” ASME. J. Electron. Packag. March 2024; 146(1): 011006. https://doi.org/10.1115/1.4062384
Read MoreChen, R., Fang, Z., Perez, C., Miller, F., Kumari, K., Saxena, A., Zheng, J., Geiger, S. J., Goodson, K. E., Majumdar, A. “Non-volatile electrically programmable integrated photonics with 5-bit operation based on phase-change material Sb2S3.” CLEO: Science and Innovations. Optica Publishing Group, 2023.
Read MoreLiu, T., Mauter, M. S. “Comparative Infrared Microscopy for Measuring Membrane Thermal Conductivity and Validating Theoretical Heat Transport Models”. ACS ES&T Engineering, 2023
Read MoreWang, Y., Collinson, D. W., Kwon, H., Miller, R. D., Lionti, K., Goodson, K. E., Dauskardt, R. H. “Linking Interfacial Bonding and Thermal Conductivity in Molecularly‐Confined Polymer‐Glass Nanocomposites with Ultra‐High Interfacial Density.” Small (2023): 2301383.
Read MoreKhan, A. I., Wu, X., Won, B., Lindgren, E., Perez, C., Goodson, K., Suzuki, Y., Oh, I-K., Wong, H-S. P., Pop, E. “Unconventional Resistivity Scaling in Polycrystalline NbP Thin Films,” Bulletin of the American Physical Society, 2023
Read MoreWahid, S., Islam, M., Perez, C., Brown, T., Chen, M., Marcus, M., Ohldag, H., Kumar, S., Pop, E. “Contact-Induced Oxygen Scavenging in Indium Tin Oxide Transistors”. Bulletin of the American Physical Society, 2023
Read MoreIslam, M., Bohaichuk, S., Brown, T., Perez, C., Zhang, C., Park, T. J., Talin, A. A., Ramanathan, S., Kumar, S. “Origins of Visible Light Emission upon Resistive Switching in NbO2” Bulletin of the American Physical Society, 2023
Read MoreKhan, A. I., Yu, H., Zhang, H., Goggin, J. R., Kwon, H., Wu, X., Perez, C., Neilson, K. M., Asheghi, M., Goodson, K. E., Vora, P. M., Davydov, A., Takeuchi, I., Pop, E. “Energy Efficient Neuro‐inspired Phase Change Memory Based on Ge4Sb6Te7 as a Novel Epitaxial Nanocomposite.” Advanced Materials (2023): 2300107.
Read MoreDede, E. M., Zhang, C., Wu, Q., Seyedhassantehrani, N., Shattique, M., Roy, S., Palko, J. W., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E., Giglio, R., Asheghi, M. “Techno-economic feasibility analysis of an extreme heat flux micro-cooler”. Iscience 26, no. 1 (2023).
Read More2022
Wu, X., Khan, A. I., Ramesh, P., Perez, C., Kim, K., Lee, Z., Saraswat, K., Goodson, K. E., Philip Wong, H. S., Pop, E. “Understanding Interface-Controlled Resistance Drift in Superlattice Phase Change Memory”. IEEE Electron Device Lett. 2022, 2–5.
Read MoreKhan, A. I., Wu, X., Perez, C., Won, B., Kim, K., Ramesh, P., Kwon, H., Tung, M. C., Lee, Z., Oh, I. K., Saraswat, K., Asheghi, M., Goodson, K. E., Wong, H. S. P., Pop, E. “Unveiling the Effect of Superlattice Interfaces and Intermixing on Phase Change Memory Performance”. Nano Letters, 2022, 22 (15), 6285–6291.
Read MoreHazra, S., Zhang, C., Wu, Q., Asheghi, M., Goodson, K., Dede, E. M., Palko, J., Narumanchi, S.. “A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies”. Scientific Reports 12.1 (2022): 12180.
Read MoreDominant Energy Carrier Transitions and Thermal Anisotropy in Epitaxial Iridium Thin Films. Advanced Functional Materials 2022, 32, 2207781.
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Read More2021
Perez, C., Knepper, R., Marquez, M.P., Forrest, E.C., Tappan, A.S., Asheghi, M., Goodson, K.E., Ziade, E.O., 2021 “Non-Contact Mass Density and Thermal Conductivity Measurements of Organic Thin Films Using Frequency – Domain Thermoreflectance,” Advanced Materials Interfaces, 9, 2, 1–6.
Read MoreKwon, H., Perez, C., Park, W., Asheghi, M., and Goodson, K.E., 2021 “Thermal Characterization of Metal–Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers,” ACS Applied Materials Interfaces, 13, 48.
