Consulting Prof. Mehdi Asheghi

Consulting Prof. Mehdi Asheghi

PhD Graduate - University Faculty


Ph.D. ME 1999. Consulting Associate Professor, Mechanical Engineering Department, Stanford University. Prof. Asheghi teaches and performs research as a member of the consulting faculty in the thermosciences group. He is distinguished by breakthrough measurements of phonon transport in silicon layers and thermal phenomena in nano memory devices. His service to the heat transfer community includes technical program chair for ITHERM 2012.

Publications

  • Kwon, H., Giglio, R., Kong, D., Shattique, M. R., Lee, H., Palko, J. W., Dede, E. M., Asheghi, M., Goodson, K. E. “Capillary-driven two-phase cooler for high-heat-flux electronics using copper wire mesh manifold and enhanced copper inverse opal wick heat sink.” Applied Thermal Engineering 303, Part 1 (2026): 131914. https://doi.org/10.1016/j.applthermaleng.2026.131914
  • Anderson, J., Hazra, S., Asheghi, M., Goodson, K. E. “Capillary Transport Enhancement in Hybrid Micropillar Wicks Fabricated with UV-Laser Ablation.” ACS Applied Engineering Materials 4(6) (2026): 3168–3175. https://doi.org/10.1021/acsaenm.6c00335
  • Jiang, K., Kwon, H., Asheghi, M., Goodson, K. E. “Experimental Optimization of Liquid–Vapor Phase Separation in High Heat Flux Capillary-Driven μ-Coolers.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(9) (September 2026): 2046–2053. https://doi.org/10.1109/TCPMT.2026.3697351
  • Lin, Y., Liu, H., Min, L. G., Turner, W., Wilson, J., Cader, T., Asheghi, M., Gray, C. T., Goodson, K. E. “High-Fidelity Package-Level Conjugate Thermal-Flow Simulation for a Memory-on-Logic 3D System with Embedded Liquid-Cooling.” 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, pp. 1308–1315 (2026). https://doi.org/10.1109/ECTC51846.2026.00216
  • Lin, Y., Kwon, H., He, Y., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics.” ASME J. Electron. Packag. 148(2) (2026): 021001. https://doi.org/10.1115/1.4071139
  • Tang, C., Lin, Y., Chen, H., Chen, Y., Gupta, M. P., Degner, M., Asheghi, M., Goodson, K. E., Mantooth, H. A. “High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler.” 2026 IEEE Applied Power Electronics Conference and Exposition (APEC), San Antonio, TX, USA, March 22–26, 2026, pp. 1094–1097. https://doi.org/10.1109/APEC51134.2026.11517173
  • Min, L. G., Kwon, H., Asheghi, M., Goodson, K. E. “Visualization of Spatial Thermal Conductivity and Boundary Conductance in Diamond Microparticles.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(7) (July 2026): 1513–1525. https://doi.org/10.1109/TCPMT.2025.3646970
  • Min, L. G., Kwon, H., Vaziri, S., Bao, X., Asheghi, M., Goodson, K. E. “Thermal Management of Three-Dimensional Chips and Monolithic Integrated Circuits Using Phase Change Materials–Si/Cu Composites.” ASME J. Electron. Packag. 148(3) (2026): 031002. https://doi.org/10.1115/1.4070160
  • Vaziri, S., Huang, X., Hou, S., Datye, I. M., He, C., Ying, J. F., Wu, X., Hsu, C. F., Min, L. G., Kwon, H., Chen, S., Chiang, C., Woon, W. Y., Liao, S. S., Asheghi, M., Goodson, K. E., Pop, E., Wong, H.-S. P., Bao, X. Y. “Sub-micron AlN Films with High Thermal Conductivity and Electrical Resistivity for Efficient Heat Dissipation in 3D ICs.” 2025 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, December 6–10, 2025, pp. 1–4. https://doi.org/10.1109/IEDM50572.2025.11353773
  • Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Thermofluidic Visualization of the Capillary-Driven Boiling for Design Optimization of Silicon-Embedded Evaporators.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(7) (July 2026): 1499–1512. https://doi.org/10.1109/TCPMT.2025.3636077
