Soroush, F., Liu, T., Wu, Q., Asheghi, M., Goodson, K. E., Marco, L., … & Martin, R. (2021, October). Contact Angle Tuning of Copper Microporous Structures. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T07A010). American Society of Mechanical Engineers.
Soroush, F., Liu, T., Wu, Q., Zhang, C., Asheghi, M., Goodson, K. E., … & Martin, R. (2021, October). A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling. In International Electronic Packaging Technical Conference and Exhibition (Vol. 85505, p. V001T05A001). American Society of Mechanical Engineers.
Soroush, F., Jung, K. W., Iyengar, M., Malone, C., Asheghi, M., and K. Goodson, “Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silicon-based Thermal Management Devices,” 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, 2020, pp. 957-962.
Wu, Q, Zhang, C, Asheghi, M, & Goodson, K. “Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications.” Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK). .https://doi.org/10.1115/IPACK2020-2603.
Hazra, S., Piazza, A., Jung, K., Asheghi, M., Gupta M, Jih E, Degner M, Goodson K, Microfabrication Challenges for Silicon-based large area (>500 mm2) 3D-manifolded embedded micro-cooler devices for high heat flux removal, ITHERM 2020, Florida, USA.
Piazza, A.,Hazra, S., Jung, K., Gupta, M., Jih, E., Asheghi, M., Goodson, K.E., Considerations and Challenges for Large Area Embedded Micro-channels with 3D Manifold in High Heat Flux Power Electronics Applications, ITHERM 2020, Florida, USA.
Hazra, S., Liu, T., Asheghi, M., Goodson, K.E., Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure, Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2020, October 27-29, 2020.
Hazra, S., Singh, Y., Asheghi, M., Goodson, K.E., Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn EutecticChip Bonding for Packaging and Integration of Extreme Heat Flux Micro-coolers, Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2020 October 27-29, 2020.
Pallo, N., Kharangate, C., Modeer, T., Schaadt, J., Asheghi, M., Goodson, K.E., and Pilawa-Podgurski, R., “Modular Heat Sink for Chip Scale GaN Transistors in Multilevel Converters,” Proceedings of the Applied Power Electronics Conference, San Antonio, TX, March 4-8,
Sood, A., Pop, E., Asheghi, M., Goodson, K.E., “The Heat Conduction Renaissance”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), May 29-June 1 2018, San Diego, CA