Chi Zhang

Dr. Chi Zhang

Research Associate and Post-Doctoral Scholar


Chi received her B.S. with honors in Mechanical Engineering with a focus on MEMS from Tsinghua University, Beijing, China in 2013, and received her Ph.D in Mechanical Engineering at Stanford in 2019. Her current research interests include the development and characterization of microporous structures for heat exchange. Chi is the recipient of Stanford School of Engineering Fellowship.

Publications

  • Zhang, C., Wu, Q., Shattique, M., Seyedhassantehrani, N., Roy, S., Palko, J., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E, Giglio, R., Dede, E. M., Asheghi, M. "Heat flux micro coolers having multi-stepped features and fluid wicking". U.S. Patent No. 11,729,951. 15 Aug. 2023.
  • Zhang, C., Hazra, S., Wu, Q., Asheghi, M., Goodson, K. E., Dede, E., Palko, J., Narumanchi, S. “Hardmask to substrate pattern transfer method for Microfabrication of micro to mesoscale, high aspect ratio, multi-level, 3D Structures". US Patent App. 18/084,303, 2023
  • Dede, E. M., Zhang, C., Wu, Q., Seyedhassantehrani, N., Shattique, M., Roy, S., Palko, J. W., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E., Giglio, R., Asheghi, M. "Techno-economic feasibility analysis of an extreme heat flux micro-cooler". Iscience 26, no. 1 (2023).
  • Hazra, S., Zhang, C., Wu, Q., Asheghi, M., Goodson, K., Dede, E. M., Palko, J., Narumanchi, S.. "A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies". Scientific Reports 12.1 (2022): 12180.
  • Zhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Goodson, K. E. (2021). Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications. International Journal of Heat and Mass Transfer, 173, 121241
  • Soroush, F., Liu, T., Wu, Q., Zhang, C., Asheghi, M., Goodson, K. E., ... & Martin, R. (2021, October). A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T05A001). American Society of Mechanical Engineers.