Conference Papers

Links and PDFs are provided below only within fair use. We assume you have proper copyright permissions to access and they are supplied as a convenience only.

Current and former lab members are listed in bold.

2015

230.

Won, Y., Lee, H., Barako, M. T., Jung, K-W, Zhang, C., Dusseault, T., Houshmand, F., Palko, J. W., Agonafer, D., Asheghi, M., Santiago, J. G.,  Goodson, K. E., “Structure Dependent Wettability on Copper Inverse Opals”, 9th International Conference on Boiling and Condensation Heat Transfer,  2015,  April 26-29, Boulder, CO
 

229.

Palko, J. W., Houshmand, F., Wilbur, J., Zhang, C., Dusseault, T., Won, Y., Lee, H., Barako, M., Agonafer, D., Jung, K-W, Asheghi, M.,  Santiago, J. G.,  Goodson, K. E., "Capillary Fed Two Phase Cooling Beyond 1kW/cm2 in Short Wicking Length, Joule‐Heated, Microporous Copper Layers," 9th International Conference on Boiling and Condensation Heat Transfer, 2015,  April 26-29, Boulder, CO

228.

Palko, J. W., Dusseault, T., Zhang, C., Wilbur, J., Ashegi, M., Goodson, K. E., Santiago, J. G.,  "Localized, High Heat Flux, Two Phase Cooling Using Capillary Fed Porous Structures," ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 - July 9, San Francisco, CA

Download PDF
227.

Won, Y., Sood, A., Katz, J., Asheghi, M., Li, Y., Owen, G., Zhu, M., Goodson, K.E., "Thermal Management of QCL Devices & Packaging", ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 - July 9, San Francisco, CA

 

Download PDF
226.

Gorle, C., Lee, H., Houshmand, F., Asheghi, M., Goodson, K.E., Parida, P.R., "Validation study for VOF simulations of boiling in a microchannel," ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 - July 9, San Francisco, CA

Download PDF
225.

Scholl, S., Gorle, C., Houshmand, F., Asheghi, M., Goodson, K.E., Verstraete, T., "Numerical optimization of advanced monolithic microcoolers for high heat flux microelectronics," ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 - July 9, San Francisco, CA
 

Download PDF
224.

Scholl, S., Gorle, C., Houshmand, F., Liu, T.,  Lee, H., Won, Y., Asheghi, M., Goodson, K.E., Kazemi, H., "Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics," ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 - July 9, San Francisco, CA
 

223.

Cho, J.Sood, A., Hayee, F., Asheghi, M., Goodson, K.E., "Thermal Characterization of Nanocrystalline Diamond Films on Silicon", ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 - July 9, San Francisco, CA.

 

Download PDF
222.

Houshmand, F., Lee, H., Asheghi, M., Goodson, K.E., "High heat flux subcooled flow boiling of methanol in microtubes," ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 - July 9, San Francisco, CA

Download PDF
221.

Zhang,C., Rong,G., Palko,J.W., Dusseault,T.J., Asheghi,M., Santiago,J.G., Goodson,K.E., "Tailoring of permeability in copper inverse opals for electronics cooling applications," ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 - July 9, San Francisco, CA

Download PDF
220.

Lee, H., Won, Y., Houshmand, F., Gorle, C., Asheghi, M., Goodson, K.E., "Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT", ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 - July 9, San Francisco, CA

Download PDF
219.

Liu, T., Houshmand, F., Gorle, C., Scholl, S., Lee, H., Won, Y., Kazemi, H., Vanhille, K., Asheghi, M., Goodson, K.E.,  "Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density GaN-SiC chip", ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2015, July 6 - July 9, San Francisco, CA

218.

Barako, M.T., Roy-Panzer, S., Kodama, T., Asheghi, M., Goodson, K.E., "Thermal Conduction in Vertically-Aligned Copper Nanowire Arrays," Materials Research Society (MRS) Spring Meeting, April 6-10, 2015, San Francisco, CA

2014

Download PDF
217.

Agonafer, D.D., Palko, J., Won, Y., Lopez, K., Dusseault, T.J., Gires, J., Asheghi, M., Santiago, J.G., Goodson, K.E., "Progress on Phase Separation Microfluidics”, Compound Semiconductor Integrated Circuit Symposium (CSICS), 2014, IEEE, Oct 20-21, La Jolla, CA, USA.

Download PDF
216.

