News

Inaugural Richard Chu Achievement award

Ken Goodson will be recognized at ITHERM 2018 for contributions to electronics thermal management and will deliver a luncheon plenary entitled “The Heat Conduction Renaissance” this coming June. Kenneth Goodson receives the Inaugural Richard Chu ITherm Award The mechanical engineering department chair has been recognized for his significant contributions to thermal management in electronic systems […]

IEEE Spectrum features our heat sink surface engineering

Retaining liquids that wet the material surface is a big challenge, we’ve developed a strategy based on nanostructuring. Retaining liquids that wet nanostructured interfaces is a big challenge, Damena and collaborators have shown the route forward.  J. Colloid Science & Technology is featuring our article with a cover image, and there is some nice press […]

Best Poster at IEEE Power Electronics Conference

Chirag & Joe led a novel heat sink design for GaN power electronics and co-authored the best poster at the Applied Power Electronics Conf. in San Antonio TX Here is the full reference for the poster, which is collaborative with the Pilawa group at UIUC:  N. Pallo, C. Kharangate, T. Modeer, J. Schaadt, M. Asheghi, […]

Diamond-GaN Bonding

Jungwan’s new paper with industrial collaborators explores conduction limits while pushing the boundaries of high speed thermoreflectance Jungwan Cho from nanoheat with local industrial collaborators explores the limits of power electronics thermal management using composite GaN-diamond substrates. our paper just out