Kenny, T.W., Goodson, K.E., Santiago, J.G., Wang, E.N., Koo, J.M., L. Jiang, Pop, E., Sinha, S., Zhang, L., Fogg, D., Yao, S., Flynn, R., Cheng, C.H., and Hidrovo, C.H., 2005, “Advanced Cooling Technologies for Microprocessors,” International Journal of High Speed Electronics and Systems, Vol. 16, pp 107-133.
Recent trends in processor power for the next generation devices point clearly to significant increase in processor heat dissipation over the coming years. In the desktop system design space, the tendency has been to minimize system enclosure size while maximizing performance, which in turn leads to high power densities in future generation systems. The current thermal solutions used today consist of advanced heat sink designs and heat pipe designs with forced air cooling to cool high power processors. However, these techniques are already reaching their limits to handle high heat flux, and there is a strong need for development of more efficient cooling systems which are scalable to handle the high heat flux generated by the future products. To meet this challenge, there has been research in academia and in industry to explore alternative methods for extracting heat from high-density power sources in electronic systems. This talk will discuss the issues surrounding device cooling, from the transistor level to the system level, and describe system-level solutions being developed for desktop computer applications developed in our group at Stanford University.