Cho, J., Won, Y., Francis, D., Asheghi, M., and Goodson, K.E., "Thermal Interface Resistance Measurements for GaN-on-Diamond Composite Substrates," IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) 2014, Oct. 19-22, La Jolla, CA, USA.

Download PDF
215.

Tyhach, M., Altman, D., Bernstein, S., Korenstein, R., Cho, J., Goodson, K.E., Francis, D., Faili, F., Ejeckam, F., Kim, S., and Graham, S., "S2-T3: Next generation gallium nitride HEMTs enabled by diamond substrates," IEEE Lester Eastman Conference on High Performance Devices (LEC) 2014, Aug. 5-7, Ithaca, NY, USA.

Download PDF
214.

Won, Y., Barako, M., Agonafer, D. A., Asheghi, M., Goodson, K. E., “Mechanical Properties of Nanostructured Porous Layers for Two-Phase Convection Enhancement”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 - 30, Orlando, FL, USA.

Download PDF
213.

Agonafer, D.A., Lopez, K., Won, Y., Palko, J., Asheghi, M., Santiago, J.G., Goodson, K.E., "Phase-Separation of Wetting Fluids Using Nanoporous Alumina Membranes and Micro-GLASS Capillaries," IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 - 30, Orlando, FL, USA.

Download PDF
212.

Cho, J., Chu, K.K., Chao, P.C., McGray, C., Asheghi, M., and Goodson, K.E., "Thermal Conduction Normal to Thin Silicon Nitride Films on Diamond and GaN", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 - 30, Orlando, FL, USA.

Download PDF
211.

Park, W., Marconnet, A. M., Kodama, T., Park, J., Sinclair, R.,  Asheghi, M.Goodson, K.E., "Phonon Thermal Conduction in Periodically Porous Silicon Nanobeams", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 - 30, Orlando, FL, USA.

Download PDF
210.

Sood, A., Cho, J., Hobart, K.D., Feygelson, T., Pate, B., Asheghi, M.Goodson, K.E., "Anisotropic and Nonhomogeneous Thermal Conduction in 1 µm Thick CVD Diamond", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 - 30, Orlando, FL, USA.

Download PDF
209.

Sood, A., Eryilmaz, S.B., Jeyasingh, R., Cho, J., Asheghi, M., Wong, -H.S.P, Goodson, K.E., "Thermal Characterization of Nanostructured Superlattices of TiN/TaN: Applications as Electrodes in Phase Change Memory" IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 - 30, Orlando, FL, USA.

Download PDF
208.

Lingamneni, S., Asheghi, M., and Goodson, K.E., "A Parametric Study of Microporous Metal Matrix-Phase Change Material Composite Heat Spreaders for Transient Thermal Applications," IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 - 30, Orlando, FL, USA.

Download PDF
207.

Guzman, P.A.V., Sood, A., Mleczko, M.J., Wang, B., Wong, -H.S.P., Nishi, Y., Asheghi, M., Goodson, K.E., "Cross Plane Thermal Conductance of Graphene-Metal Interfaces," IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 - 30, Orlando, FL, USA.

Download PDF
206.

Barako, M.T., Weisse, J.M., Roy, S., Kodama, T.,Dusseault, T.J., Motoyama, M., Asheghi, M., Prinz, F.B., Zheng, X., and Goodson, K.E., "Thermal Conduction in Nanoporous Copper Inverse Opal Films," IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 - 30, Orlando, FL, USA.

Download PDF
205.

T.J. Dusseault, J. Gires, M.T. Barako, Y. Won, D.D. Agonafer, M. Asheghi, J.G. Santiago, K.E. Goodson, "Inverse Opals for Fluid Delivery in Electronics Cooling Systems," IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 - 30, Orlando, FL, USA.

213.

Dunham, M. T., Lorenzi, B., Sood, A., Tonini, R., Ottaviani, G., Asheghi, M., Narducci, D., and Goodson, K. E., "Impact of nanovoids on the thermal conductivity of heavily-doped nanosilicon thin films," ASME International Mechanical Engineering Congress and Exposition (IMECE) 2014, November 14-20, Montreal, Canada.

2013

Download PDF
204.

S. Roy, T. Kodama, S. Lingamneni, M. A. Panzer, M. Asheghi, and K. E. Goodson, "Toward Thermal Characterization of Pico-Liter Volumes Using the 3omega Method," ASME International Mechanical Engineering Congress and Exposition (IMECE) 2013, November 15-21, San Diego, CA.

