Kenneth E. Goodson

Principal Investigator


Ken Goodson is the Davies Family Provostial Professor and the Senior Associate Dean for Faculty & Academic Affairs in the School of Engineering. He holds appointments in Mechanical Engineering and (by courtesy) Materials Science and Engineering.  As Mechanical Engineering Chair & Vice Chair from 2008 to 2019, Goodson led two strategic plans and recruited 15 faculty who transformed the department’s scholarship and diversity.

Goodson specializes in heat transfer and electronics cooling. His lab pioneered phonon free path measurements using silicon nanolayers and helped IC companies launch SOI, PCRAM, and other thermally-hard technologies. Current projects focus on power devices, vehicles, and data centers with ARPA-E, Google, Toyota, Intel, SRC, and NSF/POETS. Goodson has 35 patents and co-founded Cooligy, which built heat sinks for Apple and was acquired by Emerson.

Goodson is a member of the National Academy of Engineering and is a fellow with ASME, IEEE, APS, AAAS, and the National Academy of Inventors. He received the ASME Kraus Medal, the inaugural IEEE Chu Award, the AIChE Kern Award, the SRC Technical Excellence Award, and the Heat Transfer Memorial Award for Science.  Goodson’s PhD alumni include dozens at IC firms and 20+ faculty at MIT, UC Berkeley, Stanford, and other schools.

Goodson moonlights as a baritone oratorio soloist with Stanford groups and the San Francisco Choral Society in Davies Symphony Hall. He will sing the title role of Mendelssohn’s Elijah with Schola Cantorum in May 2020. His wife, Laura Dahl, is a concert pianist with the Stanford music faculty.

