Research Advisor
Ken Goodson chairs the Mechanical Engineering Department and holds the Davies Family Provostial Professorship as well as a courtesy appointment in Materials Science and Engineering at Stanford University. As ME Chair and Vice Chair since 2008, Goodson led two strategic plans and launched hiring actions for 15 new faculty who are transforming the department’s scholarship and diversity. Goodson is a heat transfer researcher specializing in electronics cooling and energy harvesting. His lab pioneered phonon free path measurements using silicon nanolayers and has highly-cited papers on conduction physics, novel heat conducting materials, and microfluidic heat sinks. Current "hot" projects address hybrid vehicles, smartphones, and thermally-powered wireless sensors. Nearly half of Goodson's 40 PhD alumni are professors at MIT, UC Berkeley, Stanford, and other schools. Goodson is a Fellow with ASME, IEEE, APS, & AAAS. Recognition includes the Kern Award (AIChE), the Kraus Medal (ASME), the Richard Chu Achievement Award (IEEE), the InterPACK Achievement Award (ASME/IEEE), the THERMI Award (IEEE), the SRC Technical Excellence Award, the Heat Transfer Memorial Award for Science (ASME), the Richards Award (Pi Tau Sigma), the Rohsenow Lectureship at MIT, the Aisinjoro-Soo Lectureship at UIUC, and the Hawkins Lectureship at Purdue. Goodson co-founded Cooligy, which developed heat sinks for the Apple G5 and was acquired by Emerson in 2006.

Adjunct Professor Mehdi Asheghi was a founding member of this research group as a graduate student back in 1994. He completed his Ph.D. and postdoctoral studies at Stanford through research on nanoscale thermal engineering of microelectronic devices, including several highly cited papers on phonon conduction in silicon layers. He led a very well funded research program at Carnegie Mellon University (2000-2006) that focused on nanoscale thermal phenomena in semiconductor and data storage devices. At Stanford his research ranges from nanoscale memory technologies to two phase microfluidics. Dr. Asheghi is the author of more that 200 journal publications, fully-reviewed conference papers, and book chapters, and was technical program and general chairs at ITHERM 2012, 2014 and InterPACK 2015 and 2017.

Research Associates and Post-doctoral Scholars
Website: Aditya received his B.Tech in Materials and Metallurgical Engineering from the Indian Institute of Technology, Kanpur in 2011. He is currently pursuing a PhD in Materials Science and Engineering at Stanford University. His research interests lie at the intersection of nano-thermal transport & energy conversion, nano-electronics, and fundamental materials science.

Graduate Students
Sougata is from Kolkata, India, and graduated at the top of his class from IIT Kharagpur with a B.Tech. (Hons.) in Mechanical Engineering in 2017. He is currently a Ph.D. student in the Mechanical Engineering Department at Stanford, funded by the SOE fellowship. Sougata worked extensively in microfluidics during his undergraduate years, and his current research interests lie in the fabrication and performance analysis of extreme heat flux microfluidic cooling systems. Besides research, Sougata is a huge football fan (nerd)and supports Argentina and Barcelona. He enjoys swimming, playing soccer/table tennis, and traveling plus clicking moderately bad photos of picturesque places and sometimes random things.
Ki Wook received his B.S in Mechanical Engineering from Seoul National University in 2006. He is currently pursuing his Ph.D in Mechanical Engineering at Stanford. Ki Wook has a strong background in various MEMS fabrication techniques, and his current research area focuses on embedded cooling for high heat flux applications.
Joe received his B.S. with honors in Electrical Engineering from Purdue University in May, 2012, and is now pursuing his M.S. and Ph.D. in Electrical Engineering. His research interests include solid state energy conversion and interfacial phenomena. His current research project involves the study of heat transport across non-planar interfaces. Joe is supported by a Semiconductor Research Corporation (SRC) Graduate Research Fellowship and Intel Corporation.
Heungdong received his B.S. in Mechanical Engineering and Electrical Engineering from Yonsei University, Seoul, Korea in 2015. He is now pursuing his M.S. and Ph.D. in Mechanical Engineering at Stanford, and his current research interests include the areas of thermal transport phenomena through novel nanoscale structures. Heungdong is currently supported by Kwanjeong Educational Foundation Scholarship.
Srilakshmi Lingamneni (sril AT Stanford DOT edu) received her B.Tech in Mechanical Engineering from Indian Institute of Technology, Madras in 2008 and M.S. in Mechanical Engineering from Stanford University in 2010. She is currently pursuing Ph.D. in Mechanical Engineering at Stanford University. Her research interests include development of various thermal interface materials for thermal management in electronic chips, with a particular focus on materials for 3D integrated chips.
Tanya received her B.S. in Mechanical Engineering from the Massachusetts Institute of Technology in 2014. She is currently pursuing her M.S. and Ph.D in Mechanical Engineering at Stanford, and her current research interests include the modeling and characterization of two-phase flow in various porous media. She is the recipient of a Stanford Graduate Engineering fellowship and is currently supported by the National Science Foundation Graduate Research Fellowship.
Chi received her B.S. with honors in Mechanical Engineering with a focus on MEMS from Tsinghua University, Beijing, China in 2013. She is now pursuing her M.S. and Ph.D in Mechanical Engineering at Stanford. Her current research interests include the development and characterization of microporous structures for heat exchange. Chi is the recipient of a Enlight Foundation Engineering Fellowship.