Download PDF
203.

Lingamneni, S., Marconnet, A. M., and Goodson, K. E., "3D Packaging Materials based on Graphite Nanoplatelet and Aluminum Nitride Nanocomposites," ASME International Mechanical Engineering Congress and Exposition (IMECE) 2013, November 15-21, San Diego, CA.

202.

Cho, J., Chao, P.C., Asheghi, M., and Goodson, K.E., "Phonon Conduction Normal to Polysilicon Films on Diamond," ASME 4th Micro/Nanoscale Heat & Mass Transfer (MNHMT) International Conference 2013, Dec. 11-14, Hong Kong, China.

Download PDF
201.

Won, Y.*, Cho, J.*, Agonafer, D., Asheghi, M., and Goodson, K.E., "Cooling Limits to GaN HEMT Technology," IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) 2013, Oct. 13-16, Monterey, CA, USA.

200.

Cho, J., Kodama, T., Ishiwata, H., Dahl, J., Melosh, N., Shen, Z.-X., and Goodson, K.E., "Thermal Conductance in Diamondoid Self-assembled Monolayers", Materials Research Society (MRS) Spring Meeting, April 1-5, San Francisco, CA

199.

Cho, J., Li, Z., Asheghi, M., and Goodson, K.E., "Phonon-Defect Scattering and the Thermal Resistance of the Transition Layers for GaN Heteroepitaxy", Materials Research Society (MRS) Spring Meeting, April 1-5, San Francisco, CA

198.

Sood, A., Rowlette, J., Asheghi, M., Goodson, K.E., "Thermal Conduction in Aperiodic Superlattices for Quantum Cascade Lasers", Materials Research Society (MRS) Spring Meeting, April 1-5, San Francisco, CA

197.

M.T. Dunham, M.T. BarakoS. LeBlanc, M. Asheghi, B. Chen, K.E. Goodson, "Modeling and optimization of small thermoelectric generators for low-power electronics," ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2013, July 16 - July 18, Burlingame, CA

2012

Download PDF
196.

A.M. Marconnet, M. Motoyama, M.T. Barako, Y. Gao, S. Pozder, B. Fowler, K. Ramakrishna, G. Mortland, M. Asheghi, K.E. Goodson, "Nanoscale Conformable Coatings for Enhanced Thermal Conduction of Carbon Nanotube Films," IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 - June 1, San Dego, CA

Download PDF
195.

Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K.E., “Thermal Characterization of GaN-on-Diamond Substrates for HEMT Applications,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 - June 1, San Dego, CA

Download PDF
194.

Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Altman, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K.E., “Thermal Characterization of Composite GaN Substrates for HEMT Applications,” Government Microcircuit Applications & Ctritical Technology (GomacTech) Conferfence 2012, March 18-20, Las Vegas, Nevada 

Download PDF
193.

Hom, L., Durieux, A., Miler, J., Asheghi, M., Ramani, K., Goodson, K.E. "Calibration Methodology for Interposing Liquid Coolants for Infrared Thermography of Microprocessors". IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 - June 1, San Diego, CA

Download PDF
192.

T. Kodama, W. Park, A. Marconnet, J. Lee, M. Asheghi, K. E. Goodson, 2012, "In-plane thermal conductivity measurement on nanoscale conductive materials with on-substrate device configurations",  IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 - June 1, San Diego, CA

Download PDF
191.

Park, W., Barako, M.T.Marconnet, A.M.Asheghi, M., and Goodson, K.E. "Effect of Thermal Cycling  on Commercial Thermoelectric Modules". IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 - June 1, San Diego, CA

 

 

190.

Li, Z., Tan, S., Kodama, T., Bozorg-Grayeli, E., Asheghi, M., Goodson, K.E., “Electron-Phonon Coupled Two-Dimensional Heat Transfer in Nanoscale Metal/Dielectric Multilayers,” Proceedings of the ASME Summer Heat Transfer Conference, 2012, July 8-12, Rio Grande, Puerto Rico 

Download PDF
189.

Barako, M.T., Gao, Y., Marconnet, A.M., Asheghi, M., Goodson, K.E. "Solder-Bonded Carbon Nanotube Thermal Interface Materials." IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 - June 1, San Diego, CA.

Download PDF
188.

