Sverdrup, P.G., Kurabayashi, K., Ju, Y.S., Shieh, B.P., and Goodson, K.E., 1998, "Thermal Reliability Problems Posed by Novel Dielectrics," Proc. 15th International VLSI Multilevel Interconnection Conference (VMIC), Santa Clara, CA, June 16-18, VMIC Catalog No. 98 IMIC – 108, pp. 261-266.