Department of Mechanical Engineering

Stanford University

Principal Investigator

Kenneth E. Goodson

**Touzelbaev, M.N., Miler, J.,** Yang, Y., Refai-Ahmed, G., and Goodson, K.E., 2013, "High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices,"* Journal of Electronic Packaging*, Vol. 135, pp. 031001-1 to 031001-8.

Hotspot mitigation, thermal management paths, and thermomechanical degradation are key challenges for 3D integration, in particular due to the increased quantity and complexity of "thermally...

The development of high performance heat exchangers has enjoyed a long tradition of research at Stanford University dating back to the early work by Kays and London (Compact Heat Exchangers, 1958)...