Aminfar, A., Bozorg-Grayeli, E., Asheghi, M., and Goodson, K.E., "Analysis of HEMT Multilayered Structures Using a 2D Finite Volume Model", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 - June 1, San Diego, CA

Download PDF
187.

Bozorg-Grayeli, E., Li, Z., Gambin, V., Asheghi, M., and Goodson, K.E., "Thermal Conductivity, Anisotropy, and Interface Resistances of Diamond on Poly-AlN", IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May i30 - June 1, San Dego, CA

Download PDF
186.

Barako, M.T., Park, W., Marconnet, A.M., Asheghi, M., and Goodson, K.E. "A Reliability Study with Infrared Imaging of Thermoelectric Modules under Thermal Cycling". IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2012, May 30 - June 1, San Diego, CA

2010

Download PDF
185.

Bozorg-Grayeli, E.; Reifenberg, J.P.; Chang, K.W.; Panzer, M.; Goodson, K.E.; , "Thermal conductivity and boundary resistance measurements of GeSbTe and electrode materials using nanosecond thermoreflectance," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on , vol., no., pp.1-7, 2-5 June 2010 doi: 10.1109/ITHERM.2010.5501263

184.

Miler, J., Refai-Ahmed, G., Touzelbaev, M., David, M., Steinbrenner, J., Goodson, K., "Reduced-Order Fluidic Model for Flow Instabilities in Two-Phase Microfluidic Heat Exchangers," Proceedings of the 8th International Conference on Nanochannels, Microchannels, and Minichannels, FEDSM-ICNMM2010-30878, Montreal, Quebec, Canada., 2010.

183.

Parikh, S., Chen, H., Goodson, K., Sheppard, S., 2010, "Engagement in an Undergraduate Heat Transfer Course Outside of the Classroom," In Proceedings, American Society for Engineering Education Annual Conference. June 20-23, Louisville, Kentucky.

182.

SangBum Kim, Byoungil Lee, Mehdi Asheghi, G.A.M. Hurkx, John Reifenberg, Kenneth Goodson, and H.-S. Philip Wong, "Thermal Disturbance and its Impact on Reliability of Phase-Change Memory Studied by Micro-thermal Stage," accepted for presentation to IEEE International Reliability Physics Symposium (IRPS), Anaheim, CA, May 2-6, 2010.

181.

E. Bozorg-Grayeli, J. P. Reifenberg, K. W. Chang, M. Panzer, and K. E. Goodson, "Thermal Conductivity and Boundary Resistance Measurements of GeSbTe and Electrode Materials Using Nanosecond Thermoreflectance", to be appear in the Proceedings of ITHERM, Las Vegas, Nevada, June, 2010.

180.

J. Lee, J.P. Reifenberg, E. Elah Bozorg-Grayeli, L. Hom, Z. Li, M. Asheghi, H.S.P. Wong, K.E. Goodson, "Decoupled Thermal Resistances of Phase Change Material and Their Impact on PCM Devices," to be appear in the Proceedings of ITHERM, Las Vegas, Nevada, June, 2010.

2009

179.

Patricia E. Gharagozloo, Kenneth E. Goodson. "Heat Conduction, Aggregation and Thermal Diffusion in Stationary Nanofluids," International Nanofluid Property Benchmark Exercise: Nanofluids Workshop, January 29-30, 2009, Beverly Hills, CA.

178.

Patricia E. Gharagozloo, Kenneth E. Goodson. "Impact of Aggregation and Diffusion on Nanofluid Thermal Conductivity," ECI, Associations in Solution II: Structure, Function, and Performance, July 26-30, 2009 Tomar, Portugal.

177.

A. Rogacs, J. E. Steinbrenner, X. L. Zheng, K. E. Goodson, "Characterization of the Wettability of Nanostructured Porous Films," Proceedings of the NIST Seventeenth Symposium on Thermophysical Properties, Boulder, CO, USA, June 2009.

176.

Y. Gao, A. Marconnet, M. Panzer, S. LeBlanc, S. Dogbe, Y. Ezzahri, A. Shakouri, and K.E. Goodson, 2009, "Nanostructured Interfaces for Thermoelectrics," in Proc. 28th Int. Conf. on Thermoelectrics, Freiburg, Germany, July 26-30.

175.

