Patents

Current and former lab members are listed in bold.

2013

32.

US Patent 8,389,119. Issued 2013, "Composite Thermal Interface Material including Aligned Nanofiber with Low Melting Temperature Binder,"  Panzer, M., Goodson K.E., Hu, Xuejiao, Mann, D.

2010

31.

US Patent 7,806,168. Issued 2010, "Optimal Spreader System, Device and Method for Fluid Cooled Micro-Scaled Heat Exchange," G. Upadhya, R. Herms, P. Zhou, K. E. Goodson, J. Hom

2009

30.

US Patent 7,591,302. Issued 2009, "Pump and Fan Control Concepts in a Cooling System," D. Lenehan, K.E. Goodson, T.W. Kenny, M. Munch, S. Sahu.

29.

US Patent 7,504,453. Issued 2009. "Composite Thermal Interface Material Including Particles and Nanofibers," X. Hu, L. Jiang, K. E. Goodson.

2008

28.

US Patent 7,402,029. Issued 2008. "Remedies to Prevent Cracking in a Liquid System," M. Munch, K. Goodson, D. Corbin, S. Zheng, T. Kenny, G. Shook.

27.

US Patent 7,344,363. Issued 2008. "Remedies to Prevent Cracking in a Liquid System," M. Munch, K. Goodson, D. Corbin, S. Zheng, T. Kenny, G. Shook.

26.

US Patent 7,334,630. Issued 2008. "Closed Loop Microchannel Cooling System," K.E. Goodson, C.H. Chen, D. E. Huber, L. Jiang, T. W. Kenny, J. M. Koo, D. L. Laser, J. C. Mikkelsen, J. G. Santiago, E. N. Wang, S. Zeng, L. Zhang.

25.

US Patent 7,316,543. Issued 2008. "Electroosmotic micropump with planar features," K. E. Goodson, T.W. Kenny, Juan G. Santiago, D.J. Laser, C.-H. Chen.

2007

24.

US Patent 7,278,549. Issued 2007. "Remedies to Prevent Cracking in a Liquid System," M. Munch, K. Goodson, D. Corbin, S. Zheng, T. Kenny, G. Shook.

23.

US Patent 7,201,214. Issued 2007. "Remedies to Prevent Cracking in a Liquid System," M. Munch, K. Goodson, D. Corbin, S. Zheng, T. Kenny, G. Shook.

22.

US Patent 7,201,012. Issued 2007. "Remedies to Prevent Cracking in a Liquid System," M. Munch, K. Goodson, D. Corbin, S. Zheng, T. Kenny, G. Shook.

21.

US Patent 7,185,697. Issued 2007. "Electroosmotic Microchannel Cooling System," K.E. Goodson, C.H. Chen, D. E. Huber, L. Jiang, T. W. Kenny, J. M. Koo, D. L. Laser, J. C. Mikkelsen, J. G. Santiago, E. N. Wang, S. Zeng, L. Zhang.

2006

20.

US Patent 7,131,486. Issued 2006. "Electroosmotic Microchannel Cooling System," K.E. Goodson, C.H. Chen, D. E. Huber, L. Jiang, T. W. Kenny, J. M. Koo, D. L. Laser, J. C. Mikkelsen, J. G. Santiago, E. N. Wang, S. Zeng, L. Zhang.

19.

US Patent 7,104,312. Issued 2006. "Method and Apparatus for Achieving Temperature Uniformity and Hot Spot Cooling in a Heat Producing Device," K. E. Goodson, T. W. Kenny, P. Zhou, G. Upadhya, M. Munch, M. McMaster, J. Hom.

18.

US Patent 7,090,001. Issued 2006. "Optimized Multiple Heat Pipe block for Electronics Cooling," P. Zhou, D. van der Heide, and K. Goodson.

17.

