Welcome!

Welcome!  We study heat transfer in electronic nanostructures & packaging, microfluidic heat sinks, and thermoelectric & photonic energy conversion devices. 

We focus on fundamental transport physics and interact extensively with semiconductor and energy companies.

FEATURED PAPERS

Barako, M.T.Sood, A., Zhang, C., Wang, J., Kodama, T.Asheghi, M., Zheng, X.L., Braun, P.V., and Goodson, K.E., 2016, “Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals,” Nano Letters, Vol. 16, pp. 2754-2761  DOI: 10.1021/acs.nanolett.6b00468

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Cho, J., and Goodson, K.E., 2015, "Thermal Transport: Cool Electronics," Nature Materials, Vol. 14, pp. 136-137.

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Roy-Panzer, S., Kodama, T., Lingamneni, S., Panzer, M. A., Asheghi, M., Goodson, K.E., 2015, "Thermal Characterization and Analysis of Microliter Liquid Volumes using the Three-Omega Method," Review of Scientific Instruments (Featured Article, Cover Image), 86, 024901.

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Marconnet, A.M., Panzer, M.P., and Goodson, K.E., 2013, "Thermal Conduction Phenomena in Carbon Nanotubes and Related Nanostructured Materials," Reviews of Modern Physics, Vol. 85, pp. 1296-1327.

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Pop, E., Sinha, S., and Goodson, K.E., 2006, "Heat Generation and Transport in Nanometer Scale Transistors," Proceedings of the IEEE, Vol. 94, pp. 1587-1601.

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Jiang, Mikkelsen, Koo, Huber, Yao, Zhang, Zhou, Maveety, Prasher, Santiago, Kenny, Goodson, 2002, "Closed-Loop Electroosmotic Cooling System for VLSI Circuits," IEEE Proc. Components, Packaging, & Manufacturing Technology, Vol. 25, pp. 347-355.  SEMITHERM Best Paper, 2001.  Our US patents based on this paper: 6942018, 6991024, 7131486, 7185697, & 7334630. 

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