Miler, J., Flynn, R.D., Refa-Ahmed, G., Touzelbaev, M., David, M.P., Steinbrenner, J., Goodson, K.E., "Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers," in Proceedings of the ASME 2009 Integration of Electronic and Photonic Systems, MEMS, and NEMS Conference (InterPACK), San Francisco, 2009.

174.

Y. Won, J. Lee, E.N. Wang, K.E. Goodson, T.W. Kenny, "An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device" in ASME InterPACK '09, San Francisco, CA, USA, 2009.

173.

Y. Won, D. Milnes, E.N.Wang, K.E.Goodson, T.W.Kenny , "3-D Visualization of Flow in Microscale Jet Impingement Cooling System" in ASME 7th International Conference on Nanochannels, Microchannels and Minichannels (ICNMM) '09, Pohang, South Korea, 2009.

172.

E. Bozorg-Grayeli, C. Fang, A. Rogacs, and K. E. Goodson, "Computational Modeling of Vapor Chambers with Nanostructured Wicks," in Proceedings of the ASME 2009 Heat Transfer Summer Conference, San Francisco, 2009.

171.

J. Lee, J. Reifenberg, Z. Li, L. Hom, M. Asheghi, S. Kim, H.-S. P. Wong, K.E. Goodson. "Measurement of Anisotropy in the Thermal Conductivity of Ge2Sb2Te5 Films," presented at the 10th Non-Volatile Memory Technology Symposium, October 2009, Portland, Oregon.

2008

170.

Reifenberg, J.P., Gupta, H., Asheghi, M., and Goodson, K.E., 2008, "Closed Form Thermal Analysis of Phase Change Memory Devices," Proceedings of ECI Heat Transfer in Microscale, September 22-16, Whistler, British Columbia, Canada.

Download PDF
169.

Marconnet, A.M., David, M.P., Rogacs, A., Flynn, R.D., and Goodson, K.E., 2008, "Temperature-Dependent Permeability of Microporous Membranes for Vapor Venting Heat Exchangers," Proceedings of IMECE2008, October 31-November 6, Boston, Massachusetts, USA.

168.

LeBlanc, S., Marconnet, A., Steinbrenner, J., David, M., Panzer, M., Rogacs, A., Gao, Y., Miler, J., Goodson, K., 2008, "Characterization of Nanostructured Materials," Micro/Nano Poster Forum, IMECE2008, October 31-November 6, Boston, Massachusetts, USA.

167.

LeBlanc, S., Gao, Y., Goodson, K., 2008, "Thermoelectric Heat Recovery from a Tankless Water Heating System," Proceedings of IMECE 2008, October 31-November 6, Boston, Massachusetts, USA.

166.

Steinbrenner, J.E., Lee, E.S., Wang, F.M., Fang, C., Hidrovo, C., Goodson, K.E., 2008, "Flow Regime Evolution in Long Serpentine Microchannels with a Porous Carbon Paper Wall," Proceedings of IMECE2008, October 31-November 6, Boston Massachusetts, USA.

165.

S. A. Chandorkar, M. Agarwal, R. Melamud, R. N. Candler, K. E. Goodson, and T. W. Kenny, "Limits of Quality Factor in Bulk-Mode Micromechanical Resonators," Proceedings of MEMS 2008.

164.

Reifenberg, J.P., and Goodson, K.E., 2008, "Electrothermal Transport Phenomena in Phase Change Memory Devices," Sixth US-Japan Joint Seminar on Nanoscale Transport Phenomena - Science and Engineering, July 13-16, Boston, MA.

163.

Warren, R.H., Reifenberg, J.P., and Goodson, K.E., 2008, "Compact Thermal Model for Phase Change Memory Nanodevices," Proceedings of ITHERM, May 28-31, Orlando, FL.

2007

162.

Milnes, D., Khurana, T., Hidrovo, C., Pruitt, B.L., and Goodson, K.E., 2007, "Vapor-Venting, Micromachined Heat Exchanger for Electronics Cooling," Proceedings of the ASME IMECE, Seattle, Washington.

161.

Gharagozloo, P.E., Eaton, J.K , Goodson, K.E., 2007, "Heat Conduction and Thermal Diffusion in Stationary Nanofluids," Proceedings of ECI, Nanofluids: Fundamentals and Applications, September 16-20, Copper Mountain, Colorado, USA.

160.