Publications

  • Kwon, H., Giglio, R., Kong, D., Shattique, M., Lee, H., Palko, J. W., Dede, E. M., Asheghi, M., Goodson, K. E. “Exploring capillary limits of copper wire mesh manifold for area scaling of capillary-driven two-phase coolers.” International Communications in Heat and Mass Transfer 180, Part 4 (2026): 112500. https://doi.org/10.1016/j.icheatmasstransfer.2026.112500
  • Bazmi, B., Joshi, S., Park, W. Y., Aflatounian, S., Lad, A. A., Liu, J., Shatskiy, E., Garimella, V. S., Tang, C., Lin, Y., Asheghi, M., Mantooth, H. A., Goodson, K. E., Miljkovic, N. “High-heat-flux liquid cooling of electronics with manifold microchannels: Thermal-hydraulic optimization and experimental validation.” International Journal of Heat and Mass Transfer 268 (2026): 128924. https://doi.org/10.1016/j.ijheatmasstransfer.2026.128924
  • Kwon, H., Giglio, R., Kong, D., Shattique, M. R., Lee, H., Palko, J. W., Dede, E. M., Asheghi, M., Goodson, K. E. “Capillary-driven two-phase cooler for high-heat-flux electronics using copper wire mesh manifold and enhanced copper inverse opal wick heat sink.” Applied Thermal Engineering 303, Part 1 (2026): 131914. https://doi.org/10.1016/j.applthermaleng.2026.131914
  • Anderson, J., Hazra, S., Asheghi, M., Goodson, K. E. “Capillary Transport Enhancement in Hybrid Micropillar Wicks Fabricated with UV-Laser Ablation.” ACS Applied Engineering Materials 4(6) (2026): 3168–3175. https://doi.org/10.1021/acsaenm.6c00335
  • Jiang, K., Kwon, H., Asheghi, M., Goodson, K. E. “Experimental Optimization of Liquid–Vapor Phase Separation in High Heat Flux Capillary-Driven μ-Coolers.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(9) (September 2026): 2046–2053. https://doi.org/10.1109/TCPMT.2026.3697351
  • Lin, Y., Liu, H., Min, L. G., Turner, W., Wilson, J., Cader, T., Asheghi, M., Gray, C. T., Goodson, K. E. “High-Fidelity Package-Level Conjugate Thermal-Flow Simulation for a Memory-on-Logic 3D System with Embedded Liquid-Cooling.” 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, pp. 1308–1315 (2026). https://doi.org/10.1109/ECTC51846.2026.00216
  • Lin, Y., Kwon, H., He, Y., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics.” ASME J. Electron. Packag. 148(2) (2026): 021001. https://doi.org/10.1115/1.4071139
  • Tang, C., Lin, Y., Chen, H., Chen, Y., Gupta, M. P., Degner, M., Asheghi, M., Goodson, K. E., Mantooth, H. A. “High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler.” 2026 IEEE Applied Power Electronics Conference and Exposition (APEC), San Antonio, TX, USA, March 22–26, 2026, pp. 1094–1097. https://doi.org/10.1109/APEC51134.2026.11517173
  • Min, L. G., Kwon, H., Asheghi, M., Goodson, K. E. “Visualization of Spatial Thermal Conductivity and Boundary Conductance in Diamond Microparticles.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(7) (July 2026): 1513–1525. https://doi.org/10.1109/TCPMT.2025.3646970
  • Min, L. G., Kwon, H., Vaziri, S., Bao, X., Asheghi, M., Goodson, K. E. “Thermal Management of Three-Dimensional Chips and Monolithic Integrated Circuits Using Phase Change Materials–Si/Cu Composites.” ASME J. Electron. Packag. 148(3) (2026): 031002. https://doi.org/10.1115/1.4070160
  • Vaziri, S., Huang, X., Hou, S., Datye, I. M., He, C., Ying, J. F., Wu, X., Hsu, C. F., Min, L. G., Kwon, H., Chen, S., Chiang, C., Woon, W. Y., Liao, S. S., Asheghi, M., Goodson, K. E., Pop, E., Wong, H.-S. P., Bao, X. Y. “Sub-micron AlN Films with High Thermal Conductivity and Electrical Resistivity for Efficient Heat Dissipation in 3D ICs.” 2025 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, December 6–10, 2025, pp. 1–4. https://doi.org/10.1109/IEDM50572.2025.11353773
  • Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Thermofluidic Visualization of the Capillary-Driven Boiling for Design Optimization of Silicon-Embedded Evaporators.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(7) (July 2026): 1499–1512. https://doi.org/10.1109/TCPMT.2025.3636077
  • Kong, D., Giglio, R., Shattique, M. R., Wu, Q., Kwon, H., Palko, J. W., Lee, H., Dede, E. M., Asheghi, M., Goodson, K. E. “Development of a capillary-driven two-phase microcooler using copper wiremesh 3D manifold and silicon micropin fin wicks.” International Journal of Mechanical Sciences 305 (2025): 110781. https://doi.org/10.1016/j.ijmecsci.2025.110781
  • Kong, D., Kwon, H., Lee, H., Lee, H., Asheghi, M., Goodson, K. E. “Computational Fluid Dynamics Modeling and Optimization of Large-Scale (3 cm × 3 cm) Silicon-Based Embedded Microchannels With Three-Dimensional Manifold Microcoolers.” ASME J. Electron. Packag. 147(4) (2025): 041105. https://doi.org/10.1115/1.4069319
