Qianying Wu

Graduate Student


Qianying graduated with her Ph.D. in 2024 and a B.S with honors in Building Science from Tsinghua University in 2018. She studied heat and mass transfer in micro-nano scale and worked on high heat flux cooling with phase change in micro/nanostructures. Qianying was also a TomKat Center Graduate Fellow for Translational Research. Qianying loves sports, and especially enjoys being in the water.

Publications

  • Zhang, C., Wu, Q., Shattique, M., Seyedhassantehrani, N., Roy, S., Palko, J., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E, Giglio, R., Dede, E. M., Asheghi, M. "Heat flux micro coolers having multi-stepped features and fluid wicking". U.S. Patent No. 11,729,951. 15 Aug. 2023.
  • Zhang, C., Hazra, S., Wu, Q., Asheghi, M., Goodson, K. E., Dede, E., Palko, J., Narumanchi, S. “Hardmask to substrate pattern transfer method for Microfabrication of micro to mesoscale, high aspect ratio, multi-level, 3D Structures". US Patent App. 18/084,303, 2023
  • Dede, E. M., Zhang, C., Wu, Q., Seyedhassantehrani, N., Shattique, M., Roy, S., Palko, J. W., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E., Giglio, R., Asheghi, M. "Techno-economic feasibility analysis of an extreme heat flux micro-cooler". Iscience 26, no. 1 (2023).
  • Hazra, S., Zhang, C., Wu, Q., Asheghi, M., Goodson, K., Dede, E. M., Palko, J., Narumanchi, S.. "A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies". Scientific Reports 12.1 (2022): 12180.
  • Soroush, F., Liu, T., Wu, Q., Asheghi, M., Goodson, K. E., Marco, L., ... & Martin, R. (2021, October). Contact Angle Tuning of Copper Microporous Structures. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T07A010). American Society of Mechanical Engineers.
  • Soroush, F., Liu, T., Wu, Q., Zhang, C., Asheghi, M., Goodson, K. E., ... & Martin, R. (2021, October). A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T05A001). American Society of Mechanical Engineers.