Read MoreScott, E. A., Perez, C., Saltonstall, C., Adams, D. P., Hodges, C., Asheghi, M., Goodson, K. E., Hopkins, P., Leonhardt, D., & Ziade, E.O. (2021). Simultaneous thickness and thermal conductivity determination of thinned silicon from 100 nanometers to 40 microns. Applied Physics Letters, 1–7.
Read MoreLee, H., Kang, M., Jung, K.W., Kharangate, C.R., Lee, S., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “An Artificial Neural Network Model for Predicting Frictional Pressure Drop in Micro-Pin Fin Heat Sink.” Applied Thermal Engineering, 2021, p. 117012., doi:10.1016/j.applthermaleng.2021.117012
Read MoreJung, D., Lee, H., Kong, D., Cho, E., Jung, K.W., Kharangate, C.R., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “Thermal Design and Management of Micro-Pin Fin Heat Sinks for Energy-Efficient Three-Dimensional Stacked Integrated Circuits.” International Journal of Heat and Mass Transfer, vol. 175, 2021, p. 121192., doi:10.1016/j.ijheatmasstransfer.2021.121192
Read MoreChen, M. E., Rojo, M. M., Lian, F., Koeln, J., Sood, A., Bohaichuk, S. M., Neumann, C. M., Garrow, S. G., Alleyne, A. G., Goodson, K. E., Pop, E., “Graphene-Based Electromechanical Thermal Switches”, 2D Materials, in press.
Read MoreXiong, F., Yalon, E., McClellan, C. M., Zhang, J., Aslan, O. B., Sood, A., Sun, J., Andolina, C., Al-Saidi, W., Goodson, K. E., Heinz, T. F., Cui, Y., Pop, E. 2021 “Tuning Electrical and Interfacial Thermal Properties of Bilayer MoS2 via Electrochemical Intercalation”, Nanotechnology, 32, 26520
Read MoreHinckley, A. C., Andrews, S. C., Dunham, M., Sood, A., Barako, M. T., Schneider, S., Toney, M. F., Goodson, K. E., Bao, Z., 2021 “Achieving High Thermoelectric Performance and Metallic Transport in Solvent-Sheared PEDOT:PSS”, Advanced Electronic Materials, 2001190.
Read MoreZhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Goodson, K. E. (2021). Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications. International Journal of Heat and Mass Transfer, 173, 121241
Read MoreKwon, H., Khan, A.I., Perez, C., Asheghi, M., Pop, E., Goodson, K.E., 2021 “Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films”, ACS Nano Letters, 21 (14), 5984-5990.
Read MoreKwon, H., Perez, C., Kim, H. K., Asheghi, M., Park, W., and Goodson, K. E. (2021). Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition. ACS Applied Materials & Interfaces.
Read MoreLiu, T., Asheghi, M., and Goodson, K. E. (2021). Performance and Manufacturing of Silicon-Based Vapor Chambers. Applied Mechanics Reviews, 73(1), 010802.
Read MoreSoroush, F., Liu, T., Wu, Q., Asheghi, M., Goodson, K. E., Marco, L., … & Martin, R. (2021, October). Contact Angle Tuning of Copper Microporous Structures. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T07A010). American Society of Mechanical Engineers.
Read MoreSoroush, F., Liu, T., Wu, Q., Zhang, C., Asheghi, M., Goodson, K. E., … & Martin, R. (2021, October). A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T05A001). American Society of Mechanical Engineers.
Read MoreA. Sood, C. Sievers, Y. C. Shin, V. Chen, S. Chen, K. K. H. Smithe, S. Chatterjee, D. Donadio, K. E. Goodson, E. Pop, “Engineering thermal transport across layered graphene-MoS2 superlattices”, ACS Nano, 15, 19503 (2021)
Read More2020
Hazra, S., Singh, Y., Asheghi, M., Goodson, K.E., Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn EutecticChip Bonding for Packaging and Integration of Extreme Heat Flux Micro-coolers, Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2020 October 27-29, 2020.
Read MoreHazra, S., Liu, T., Asheghi, M., Goodson, K.E., Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure, Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2020, October 27-29, 2020.
Read MorePiazza, A.,Hazra, S., Jung, K., Gupta, M., Jih, E., Asheghi, M., Goodson, K.E., Considerations and Challenges for Large Area Embedded Micro-channels with 3D Manifold in High Heat Flux Power Electronics Applications, ITHERM 2020, Florida, USA.
