Tiwei Wei

Tiwei Wei is currently the research scholar at NanoHeat group in Stanford University. He received his PhD degree at the Interuniversity Microelectronics Centre (imec) and KU Leuven, Belgium in 2020. He joined imec in 2015, starting the PhD research with developing electronic cooling solutions for high performance systems. Before joining in imec, he worked as a researcher staff in Tsinghua University and Hong Kong University of Science and Technology, from 2011 until 2015, where he worked on advanced microelectronic packaging techniques. He received the “Imec excellence PhD award” in 2020, and “Belgium FWO Fellowship” in 2019. He also got the EPS / ECTC 2019 Student Travel Award (10 recipients) and  ITherm 2019 Student Travel Grant. His current research interests include impingement jet cooling and embedded microchannel cooling for high heat flux applications.