Heat Transfer Regimes in Microstructures
Flik, M.I., Choi, B.I., and Goodson, K.E., 1992, “Heat Transfer Regimes in Microstructures,” ASME Journal of Heat Transfer, Vol. 114, pp. 666-674.
Flik, M.I., Choi, B.I., and Goodson, K.E., 1992, “Heat Transfer Regimes in Microstructures,” ASME Journal of Heat Transfer, Vol. 114, pp. 666-674.
Flik, M.I., Zhang, Z.M., Goodson, K.E., Siegal, M.P., and Phillips, J.M., 1992, “The Electron Scattering Rate in Epitaxial YBa2Cu3O7 Superconducting Films,” Physical Review B, Vol. 46, pp. 5606-5614.
Goodson, K.E., and Flik, M.I., 1992, “Effect of Microscale Thermal Conduction on the Packing Limit of Silicon-on-Insulator Electronic Devices,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, pp. 715-722.