Read MoreJung, K., Hazra, S., Kwon, H., Piazza, A., Jih, E., Asheghi, M., Gupta, M., Degner, M., Goodson, K.E., Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel 3D-Manifold Coolers (EMMC): Part 2 – Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~ 1 kW/cm2) Power Electronics Cooling, Journal of Electronic Packaging 202
Read MoreHazra, S., Jung, K., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel 3D-Manifold Coolers (EMMC): Part 3 – Addressing Challenges in Laser Micro-Machining based Manufacturing of 3D-Manifolded Micro-cooler Devices, Journal of Electronic Packaging, ASME 2020
Read MoreHazra, S., Piazza, A., Jung, K., Asheghi, M., Gupta M, Jih E, Degner M, Goodson K, Microfabrication Challenges for Silicon-based large area (>500 mm2) 3D-manifolded embedded micro-cooler devices for high heat flux removal, ITHERM 2020, Florida, USA.
Read MorePark, J., Bae, K., Kim, T. R., Perez, C., Sood, A., Asheghi, M., Goodson, K. E., Park, W (2020). “Direct Quantification of Heat Generation Due to Inelastic Scattering of Electrons Using a Nanocalorimeter”. Advanced Science, 2002876, 8
Read MoreWu, Q, Zhang, C, Asheghi, M, & Goodson, K. “Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications.” Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK). .https://doi.org/10.1115/IPACK2020-2603.
Read MoreLiu, T., Palko, J. W., Katz, J. S., Zhou, F., Dede, E. M., Asheghi, M., & Goodson, K. E. (2020). Steady-State Parametric Optimization and Transient Characterization of Heat Flow Regulation With Binary Diffusion. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(12), 1996-2007.
Read MoreA.I. Khan, H. Kwon, R. Islam, C. Perez, M.E. Chen, M. Asheghi, K.E. Goodson, H.-S.P. Wong, E. Pop, “Two-Fold Reduction of Switching Current Density in Phase Change Memory Using Bi2Te3 Thermoelectric Interfacial Layer,” IEEE Electron Dev. Lett. 41, 1657-1660 (2020).
Read MoreU.S. Provisional Application 62,971,346. Issued 2020, “High Thermal Conductivity AlN Heat Spreader Films”. Ueda, S., McLeod A., Kummel, A., Burkland, M., Chumbles, E., Kazior, T., Pop, E., Chen, M., Perez, C., and Rodwell, M.
Read MoreSoroush, F., Jung, K. W., Iyengar, M., Malone, C., Asheghi, M., and K. Goodson, “Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silicon-based Thermal Management Devices,” 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, 2020, pp. 957-962.
Read MoreTerzis, A., Ramachandranm A., Wang, K., Asheghi, M., Goodson, K.E., and Santiago, J.G., “High-Frequency Water Vapor Sorption Cycling Using Fluidization of Metal-Organic Frameworks,” Cell Reports Physical Science, Vol. 1., 100057.
Read MoreNguyen, T.K., Phan, H.P., Dowling, K.M., Yalamarthy, A.S., Dinh, T., Balakrishnan, V., Liu, T.Y., Chapin, C.A., Truong, Q.D., Dau, V.T., Goodson, K.E., Senesky, D.G., Dao, D.V., Nguyen, N.T., 2020, “Lithography and Etching-Free Microfabrication of Silicon Carbide on Insulator Using Direct UV Laser Ablation,” Advanced Engineering Materials, Vol. 22, 1901173.
Read MoreGuo, P.F., Burrow, J.A., Sevison, G.A., Kwon, H., Perez, C., Hendrickson, J.R., Smith, E.M., Asheghi, M., Goodson, K.E., Agha, I., Sarangan, A.M., 2020, Tungsten-doped Ge2Sb2Te5 phase change material for high-speed optical switching devices,” Applied Physics Letters, Vol. 116, 131901.
Read MoreLiu, T.Y., Dunham, M.T., Jung, K.W., Chen, B.X., Asheghi, M., and Goodson, K.E., 2020, “Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution,” International Journal of Heat and Mass Transfer, Vol. 152, 119569.
Read MoreSevison, G., Farzinazar, S., Burrow, J., Perez, C., Kwon, Heungdong, Lee, J., Asheghi, M., Goodson, K.E., Hendrickson, J., Afha, I., 2020, “Phase Change Dynamics and 2-Dimensional 4Bit Memory in Ge2Sb2Te5 Via Telecom-Band Encoding,” ACS Photonics, Vol. 7, pp. 480-487.
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