Pettes, A., R. Melamud, S. Higuchi, and K. Goodson, "Impact of Contact Resistances on Dimensional Scaling of Thermoelectric Energy Conversion Devices," Proceedings of the 26th International Conference on Thermoelectrics, Jeju Island, South Korea, pp. 283-289, 2007.

159.

Kodama, T., Jain, A., Goodson, K.E., 2007, "Nonmetallic conduction property of a DNA templated Gold Nanowire," Proceedings of IPACK2007, July 8-12, Vancouver, British Columbia, Canada.

158.

Gharagozloo, P.E., Eaton, J.K., and Goodson, K.E., 2007, "Impact of Thermodiffusion on Temperature Fields in Stationary Nanofluids," Proceedings of IPACK2007, July 8-12, Vancouver, British Columbia, Canada.

157.

Kim, D.R., Koo, J.R., Fang, C., Steinbrenner, J.E., Lee, E.S., Wang, F.M., Hidrovo, C.H., Eaton, J.K., and Goodson, K.E., 2007, "Compact Model of Slug Flow in Microchannels," Proceedings of the 5th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2007, June 18-20, Puebla, Mexico.

156.

Panzer, M.P., and Goodson, K.E., 2007, "Thermal Inteface Resistances in Nanostructures," Proceedings of the ASME-JSME Thermal Engineering Summer Heat Transfer Conference, July 8-12, Vancouver, British Columbia, Canada.

155.

Lee, J-H., Flynn, R., Goodson, K.E., and Eaton, J.K., 2007, "Convective Heat Transfer of Nanofluids in Microchannels," Proceedings of the ASME-JSME Thermal Engineering Summer Heat Transfer Conference, July 8-12, Vancouver, British Columbia, Canada.

154.

Pettes, A.M., Hodes, M.S., Goodson, K.E., 2007, "Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance," Proceedings of IPACK2007, July 8-12, Vancouver, British Columbia, Canada.

153.

Lee, E.S., Hidrovo, C., Goodson, K.E., and Eaton, J.K., 2007, "Gas-Liquid Flow in Microchannels Bounded by a Porous Wall," 6th International Conference on Multiphase Flow, ICMF 2007, July 9-13, Leipzig, Germany.

2006

152.

Fogg, D., Cheng, C.H., and Goodson, K.E., 2006, "Design Considerations for the Effects of Liquid Compressibility in Microchannel Flow Boiling," Proc. IMECE 2006, Paper No. IMECE2006-14380, Nov. 5-10, 2006, Chicago, IL, USA.

151.

Fogg, D., and Goodson, K.E., 2006, "Bubble Growth, Departure, and Convection in Single Microchannels," Proc. IMECE, Paper No. IMECE2006-14382, Nov. 5-10, 2006, Chicago, IL, USA.

150.

Flynn, R.D., Fogg, D.W., Koo, J.M., Cheng, C.H., and Goodson, K.E., 2006, "Boiling Flow Interaction Between Two Parallel Microchannels," Proc. IMECE 2006, Paper No. IMECE2006-14696, Nov. 5-10, 2006, Chicago, IL, USA.

149.

Oh, D., Jain, A., Eaton, J.K., Goodson, K.E., Lee, J.S., 2006, "Thermal Conductivity Measurement of Aluminum Oxide Nanofluids using the 3-Omega Method", Proc. ASME-IMECE-2006, Chicago.

148.

Sinha, S., and Goodson, K.E., 2006, "Dissipation and Entropy Flow in Logic: Fundamental Limits and Engineering Challenges," International Workshop on Nanoscale Energy Conversion and Information Processing Devices, Nice, France.

147.

Fogg, D., and Goodson, K.E., 2006, "The Effects of Liquid Compressibility on the Nucleation and Growth of Bubbles in Forced Convective Flow Boiling Within Microchannels," 4th International Conference on Nanochannels, Microchannels, and Minichannels. June 19-21, 2006. Limerick, Ireland. Paper No. ICNMM2006-96208.

146.

David, M.P., Fogg, D.W., Hidrovo, C., Flynn, R., Goodson, K.E., 2006, "Development and Calibration of a two-dye fluorescence system for use in two-phase micro-flow thermometry," ITherm 2006, San Diego, USA, 29 May-2 June.

145.

Reifenberg, J., Pop, E., Gibby, A., Wong, S., Goodson, K.E., 2006, "Multiphysics Modeling and Impact of Thermal Boundary Resistance in Phase Change Memory Devices," Proceedings of the ITHERM Conference, p. 106, San Diego, CA.

