Heungdong Kwon

Dr. Heungdong Kwon

Postdoctoral Scholar


Heungdong earned his Ph.D. in ME at Stanford in 2022, during which he was supported by the Kwanjeong Educational Foundation Scholarship. He is currently a postdoctoral scholar in Nanoheat group and his current work is to develop advanced micro-fluidic cooler system for ultra-high heat flux removal from power electronics and high-performance computing devices. His interest also includes nanoscale thermal transport in chalcogenide heterostructures and wide-band gap materials. Heungdong received his B.S. in ME and EE from Yonsei University, Seoul, Korea in 2015.

Publications

  • Kwon, H., Giglio, R., Kong, D., Shattique, M. R., Lee, H., Palko, J. W., Dede, E. M., Asheghi, M., Goodson, K. E. “Capillary-driven two-phase cooler for high-heat-flux electronics using copper wire mesh manifold and enhanced copper inverse opal wick heat sink.” Applied Thermal Engineering 303, Part 1 (2026): 131914. https://doi.org/10.1016/j.applthermaleng.2026.131914
  • Jiang, K., Kwon, H., Asheghi, M., Goodson, K. E. “Experimental Optimization of Liquid–Vapor Phase Separation in High Heat Flux Capillary-Driven μ-Coolers.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(9) (September 2026): 2046–2053. https://doi.org/10.1109/TCPMT.2026.3697351
  • Lin, Y., Kwon, H., He, Y., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics.” ASME J. Electron. Packag. 148(2) (2026): 021001. https://doi.org/10.1115/1.4071139
  • Min, L. G., Kwon, H., Asheghi, M., Goodson, K. E. “Visualization of Spatial Thermal Conductivity and Boundary Conductance in Diamond Microparticles.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(7) (July 2026): 1513–1525. https://doi.org/10.1109/TCPMT.2025.3646970
  • Min, L. G., Kwon, H., Vaziri, S., Bao, X., Asheghi, M., Goodson, K. E. “Thermal Management of Three-Dimensional Chips and Monolithic Integrated Circuits Using Phase Change Materials–Si/Cu Composites.” ASME J. Electron. Packag. 148(3) (2026): 031002. https://doi.org/10.1115/1.4070160
  • Vaziri, S., Huang, X., Hou, S., Datye, I. M., He, C., Ying, J. F., Wu, X., Hsu, C. F., Min, L. G., Kwon, H., Chen, S., Chiang, C., Woon, W. Y., Liao, S. S., Asheghi, M., Goodson, K. E., Pop, E., Wong, H.-S. P., Bao, X. Y. “Sub-micron AlN Films with High Thermal Conductivity and Electrical Resistivity for Efficient Heat Dissipation in 3D ICs.” 2025 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, December 6–10, 2025, pp. 1–4. https://doi.org/10.1109/IEDM50572.2025.11353773
  • Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Thermofluidic Visualization of the Capillary-Driven Boiling for Design Optimization of Silicon-Embedded Evaporators.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(7) (July 2026): 1499–1512. https://doi.org/10.1109/TCPMT.2025.3636077
  • Kong, D., Giglio, R., Shattique, M. R., Wu, Q., Kwon, H., Palko, J. W., Lee, H., Dede, E. M., Asheghi, M., Goodson, K. E. “Development of a capillary-driven two-phase microcooler using copper wiremesh 3D manifold and silicon micropin fin wicks.” International Journal of Mechanical Sciences 305 (2025): 110781. https://doi.org/10.1016/j.ijmecsci.2025.110781
  • Kong, D., Kwon, H., Lee, H., Lee, H., Asheghi, M., Goodson, K. E. “Computational Fluid Dynamics Modeling and Optimization of Large-Scale (3 cm × 3 cm) Silicon-Based Embedded Microchannels With Three-Dimensional Manifold Microcoolers.” ASME J. Electron. Packag. 147(4) (2025): 041105. https://doi.org/10.1115/1.4069319
