Yujui Lin


Yujui Lin is a Ph.D. student at Stanford Nanoheat Lab. He received his B.S. in Power Mechanical Engineering at National Tsing Hua University in 2019 and his M.S. in Mechanical Engineering at Stanford University in 2023. He was a visiting student researcher at UC Berkeley during his undergrad and worked as a research assistant at National Taiwan University before joining Stanford. His research interest includes heat transfer, electronics cooling, and MEMS. He is interested in the single-phase and two-phase microfluidics heatsink for high-power-density devices such as power electronics or server chips. On weekends, Yujui is an enthusiast for road cycling.

Publications

  • Lin, Y., Liu, H., Min, L. G., Turner, W., Wilson, J., Cader, T., Asheghi, M., Gray, C. T., Goodson, K. E. “High-Fidelity Package-Level Conjugate Thermal-Flow Simulation for a Memory-on-Logic 3D System with Embedded Liquid-Cooling.” 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, pp. 1308–1315 (2026). https://doi.org/10.1109/ECTC51846.2026.00216
  • Lin, Y., Kwon, H., He, Y., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics.” ASME J. Electron. Packag. 148(2) (2026): 021001. https://doi.org/10.1115/1.4071139
  • Tang, C., Lin, Y., Chen, H., Chen, Y., Gupta, M. P., Degner, M., Asheghi, M., Goodson, K. E., Mantooth, H. A. “High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-cooled Microcooler.” 2026 IEEE Applied Power Electronics Conference and Exposition (APEC), San Antonio, TX, USA, March 22–26, 2026, pp. 1094–1097. https://doi.org/10.1109/APEC51134.2026.11517173
  • Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Thermofluidic Visualization of the Capillary-Driven Boiling for Design Optimization of Silicon-Embedded Evaporators.” IEEE Transactions on Components, Packaging and Manufacturing Technology 16(7) (July 2026): 1499–1512. https://doi.org/10.1109/TCPMT.2025.3636077
  • Lin, Y., Kwon, H., Xiao, K., Gupta, M. P., Degner, M., Asheghi, M., Mantooth, H. A., Goodson, K. E. “Performance Characterization of Capillary-driven Thin-Film Boiling under Sub-Atmospheric (25-100 kPa) Environment.” 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Dallas, TX, USA, May 27–30, 2025. https://doi.org/10.1109/ITherm55376.2025.11235588
  • Lin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M., Asheghi , M., Mantooth, H. A., and Goodson, K. E. (September 20, 2023). "Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform." ASME. J. Electron. Packag. June 2024; 146(2): 021003. https://doi.org/10.1115/1.4062924
  • Lin, Y., Wei, T., Moy, W. J., Chen, H., Gupta, M. P., Degner, M. Asheghi, M., Mantooth, H. A., and Goodson, K. E., (June 7, 2023). "Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module." ASME. J. Electron. Packag. March 2024; 146(1): 011006. https://doi.org/10.1115/1.4062384