Archive

Sponsors: Intel, SRC, MARCO IFC, Texas Instruments With the scaling of silicon nanotransistors into the deep submicrometer regime, a variety of compounding factors are increasing the temperature rise in the multilevel interconnect systems in modern VLSI circuits. These include increasing levels of metallization layers, which increase the thermal resistance to the high conductivity substrate, as […]

Sponsors: IBM, ONR Collaborators: IBM, Tom Kenny Group, Mechanical Engineering, Stanford High density data storage is one of the key challenges for next-generation computation. Data storage techniques that involve material displacement of motion are not subjected to the same fundamental limits as magnetic storage, and therefore offer truly exceptional possibilities for data density. Thermomechanical data […]

Sponsors: DOE-NSF Partnership on Thermoelectrics. Bosch Collaborators: University of South Florida, Bosch, Northrop Grumman Students: Dr. Michael Barako, Maneeshika Madduri, Prof. Saniya LeBlanc (George Washington), Jena Barnes, Srilakshmi Lingamneni A key to improving vehicle efficiency is recovering a fraction of the energy lost with the hot exhaust gases, and a promising strategy is to integrate [...]

Sponsors: NSF, Stanford University Students: Dr. Shilpi Roy Thermal transport and temperature distributions have a profound impact on the health, growth, modification, and diagnostics of cells and biological molecules including DNA. The vast majority of research in biochemistry and biomedicine has focused on these phenomena under carefully controlled - but spatially and temporally uniform - [...]

Sponsors: SRC, ONR, NSF, Intel, AMD As the silicon transistor is scaled to deep submicrometer gate lengths, the microprocessor thermal management challenge has been extended to nanoscale thermal conduction and coupled electron-phonon transport within and near the active regions of devices. The electron temperatures in modern silicon devices can exceed several thousand Kelvin, which results […]

Sponsors: ONR, SRC, NSF, IBM Heat conduction in polymer thin films and related deformation phenomena play a central role in modern manufacturing technologies, semiconductor processing, and data storage. Applications range from flexible electronics and organic light emitting devices to novel polymer-based biomedical components. Polymers have very low thermal conductivities, and typically govern the temperature differences […]

Sponsors: SRC, NSF, Intel, AMD Collaborators: Professor Simon Wong, Stanford Electrical Engineering The basic physics of phonon conduction in dielectrics and semiconductors has been the focus of research for more than a century. However, recent improvements in nanofabrication technologies have enabled new classes of experiments involving silicon films of near perfect crystalline quality. The MEMS […]

Sponsors: ONR, NSF, DOE, SRC, IFC/MARCO, AMD Thermal interface materials (TIMs) play a central role in the performance and reliability of electronic systems. They are the route for thermal conduction between semiconductor chips and metal heat spreaders, heat pipes, and heat sinks, and must withstand thermomechanical stresses due to thermal cycling. Particularly challenging TIM applications […]

Sponsors: ONR, Sandia National Laboratories Collaborators: John Eaton group, Stanford Mechanical Engineering Nanofluids contain a small volume fraction of nanoparicles, nanowires, or nanotubes for targeted changes in thermal, rheological and/or other properties. Prior to Stanford’s efforts in this research area, several research groups reported improvements in the thermal conductivity of nanofluids that far exceeded even […]

Sponsors: NSF, DOE Collaborators: Quate and Kino groups (Stanford EE / Applied Physics) High spatial resolution thermometry is important for a variety of applications including electronic circuits, biological and chemical microsystems and advanced photonic devices including lasers and radar. Infrared imaging is one of the most common thermometry methods for macroscale systems, but application to […]