Dr. Mehdi Asheghi

Dr. Mehdi Asheghi

Affiliated Faculty

Website

Adjunct Professor Mehdi Asheghi was a founding member of this research group as a graduate student back in 1994.  He completed his Ph.D. and postdoctoral studies at Stanford through research on nanoscale thermal engineering of microelectronic devices, including several highly cited papers on phonon conduction in silicon layers. He led a very well funded research program at Carnegie Mellon University (2000-2006) that focused on nanoscale thermal phenomena in semiconductor and data storage devices. At Stanford his research ranges from nanoscale memory technologies to two phase microfluidics.  Dr. Asheghi is the author of more than 200 journal publications, fully-reviewed conference papers, and book chapters, and was technical program and was technical program and  general chairs at ITHERM 2012, 2014 and InterPACK 2015 and 2017.

Publications

  • Zhang, C., Wu, Q., Shattique, M., Seyedhassantehrani, N., Roy, S., Palko, J., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E, Giglio, R., Dede, E. M., Asheghi, M. "Heat flux micro coolers having multi-stepped features and fluid wicking". U.S. Patent No. 11,729,951. 15 Aug. 2023.
  • Zhang, C., Hazra, S., Wu, Q., Asheghi, M., Goodson, K. E., Dede, E., Palko, J., Narumanchi, S. “Hardmask to substrate pattern transfer method for Microfabrication of micro to mesoscale, high aspect ratio, multi-level, 3D Structures". US Patent App. 18/084,303, 2023
  • Khan, A. I., Yu, H., Zhang, H., Goggin, J. R., Kwon, H., Wu, X., Perez, C., Neilson, K. M., Asheghi, M., Goodson, K. E., Vora, P. M., Davydov, A., Takeuchi, I., Pop, E. "Energy Efficient Neuro‐inspired Phase Change Memory Based on Ge4Sb6Te7 as a Novel Epitaxial Nanocomposite." Advanced Materials (2023): 2300107.
  • Dede, E. M., Zhang, C., Wu, Q., Seyedhassantehrani, N., Shattique, M., Roy, S., Palko, J. W., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E., Giglio, R., Asheghi, M. "Techno-economic feasibility analysis of an extreme heat flux micro-cooler". Iscience 26, no. 1 (2023).
  • Khan, A. I., Wu, X., Perez, C., Won, B., Kim, K., Ramesh, P., Kwon, H., Tung, M. C., Lee, Z., Oh, I. K., Saraswat, K., Asheghi, M., Goodson, K. E., Wong, H. S. P., Pop, E. "Unveiling the Effect of Superlattice Interfaces and Intermixing on Phase Change Memory Performance". Nano Letters, 2022, 22 (15), 6285–6291.
  • Hazra, S., Zhang, C., Wu, Q., Asheghi, M., Goodson, K., Dede, E. M., Palko, J., Narumanchi, S.. "A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies". Scientific Reports 12.1 (2022): 12180.
  • Perez, C., Jog, A., Kwon, H., Gall, D., Asheghi, M., Kumar, S., Park, W., Goodson, K. E., Dominant Energy Carrier Transitions and Thermal Anisotropy in Epitaxial Iridium Thin Films. Advanced Functional Materials 2022, 32, 2207781.
  • Liu, T., Asheghi, M., and Goodson, K. E. (2021). Performance and Manufacturing of Silicon-Based Vapor Chambers. Applied Mechanics Reviews, 73(1), 010802.
  • Kwon, H., Khan, A.I., Perez, C., Asheghi, M., Pop, E., Goodson, K.E., 2021 "Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films", ACS Nano Letters, 21 (14), 5984-5990.
  • Zhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Goodson, K. E. (2021). Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications. International Journal of Heat and Mass Transfer, 173, 121241
  • Jung, D., Lee, H., Kong, D., Cho, E., Jung, K.W., Kharangate, C.R., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “Thermal Design and Management of Micro-Pin Fin Heat Sinks for Energy-Efficient Three-Dimensional Stacked Integrated Circuits.” International Journal of Heat and Mass Transfer, vol. 175, 2021, p. 121192., doi:10.1016/j.ijheatmasstransfer.2021.121192
  • Lee, H., Kang, M., Jung, K.W., Kharangate, C.R., Lee, S., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “An Artificial Neural Network Model for Predicting Frictional Pressure Drop in Micro-Pin Fin Heat Sink.” Applied Thermal Engineering, 2021, p. 117012., doi:10.1016/j.applthermaleng.2021.117012
  • Scott, E. A., Perez, C., Saltonstall, C., Adams, D. P., Hodges, C., Asheghi, M., Goodson, K. E., Hopkins, P., Leonhardt, D., & Ziade, E.O. (2021). Simultaneous thickness and thermal conductivity determination of thinned silicon from 100 nanometers to 40 microns. Applied Physics Letters, 1–7.
  • Soroush, F., Liu, T., Wu, Q., Asheghi, M., Goodson, K. E., Marco, L., ... & Martin, R. (2021, October). Contact Angle Tuning of Copper Microporous Structures. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T07A010). American Society of Mechanical Engineers.
  • Soroush, F., Liu, T., Wu, Q., Zhang, C., Asheghi, M., Goodson, K. E., ... & Martin, R. (2021, October). A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T05A001). American Society of Mechanical Engineers.
  • Soroush, F., Jung, K. W., Iyengar, M., Malone, C., Asheghi, M., and K. Goodson, "Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silicon-based Thermal Management Devices," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, 2020, pp. 957-962.