Dunham, M.T., Hendricks, T.J., and Goodson, K.E., 2019, “Thermoelectric Generators: A Case Study in Multi-Scale Thermal Engineering Design,” Advances in Heat Transfer, Vol. 51, Ch. 5, pp. 299-350, Elsevier, New York.
Cho, J., Li, Z., Asheghi, M., and Goodson, K. E., 2014, “Near-Junction Thermal Management: Thermal Conduction in Gallium Nitride Composite Substrates,” Annual Review of Heat Transfer, Vol. 18, 2016.
Bozorg-Grayeli, E., Reifenberg, J.P., Asheghi, M., Wong, H.-S. P., and Goodson, K.E., 2013, “Thermal Transport in Phase Change Memory Materials,” Annual Review of Heat Transfer, Vol. 16, pp. 397-428.
Hidrovo, C., Goodson, K.E., 2008, “Active Microfluidic Cooling of Integrated Circuits,” in Electrical, Optical, and Thermal Interconnections for 3D Integrated Systems, J. Meindl and M. Bakir, eds., Artech, Boston, pp. 293-330.
L. Zhang, Goodson, K.E., and Kenny, T.W., 2003, Book: "Silicon Microchannel Heat Sinks: Theories and Phenomena," Springer-Verlag Microtechnology and MEMS Series, ISBN 3-540-40181-4.
King, W.P., and Goodson, K.E., 2002, “Thermomechanical Formation and Thermal Imaging of Polymer Nanostructures” in Heat Transfer and Fluid Flow in Microscale and Nanoscale Devices, M. Faghri and B. Sunden, Eds., Southampton: WIT Press, pp. 131-171.
Goodson, K.E., 2000, "Thermal Conduction in Electronic Microstructures," in the Thermal Engineering Handbook, F. Kreith, ed., CRC Press, Boca Raton, Florida, pp. 4.458 – 4.504.
Ju, Y.S., and Goodson, 1999, Book: "Microscale Heat Conduction in Integrated Circuits and their Constituent Films," Kluwer Academic Publishers, Boston.
Goodson, K.E., Ju, Y.S., and Asheghi, M., 1998, "Thermal Phenomena in Semiconductor Devices and Interconnects," in Microscale Energy Transport, C.L. Tien et al., eds., Taylor & Francis, New York, NY, pp. 229-293.
Goodson, K.E., 1995, "Impact of CVD Diamond Layers on the Thermal Engineering of Electronic Systems," in the Annual Review of Heat Transfer, C.L. Tien, ed., Begell House, New York, NY, Vol. 6, pp. 323-353