  • Kwon, H., Kong, D., Palko, J., Dede, E. M., Asheghi, M., Goodson, K. E. “Enhanced Capillary-Driven Boiling in Two-Phase Micro-cooler with Engineered Copper Inverse Opals (CIOs) Wick and Silicon 3D Manifold for High Heat Flux Cooling Application.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025.
  • Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Performance Characterization of Capillary-driven Thin-Film Boiling under Sub-Atmospheric (25-100 kPa) Environment.” 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235588
  • Min, L. G., Kwon, H., Perez, C., Asheghi, M., Goodson, K. E. “Direct Visualization of Local Thermal Conductivity and Boundary Conductance of Diamond Particles.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235652
  • Wang, Y., Collinson, D. W., Kwon, H., Miller, R. D., Lionti, K., Goodson, K. E., Dauskardt, R. H. "Linking Interfacial Bonding and Thermal Conductivity in Molecularly‐Confined Polymer‐Glass Nanocomposites with Ultra‐High Interfacial Density." Small (2023): 2301383.
  • Khan, A. I., Yu, H., Zhang, H., Goggin, J. R., Kwon, H., Wu, X., Perez, C., Neilson, K. M., Asheghi, M., Goodson, K. E., Vora, P. M., Davydov, A., Takeuchi, I., Pop, E. "Energy Efficient Neuro‐inspired Phase Change Memory Based on Ge4Sb6Te7 as a Novel Epitaxial Nanocomposite." Advanced Materials (2023): 2300107.
  • Khan, A. I., Wu, X., Perez, C., Won, B., Kim, K., Ramesh, P., Kwon, H., Tung, M. C., Lee, Z., Oh, I. K., Saraswat, K., Asheghi, M., Goodson, K. E., Wong, H. S. P., Pop, E. "Unveiling the Effect of Superlattice Interfaces and Intermixing on Phase Change Memory Performance". Nano Letters, 2022, 22 (15), 6285–6291.
  • Perez, C., Jog, A., Kwon, H., Gall, D., Asheghi, M., Kumar, S., Park, W., Goodson, K. E., Dominant Energy Carrier Transitions and Thermal Anisotropy in Epitaxial Iridium Thin Films. Advanced Functional Materials 2022, 32, 2207781.
  • Kwon, H., Perez, C., Park, W., Asheghi, M., and Goodson, K.E., 2021 “Thermal Characterization of Metal–Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers,” ACS Applied Materials Interfaces, 13, 48.
  • Kwon, H., Perez, C., Kim, H. K., Asheghi, M., Park, W., and Goodson, K. E. (2021). Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition. ACS Applied Materials & Interfaces.
  • Kwon, H., Khan, A.I., Perez, C., Asheghi, M., Pop, E., Goodson, K.E., 2021 "Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films", ACS Nano Letters, 21 (14), 5984-5990.
  • Sevison, G., Farzinazar, S., Burrow, J., Perez, C., Kwon, Heungdong, Lee, J., Asheghi, M., Goodson, K.E., Hendrickson, J., Afha, I., 2020, "Phase Change Dynamics and 2-Dimensional 4Bit Memory in Ge2Sb2Te5 Via Telecom-Band Encoding," ACS Photonics, Vol. 7, pp. 480-487.
  • A.I. Khan, H. Kwon, R. Islam, C. Perez, M.E. Chen, M. Asheghi, K.E. Goodson, H.-S.P. Wong, E. Pop, "Two-Fold Reduction of Switching Current Density in Phase Change Memory Using Bi2Te3 Thermoelectric Interfacial Layer," IEEE Electron Dev. Lett. 41, 1657-1660 (2020).
  • Guo, P.F., Burrow, J.A., Sevison, G.A., Kwon, H., Perez, C., Hendrickson, J.R., Smith, E.M., Asheghi, M., Goodson, K.E., Agha, I., Sarangan, A.M., 2020,  Tungsten-doped Ge2Sb2Te5 phase change material for high-speed optical switching devices," Applied Physics Letters, Vol. 116, 131901.