  • Song, Y. S., Su, H., Lee, Y.-M., Han, Z., Bennett, R. K. A., Wang, M. A., Min, L. G., Asheghi, M., Goodson, K. E., Wang, S. X., Pop, E. “Investigation and Reduction of Thermal Resistance in Gate-All-Around Indium Tin Oxide Nanosheet Field-Effect Transistors.” 2025 Device Research Conference (DRC), Durham, NC, USA, June 22–25, 2025, pp. 1–2. https://doi.org/10.1109/DRC66027.2025.11105746
  • Kwon, H., Kong, D., Palko, J., Dede, E. M., Asheghi, M., Goodson, K. E. “Enhanced Capillary-Driven Boiling in Two-Phase Micro-cooler with Engineered Copper Inverse Opals (CIOs) Wick and Silicon 3D Manifold for High Heat Flux Cooling Application.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025.
  • Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Performance Characterization of Capillary-driven Thin-Film Boiling under Sub-Atmospheric (25-100 kPa) Environment.” 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235588
  • Coughlin, M.*, Clements, A.*, Wang, F.*, Min, L. G., Jiang, K., Kwon, H., Asheghi, M., Goodson, K. E. “Development of Liquid Metal and Silicon Pin Fin Composite Thermal Interface Materials.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235805 (*equal contribution)
  • Kong, D., Giglio, R., Zhang, C., Jiang, K., Palko, J. W., Lee, H., Asheghi, M., Goodson, K. E. “Comparison of Pumped vs. Capillary-driven Two-Phase Microcoolers for High Heat Flux Applications.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235580
  • Min, L. G., Kwon, H., Perez, C., Asheghi, M., Goodson, K. E. “Direct Visualization of Local Thermal Conductivity and Boundary Conductance of Diamond Particles.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235652
  • Dede, E. M., Zhou, F., Zhou, Y., Lohan, D. J., Asheghi, M., Goodson, K. E., Erickson, K. “Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics.” ASME J. Electron. Packag. 147(2) (2025): 021009. https://doi.org/10.1115/1.4067649
  • Giglio, R., Shattique, M. R., Dede, E. M., Narumanchi, S., Asheghi, M., Goodson, K. E., Palko, J. W. “Porous mesh manifold for enhanced boiling performance.” Applied Thermal Engineering 260 (2025): 124918. https://doi.org/10.1016/j.applthermaleng.2024.124918
  • Lin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M., Asheghi , M., Mantooth, H. A., and Goodson, K. E. (September 20, 2023). "Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform." ASME. J. Electron. Packag. June 2024; 146(2): 021003. https://doi.org/10.1115/1.4062924
  • Zhang, C., Wu, Q., Shattique, M., Seyedhassantehrani, N., Roy, S., Palko, J., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E, Giglio, R., Dede, E. M., Asheghi, M. "Heat flux micro coolers having multi-stepped features and fluid wicking". U.S. Patent No. 11,729,951. 15 Aug. 2023.
  • Zhang, C., Hazra, S., Wu, Q., Asheghi, M., Goodson, K. E., Dede, E., Palko, J., Narumanchi, S. “Hardmask to substrate pattern transfer method for Microfabrication of micro to mesoscale, high aspect ratio, multi-level, 3D Structures". US Patent App. 18/084,303, 2023
  • Chen, R., Fang, Z., Perez, C., Miller, F., Kumari, K., Saxena, A., Zheng, J., Geiger, S. J., Goodson, K. E., Majumdar, A. "Non-volatile electrically programmable integrated photonics with 5-bit operation." Nature Communications 14.1 (2023): 3465.
  • Lin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M. Asheghi, M., Mantooth, H. A., and Goodson, K. E., (June 7, 2023). "Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module." ASME. J. Electron. Packag. March 2024; 146(1): 011006. https://doi.org/10.1115/1.4062384
  • Chen, R., Fang, Z., Perez, C., Miller, F., Kumari, K., Saxena, A., Zheng, J., Geiger, S. J., Goodson, K. E., Majumdar, A. "Non-volatile electrically programmable integrated photonics with 5-bit operation based on phase-change material Sb2S3." CLEO: Science and Innovations. Optica Publishing Group, 2023.
  • Wang, Y., Collinson, D. W., Kwon, H., Miller, R. D., Lionti, K., Goodson, K. E., Dauskardt, R. H. "Linking Interfacial Bonding and Thermal Conductivity in Molecularly‐Confined Polymer‐Glass Nanocomposites with Ultra‐High Interfacial Density." Small (2023): 2301383.
  • Khan, A. I., Wu, X., Won, B., Lindgren, E., Perez, C., Goodson, K., Suzuki, Y., Oh, I-K., Wong, H-S. P., Pop, E. "Unconventional Resistivity Scaling in Polycrystalline NbP Thin Films," Bulletin of the American Physical Society, 2023
  • Khan, A. I., Yu, H., Zhang, H., Goggin, J. R., Kwon, H., Wu, X., Perez, C., Neilson, K. M., Asheghi, M., Goodson, K. E., Vora, P. M., Davydov, A., Takeuchi, I., Pop, E. "Energy Efficient Neuro‐inspired Phase Change Memory Based on Ge4Sb6Te7 as a Novel Epitaxial Nanocomposite." Advanced Materials (2023): 2300107.