  • Kong, D., Giglio, R., Shattique, M. R., Wu, Q., Kwon, H., Palko, J. W., Lee, H., Dede, E. M., Asheghi, M., Goodson, K. E. “Development of a capillary-driven two-phase microcooler using copper wiremesh 3D manifold and silicon micropin fin wicks.” International Journal of Mechanical Sciences 305 (2025): 110781. https://doi.org/10.1016/j.ijmecsci.2025.110781
  • Kong, D., Kwon, H., Lee, H., Lee, H., Asheghi, M., Goodson, K. E. “Computational Fluid Dynamics Modeling and Optimization of Large-Scale (3 cm × 3 cm) Silicon-Based Embedded Microchannels With Three-Dimensional Manifold Microcoolers.” ASME J. Electron. Packag. 147(4) (2025): 041105. https://doi.org/10.1115/1.4069319
  • Song, Y. S., Su, H., Lee, Y.-M., Han, Z., Bennett, R. K. A., Wang, M. A., Min, L. G., Asheghi, M., Goodson, K. E., Wang, S. X., Pop, E. “Investigation and Reduction of Thermal Resistance in Gate-All-Around Indium Tin Oxide Nanosheet Field-Effect Transistors.” 2025 Device Research Conference (DRC), Durham, NC, USA, June 22–25, 2025, pp. 1–2. https://doi.org/10.1109/DRC66027.2025.11105746
  • Kwon, H., Kong, D., Palko, J., Dede, E. M., Asheghi, M., Goodson, K. E. “Enhanced Capillary-Driven Boiling in Two-Phase Micro-cooler with Engineered Copper Inverse Opals (CIOs) Wick and Silicon 3D Manifold for High Heat Flux Cooling Application.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025.
  • Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Performance Characterization of Capillary-driven Thin-Film Boiling under Sub-Atmospheric (25-100 kPa) Environment.” 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235588
  • Coughlin, M.*, Clements, A.*, Wang, F.*, Min, L. G., Jiang, K., Kwon, H., Asheghi, M., Goodson, K. E. “Development of Liquid Metal and Silicon Pin Fin Composite Thermal Interface Materials.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235805 (*equal contribution)
  • Kong, D., Giglio, R., Zhang, C., Jiang, K., Palko, J. W., Lee, H., Asheghi, M., Goodson, K. E. “Comparison of Pumped vs. Capillary-driven Two-Phase Microcoolers for High Heat Flux Applications.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235580
  • Min, L. G., Kwon, H., Perez, C., Asheghi, M., Goodson, K. E. “Direct Visualization of Local Thermal Conductivity and Boundary Conductance of Diamond Particles.” 2025 24th IEEE ITherm, Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235652
  • Dede, E. M., Zhou, F., Zhou, Y., Lohan, D. J., Asheghi, M., Goodson, K. E., Erickson, K. “Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics.” ASME J. Electron. Packag. 147(2) (2025): 021009. https://doi.org/10.1115/1.4067649
  • Giglio, R., Shattique, M. R., Dede, E. M., Narumanchi, S., Asheghi, M., Goodson, K. E., Palko, J. W. “Porous mesh manifold for enhanced boiling performance.” Applied Thermal Engineering 260 (2025): 124918. https://doi.org/10.1016/j.applthermaleng.2024.124918
  • Lin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M., Asheghi , M., Mantooth, H. A., and Goodson, K. E. (September 20, 2023). "Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform." ASME. J. Electron. Packag. June 2024; 146(2): 021003. https://doi.org/10.1115/1.4062924
  • Lin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M. Asheghi, M., Mantooth, H. A., and Goodson, K. E., (June 7, 2023). "Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module." ASME. J. Electron. Packag. March 2024; 146(1): 011006. https://doi.org/10.1115/1.4062384