Luke Min

Website

Luke (Gyubin) Min is a Ph.D. student in Mechanical Engineering at Stanford University, specializing in heterogeneous-integration packaging and advanced thermal management for high-power electronic devices. His research spans CFD/FEA modeling (Fluent, COMSOL, Icepak), experimental thermal metrology (TDTR, IR thermography, and flow-loop characterization), and micro/nanofabrication for chip-to-cooler integration. He develops and validates cooling solutions for densely integrated logic and RF systems, with particular focus on microfluidic coolers, high-conductivity composite heat spreaders, and electrothermal co-design.

Prior to Stanford, Luke completed his M.S. at Yonsei University, where he worked on thermodynamic modeling of solid-oxide electrolysis systems. He has published in peer-reviewed journals and presented at major international conferences. He is a recipient of the Stanford Graduate Fellowship (SGF) and an Enhancing Diversity in Graduate Education (EDGE) Fellowship. Outside of research, Luke enjoys swimming, running, and traveling.

Publications

  • Lin, Y., Liu, H., Min, L. G., Turner, W., Wilson, J., Cader, T., Asheghi, M., Gray, C. T., Goodson, K. E. “High-Fidelity Package-Level Conjugate Thermal-Flow Simulation for a Memory-on-Logic 3D System with Embedded Liquid-Cooling.” 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, pp. 1308–1315 (2026). https://doi.org/10.1109/ECTC51846.2026.00216
  • Min, L. G., Kwon, H., Asheghi, M., Goodson, K. E. “Visualization of Spatial Thermal Conductivity and Boundary Conductance in Diamond Microparticles.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(7) (July 2026): 1513–1525. https://doi.org/10.1109/TCPMT.2025.3646970
  • Min, L. G., Kwon, H., Vaziri, S., Bao, X., Asheghi, M., Goodson, K. E. “Thermal Management of Three-Dimensional Chips and Monolithic Integrated Circuits Using Phase Change Materials–Si/Cu Composites.” ASME J. Electron. Packag. 148(3) (2026): 031002. https://doi.org/10.1115/1.4070160
  • Vaziri, S., Huang, X., Hou, S., Datye, I. M., He, C., Ying, J. F., Wu, X., Hsu, C. F., Min, L. G., Kwon, H., Chen, S., Chiang, C., Woon, W. Y., Liao, S. S., Asheghi, M., Goodson, K. E., Pop, E., Wong, H.-S. P., Bao, X. Y. “Sub-micron AlN Films with High Thermal Conductivity and Electrical Resistivity for Efficient Heat Dissipation in 3D ICs.” 2025 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, December 6–10, 2025, pp. 1–4. https://doi.org/10.1109/IEDM50572.2025.11353773
  • Song, Y. S., Su, H., Lee, Y.-M., Han, Z., Bennett, R. K. A., Wang, M. A., Min, L. G., Asheghi, M., Goodson, K. E., Wang, S. X., Pop, E. “Investigation and Reduction of Thermal Resistance in Gate-All-Around Indium Tin Oxide Nanosheet Field-Effect Transistors.” 2025 Device Research Conference (DRC), Durham, NC, USA, June 22–25, 2025, pp. 1–2. https://doi.org/10.1109/DRC66027.2025.11105746
  • Coughlin, M.*, Clements, A.*, Wang, F.*, Min, L. G., Jiang, K., Kwon, H., Asheghi, M., Goodson, K. E. “Development of Liquid Metal and Silicon Pin Fin Composite Thermal Interface Materials.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235805 (*equal contribution)
  • Min, L. G., Kwon, H., Perez, C., Asheghi, M., Goodson, K. E. “Direct Visualization of Local Thermal Conductivity and Boundary Conductance of Diamond Particles.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235652