Zhang,C., Rong,G., Palko,J.W., Dusseault,T.J., Asheghi,M., Santiago,J.G., Goodson,K.E., “Tailoring of permeability in copper inverse opals for electronics cooling applications,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 – July 9, San Francisco, CA