Ken Goodson elected to National Academy of Engineering and National Academy of Inventors
NAE election is among the highest honors for engineers.NAI recognizes inventions of societal benefit.NAE citation: “for developments in microprocessor thermal management and nanoscale heat conduction.” news highlight
Nanoheat Alumni win NSF CAREER Awards!
Congrats to Saniya Leblanc (George Washington University) and Damena Agonafer (Washington University in St. Louis) for their 2019 awards, and to Yoonjin Won (UC Irvine) in 2018, all with great ideas for research, education, and outreach. Saniya’s research will be on additive manufacturing for thermoelectric applications, and Damena and Yoonjin are exploring aspects of phase […]
ARPA-E collaboration launches with UC Merced, NREL, and Toyota
Extreme two-phase heat sinking for data centers and power electronics, exploring the limits of convective cooling for two of the toughest applications facing society. Project Title: Exploring the Limits of Cooling for Extreme Heat Flux Applications: Data Centers and Power Electronics. Collaborators: Prof. Joe Palko, UC Merced, Dr. Sreekant Narumanchi, NREL, and Dr. Eric Dede, […]
National Academy of Inventors (NAI)
Ken was elected to the 2019 class of Fellows for inventions and contributions to society, induction ceremony in April.
Solid-state electrothermal transistor
Just out in Nature Communications: strong heatflow modulation through lithium intercalation in MoS2, in-situ scanning TDTR captures the transient physics. Stanford press
Diamond grain boundary thermal imaging
Aditya’s Nano Letter unveils defect physics with novel scanning TDTR, wins best poster award at Electronic Materials Symposium http://www.electronicmaterialssymposium.org/home nanotechweb Nano Letter just out electronic materials symposium
Inaugural Richard Chu Achievement award
Ken Goodson will be recognized at ITHERM 2018 for contributions to electronics thermal management and will deliver a luncheon plenary entitled “The Heat Conduction Renaissance” this coming June. Kenneth Goodson receives the Inaugural Richard Chu ITherm Award The mechanical engineering department chair has been recognized for his significant contributions to thermal management in electronic systems […]
IEEE Spectrum features our heat sink surface engineering
Retaining liquids that wet the material surface is a big challenge, we’ve developed a strategy based on nanostructuring. Retaining liquids that wet nanostructured interfaces is a big challenge, Damena and collaborators have shown the route forward. J. Colloid Science & Technology is featuring our article with a cover image, and there is some nice press […]
Best Poster at IEEE Power Electronics Conference
Chirag & Joe led a novel heat sink design for GaN power electronics and co-authored the best poster at the Applied Power Electronics Conf. in San Antonio TX Here is the full reference for the poster, which is collaborative with the Pilawa group at UIUC: N. Pallo, C. Kharangate, T. Modeer, J. Schaadt, M. Asheghi, […]
Record setting heat sink:Diamond + inverse opals
Advanced Functional Materials just published our 5 year DARPA effort link to the paper
Damena Agonafer et al. featured on cover of JCIS
Our paper on dielectric phase separation in the Journal of Colloid and Interface Science Damena led our efforts on dielectric phase separation the nanoheat paper is just out and getting great attention. Well done! link to publication
Tanya Liu’s “perfect pitch” at the NSF ERC Center Meeting
Well done! Tanya Liu placed 3rd at the NSF Engineering Research Center Biennial Review by “perfectly pitching” her phase change spreaders with relevance for electric vehicle range. This competition involves a 90-second pitch, with only 1 slide and no props and is conducted in front of the entire Biennial Meeting audience. The winners of each […]