Welcome!

Welcome!  We study heat transfer in electronic nanostructures & packaging, microfluidic heat sinks, and thermoelectric & photonic energy conversion devices. 

We focus on fundamental transport physics and interact extensively with semiconductor and energy companies.

FEATURED PAPERS

Marconnet, A.M., Panzer, M.P., and Goodson, K.E., 2013, "Thermal Conduction Phenomena in Carbon Nanotubes and Related Nanostructured Materials," Reviews of Modern Physics, invited, accepted and in press.

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Marconnet, A.M., Asheghi, M., and Goodson, K.E., 2013, "From the Casimir Limit to Phononic Crystals: Twenty Years of Phonon Transport Studies using Silicon-on-Insulator Technology," Journal of Heat Transfer, invited for special anniversary issue, accepted and in press.

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Li, Z., Tan, S., Bozorg-Grayeli, E., Kodama, T., Asheghi, M., Delgado, G., Panzer, M., Pokrovsky, A., Wack, D., and Goodson, K.E., 2012, "Phonon Dominated Heat Conduction Normal to Mo/Si Multilayers with Period below 10 nm," Nano Letters, Vol. 12, pp. 3121-3126.

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David, M.P., Miler, J., Steinbrenner, J., Yang, Y., Touzelbaev, M., and Goodson, K.E., 2011, "Hydraulic and Thermal Characteristics of a Vapor Venting Two-phase Microchannel Heat Exchanger," International Journal of Heat and Mass Transfer, Vol. 54, pp. 5504-5516.

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Steinbrenner, J.B., Lee, E.S., Hidrovo, C.H., Eaton, J.K., and Goodson, K.E., 2011, "Impact of channel geometry on two-phase flow in fuel cell microchannels," Journal of Power Sources, Vol. 196, 5012-5020.

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Rowlette, J.A., Kekatpure, R.D., Panzer, M.A., Brongersma, M.L., and Goodson, K.E., 2009, "Nonradiative Recombination in Strongly Interacting Silicon Nanocrystals Embedded in Amorphous Silicon-Oxide Films," Physical Review B, Vol. 80, 045314.

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Pop, E., Sinha, S., and Goodson, K.E., 2006, "Heat Generation and Transport in Nanometer Scale Transistors," Proceedings of the IEEE, Vol. 94, pp. 1587-1601.

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Jiang, Mikkelsen, Koo, Huber, Yao, Zhang, Zhou, Maveety, Prasher, Santiago, Kenny, Goodson, 2002, "Closed-Loop Electroosmotic Cooling System for VLSI Circuits," IEEE Proc. Components, Packaging, & Manufacturing Technology, Vol. 25, pp. 347-355.  SEMITHERM Best Paper, 2001.  Our US patents based on this paper: 6942018, 6991024, 7131486, 7185697, & 7334630. 

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