Sood, A., Pop, E., Asheghi, M., Goodson, K.E., “The Heat Conduction Renaissance”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), May 29-June 1 2018, San Diego, CA
Katz, J. S., Barako, M. T., Park, W., Sood, A., Asheghi, M., & Goodson, K. E. (2018, May). Highly Anisotropic Thermal Conductivity in Spin-Cast Polystyrene Nano-Films. In 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 477-481). IEEE.
Yalon, E., Smithe, K.K.H., Aslan, O.B., McClellan, C.J., Xiong, F., Shin, Y.C., Sood, A., Suryavanshi, S.V., Xu, R., Neumann, C., Goodson, K.E., Heinz, T., Pop, E., “Characterization of the Thermal Boundary Conductance between MoS2 and SiO2 via In-Situ Raman Spectroscopy of FunctioningTransistors”, Materials Research Society (MRS) Spring Meeting, April 2017, Phoenix, AZ
Xiong, F., Yalon, E., McClellan, C.J., Sood, A., Zhang, J., Sun, J., Goodson, K.E., Cui, Y., Pop, E., “Probing Electrical and Thermal Properties in Electrochemically Li-Intercalated MoS2 Nanosheets with Raman Spectroscopy”, Materials Research Society (MRS) Spring Meeting, April 2017, Phoenix, AZ
Sood, A., Xiong, F., Wang, H., Cui, Y., Pop, E., Goodson, K.E., “Understanding and Tuning Heat Conduction in MoS2: Cross-Plane Diffusive-Ballistic Transport, and Dynamic Electrochemical Tuning of Thermal Conductivity by Li Intercalation”, Materials Research Society (MRS) Spring Meeting, April 2017, Phoenix, AZ
Bougher, T.L., Yates, L., Cheng, Z., Cheaito, R., Sood, A., Asheghi, M., Goodson, K.E., Cola, B.A., Graham, S., "Experimental Considerations of CVD Diamond Film Measurements using Time Domain Thermoreflectance", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), May 30-June 2 2017, Orlando, FL
Cheaito, R., Sood, A., Yates, L., Cheng, Z., Bougher, T.L., Asheghi, M., Graham, S., Goodson, K.E., "Thermal Conductivity Measurements on Suspended Diamond Membranes using Picosecond and Femtosecond Time-Domain Thermoreflectance", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), May 30-June 2 2017, Orlando, FL
Park, W., Ahn, E., Kodama, T., Park, J., Barako, M. T., Sohn, J., Cho, J., Kim, S., Marconnet, A. M., Asheghi, M., Sinclair, R., and Goodson, K. E., “Phonon Conduction in Silicon Nanobeam Labyrinths,” Scientific Reports, Vol. 7, article 6233.
Flader, I. B., Chen, Y., Shin, D. D., Heinz, D. B., Oritz, L. C., Alter, A. L., Park, W., Goodson, K.E., and Kenny, T.W., “Micro-ththering for In-process Stiction Mitigation of Highly Compliant Structures”, The 30th IEEE International Conference on Micro Electro Mechanical Systems, Jan. 22-26 2017, Las Vegas, NV
Katz, J. S., Lai, H., Teo, Y. C., Asheghi, M., Xia, Y., and Goodson, K. E., "Thermal Conduction in Novel Polymers", Semiconductor Research Corporation (SRC) Techcon, September 2017, Austin, TX