US Patent 7,077,634. Issued 2006. "Remedies to Prevent Cracking in a Liquid System," M. Munch, K. Goodson, D. Corbin, S. Zheng, T. Kenny, G. Shook.

16.

US Patent 7,061,104. Issued 2006. "Apparatus for Conditioning Power and Managing Thermal Energy in an Electronic Device," T. Kenny, K. E. Goodson, J. G. Santiago, G. C. Everett.

15.

US Patent 7,050,306. Issued 2006. "Power Conditioning Module," T. Kenny, K. E. Goodson, J. G. Santiago, G. C. Everett.

14.

US Patent 7,019,972. Issued 2006. "Apparatus for Conditioning Power and Managing Thermal Energy in an Electronic Device," T. Kenny, K. E. Goodson, J. G. Santiago, G. C. Everett.

13.

US Patent 7,000,684. Issued 2006. "Method and Apparatus for Efficient Vertical Fluid Delivery for Cooling a Heat-Producing Device," T. Kenny, M. Munch, P. Zhou, J. Shook, K. Goodson, D. Corbin, M. McMaster, J. Lovette

12.

US Patent 6,994,151. Issued 2006. "Vapor Escape Microchannel Heat Exchanger," P. Zhou, K. E. Goodson, T. Kenny, J. Santiago.

11.

US Patent 6,991,024. Issued 2006. "Electroosmotic Microchannel Cooling System," K.E. Goodson, C.H. Chen, D. E. Huber, L. Jiang, T. W. Kenny, J. M. Koo, D. L. Laser, J. C. Mikkelsen, J. G. Santiago, E. N. Wang, S. Zeng, L. Zhang.

10.

US Patent 6,988,535. Issued 2006. "Channeled flat plate fin heat exchange system, device and method," G. Upadhya, R. Herms, P. Zhou, K. E. Goodson.

9.

US Patent 6,988,534. Issued 2006. "Method and Apparatus for Flexible Fluid Delivery for Cooling Desired Hot Spots in a Heat Producing Device," T. Kenny, J.G. Shook, D. Corbin, M. Munch, K. E. Goodson.

8.

US Patent 6,986,382. Issued 2006. "Interwoven Manifolds for Pressure Drop Reduction in Microchannel Heat Exchangers," G. Upadhya, M. Munch, P. Zhou, G. Shook, T. Kenny, K. Goodson, D. Corbin.

2005

7.

US Patent 6,942,018. Issued 2005. "Electroosmotic Microchannel Cooling System", K.E. Goodson, D.E. Huber, L. Jiang, T.W. Kenny, J-M Koo, J.C. Mikkelsen, J.G. Santiago, E. Wang, S. Zheng, L. Zhang, D. Laser, H. Chen.

6.

US Patent 6,881,039. Issued 2005. "Microfabricated Electrokinetic Pump," D. Corbin, K.E. Goodson, T.W. Kenny, J.G. Santiago, S. Zeng.

5.

US Patent 6,882,543. Issued 2005. "Apparatus for Conditioning Power and Managing Thermal Energy in an Electronic Device," T.W. Kenny, K.E. Goodson J. Santiago, and C. Everett.

2004

4.

US Patent 6,881,039. Issued 2004. "Microfabricated Electrokinetic Pump," D. Corbin, K. Goodson, T. Kenny, J. Santiago, and S. Zheng.

3.

US Patent 6,678,168. Issued 2004. "System Including Power Conditioning Module," T.W. Kenny, K.E. Goodson, J.G. Santiago, C. K, Everett, R. Chaplinsky, and J. Kim.

2003

2.

US Patent 6,606,251. Issued 2003. "Power Conditioning Module," T.W. Kenny, K.E. Goodson, J.G. Santiago, and G. C. Everett.

1998

1.

US Patent 5,843,224. Issued 1998. "Composite structure comprising a semiconductor layer arranged on a diamond or diamond-like layer and process for its production," R. Zachai, T. Gutheit, K.E. Goodson.