Conference Papers

Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silicon-based Thermal Management Devices

Soroush, F., Jung, K. W., Iyengar, M., Malone, C., Asheghi, M., and K. Goodson, “Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silicon-based Thermal Management Devices,” 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, 2020, pp. 957-962, doi: 10.1109/ITherm45881.2020.9190368.

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Wu, Q, Zhang, C, Asheghi, M, & Goodson, K. “Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications.” Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK). .https://doi.org/10.1115/IPACK2020-2603.

Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn EutecticChip Bonding for Packaging and Integration of Extreme Heat Flux Micro-coolers

Hazra, S., Singh, Y., Asheghi, M., Goodson, K.E., Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn EutecticChip Bonding for Packaging and Integration of Extreme Heat Flux Micro-coolers, Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2020 October 27-29, 2020.