Tiwei Wei is currently an Assistant Professor of Mechanical Engineering at Purdue University. He was the postdoc research scholar at NanoHeat group at Stanford University between 2020 and 2022. He received his Ph.D. degree at the Interuniversity Microelectronics Centre (imec) and KU Leuven, Belgium in 2020. He joined imec in 2015, starting his Ph.D. research by developing electronic cooling solutions for 3D integration systems. Before joining imec, he worked as a researcher staff at Tsinghua University and Hong Kong University of Science and Technology, from 2011 until 2015, where he worked on advanced microelectronic packaging techniques. He received the “Imec excellence Ph.D. award” in 2020, and “Belgium FWO Fellowship” in 2019. He also got the EPS / ECTC 2019 Student Travel Award (10 recipients), IEEE ICEPT 2013 outstanding paper award, and  ITherm 2019 Student Travel Grant. His current research interests include advanced semiconductor packaging and efficient thermal management technologies.