  • Dede, E. M., Zhang, C., Wu, Q., Seyedhassantehrani, N., Shattique, M., Roy, S., Palko, J. W., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E., Giglio, R., Asheghi, M. "Techno-economic feasibility analysis of an extreme heat flux micro-cooler". Iscience 26, no. 1 (2023).
  • Wu, X., Khan, A. I., Ramesh, P., Perez, C., Kim, K., Lee, Z., Saraswat, K., Goodson, K. E., Philip Wong, H. S., Pop, E. "Understanding Interface-Controlled Resistance Drift in Superlattice Phase Change Memory". IEEE Electron Device Lett. 2022, 2–5.
  • Khan, A. I., Wu, X., Perez, C., Won, B., Kim, K., Ramesh, P., Kwon, H., Tung, M. C., Lee, Z., Oh, I. K., Saraswat, K., Asheghi, M., Goodson, K. E., Wong, H. S. P., Pop, E. "Unveiling the Effect of Superlattice Interfaces and Intermixing on Phase Change Memory Performance". Nano Letters, 2022, 22 (15), 6285–6291.
  • Hazra, S., Zhang, C., Wu, Q., Asheghi, M., Goodson, K., Dede, E. M., Palko, J., Narumanchi, S.. "A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies". Scientific Reports 12.1 (2022): 12180.
  • Perez, C., Jog, A., Kwon, H., Gall, D., Asheghi, M., Kumar, S., Park, W., Goodson, K. E., Dominant Energy Carrier Transitions and Thermal Anisotropy in Epitaxial Iridium Thin Films. Advanced Functional Materials 2022, 32, 2207781.
  • Chen, M. E., Rojo, M. M., Lian, F., Koeln, J., Sood, A., Bohaichuk, S. M., Neumann, C. M., Garrow, S. G., Alleyne, A. G., Goodson, K. E., Pop, E., “Graphene-Based Electromechanical Thermal Switches”, 2D Materials, in press.
  • Xiong, F., Yalon, E., McClellan, C. M., Zhang, J., Aslan, O. B., Sood, A., Sun, J., Andolina, C., Al-Saidi, W., Goodson, K. E., Heinz, T. F., Cui, Y., Pop, E. 2021 "Tuning Electrical and Interfacial Thermal Properties of Bilayer MoS2 via Electrochemical Intercalation", Nanotechnology, 32, 26520
  • Hinckley, A. C., Andrews, S. C., Dunham, M., Sood, A., Barako, M. T., Schneider, S., Toney, M. F., Goodson, K. E., Bao, Z., 2021 "Achieving High Thermoelectric Performance and Metallic Transport in Solvent-Sheared PEDOT:PSS", Advanced Electronic Materials, 2001190.
  • Scott, E. A., Perez, C., Saltonstall, C., Adams, D. P., Hodges, C., Asheghi, M., Goodson, K. E., Hopkins, P., Leonhardt, D., & Ziade, E.O. (2021). Simultaneous thickness and thermal conductivity determination of thinned silicon from 100 nanometers to 40 microns. Applied Physics Letters, 1–7.
  • Kwon, H., Perez, C., Kim, H. K., Asheghi, M., Park, W., and Goodson, K. E. (2021). Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition. ACS Applied Materials & Interfaces.
  • Jung, D., Lee, H., Kong, D., Cho, E., Jung, K.W., Kharangate, C.R., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “Thermal Design and Management of Micro-Pin Fin Heat Sinks for Energy-Efficient Three-Dimensional Stacked Integrated Circuits.” International Journal of Heat and Mass Transfer, vol. 175, 2021, p. 121192., doi:10.1016/j.ijheatmasstransfer.2021.121192
  • Lee, H., Kang, M., Jung, K.W., Kharangate, C.R., Lee, S., Iyengar, M., Malone, C., Asheghi, M., Goodson, K.E., Lee, H. “An Artificial Neural Network Model for Predicting Frictional Pressure Drop in Micro-Pin Fin Heat Sink.” Applied Thermal Engineering, 2021, p. 117012., doi:10.1016/j.applthermaleng.2021.117012
  • Liu, T., Asheghi, M., and Goodson, K. E. (2021). Performance and Manufacturing of Silicon-Based Vapor Chambers. Applied Mechanics Reviews, 73(1), 010802.
  • Zhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Goodson, K. E. (2021). Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications. International Journal of Heat and Mass Transfer, 173, 121241
  • Kwon, H., Khan, A.I., Perez, C., Asheghi, M., Pop, E., Goodson, K.E., 2021 "Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films", ACS Nano Letters, 21 (14), 5984-5990.
  • Soroush, F., Liu, T., Wu, Q., Asheghi, M., Goodson, K. E., Marco, L., ... & Martin, R. (2021, October). Contact Angle Tuning of Copper Microporous Structures. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T07A010). American Society of Mechanical Engineers.
  • Soroush, F., Liu, T., Wu, Q., Zhang, C., Asheghi, M., Goodson, K. E., ... & Martin, R. (2021, October). A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T05A001). American Society of Mechanical Engineers.
  • A. Sood, C. Sievers, Y. C. Shin, V. Chen, S. Chen, K. K. H. Smithe, S. Chatterjee, D. Donadio, K. E. Goodson, E. Pop, “Engineering thermal transport across layered graphene-MoS2 superlattices”, ACS Nano, 15, 19503 (2021)
  • Soroush, F., Jung, K. W., Iyengar, M., Malone, C., Asheghi, M., and K. Goodson, "Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silicon-based Thermal Management Devices," 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, 2020, pp. 957-962.