144.

Jain, A., Goodson, K.E., 2006, "Thermal Phenomena in Biological Microdevices", Keynote paper at the ASME-ISHMT Heat & Mass Transfer Conference, IIT-Guwahati, India.

143.

Panzer, M., Zhang, G., Mann, D., Hu, X., Pop, E., Dai H., and Goodson, K.E., 2006, "Thermal Properties of Metal-Coated Vertically-Aligned Single Wall Nanotube Films," Proceedings of the ITHERM Conference, p. 1306, May 2006, San Diego, CA.

142.

Jain, A., Hu, X., Goodson, K.E., 2006, "A New Formulation for Thermal Transport Property Measurement of a Two-Dimensional Thin Film using the 3-Omega Method," ASME-ISHMT Heat & Mass Transfer Conference, Guwahati, India.

2005

140.

Jain, A., Goodson, K.E., 2005, "Measurement of Thermophysical Properties of Thin Film Shape Memory Alloys using the 3-Omega Method," ASME-IMECE-2005, Orlando, FL, Nov. 2005.

141.

Steinbrenner, J., Vigneron, S., Wang, F.-M., Hidrovo, C., Koo, J.-M., Lee, E. S., Cheng, C.-H., Eaton, J. and Goodson, K., 2005, "Evaluation of a Compact Model for Prediction of Liquid Film Thickness in Stratified Two-Fluid Microchannel Flows," American Physical Society, Division of Fluid Dynamics, 58th Annual Meeting, November 20-22, 2005, Chicago, IL.

139.

Jain, A., Goodson, K.E., 2005, "A Theoretical Model for Temperature Gradient Effects on Cells," Proceedings of the ASME National Heat Transfer Conference, San Francisco, CA.

138.

Jain, A., Ness, K., Fishman, H.A., Goodson, K.E., 2005, "Investigation of Temperature Gradient Effects on Neurite Outgrowth in Nerve Cells using a Microfabricated Heater Structure," 3rd International IEEE-EMBS Conference on Microtechnologies in Medicine and Biology, Oahu, HI, May 12-14.

137.

Lee, E. S., Hidrovo, C. H., Steinbrenner, J. E., Wang, F.-M., Vigneron, S., Eaton, J. K. and Goodson, K. E., 2005, "Flow Structures and Frictional Characteristics on Two-Phase Flow in Microchannels in PEM Fuel Cells," FEDSM2005: 2005 ASME Fluids Engineering Summer Conference, June 19-23, Houston, Texas.

136.

Flynn, R.D., Kramer, T.A., Koo, J.M., Cheng, C.H., Fogg, D.W., Wang, E.N., and Goodson, K.E., 2005, "Convective Boiling in Silicon Microchannels with Localized Heating and Thermometry," Proc. ASME ICMM 2005-75209.

135.

Sinha, S., Goodson, K.E., 2005, "Engineering Phonon Transport: Devices to Materials," Sixth International Workshop on Future Information Processing Technologies, Asheville, NC.

134.

R. Flynn, Kramer, T.A., Koo, J.M., Fogg, D.W., Cheng, C.H., Wang, E.N., Goodson, K.E., 2005, "Convective Boiling in Silicon Microchannels with Localized Heating and Thermometry," 3rd International Conference on Microchannels & Minichannels, Toronto, Canada, June 13-15, ICMM2005-75209.

133.

Sinha, S., Pop, E., and Goodson, K.E., 2005, "Phonon Transport in Nanotransistors", Proceedings of the US-Japan Nanotherm Conference, Sendai, Japan.

132.

Wang, E., Devasenathipathy, S., Lin, H., Hidrovo, C., Santiago, G., Goodson, K. and Kenny, T., 2005, "Bubble Reconstruction Method for Two-Phase Microchannel Flows," Proceedings of the American Physical Society, Division of Fluid Dynamics, 58th Annual Meeting, November 20-22, Chicago, IL.

131.

Wang, F.-M., Steinbrenner, J. E., Hidrovo, C. H., Kramer, T. A., Lee, E. S., Vigneron, S., Cheng, C.-H., Eaton, J. K. and Goodson, K.E., 2005, "Investigation of Two-Phase Transport Phenomena in Microchannels Using a Microfabricated Experimental Structure", Heat SET 2005: Heat Transfer in Components and Systems for Sustainable Energy Technologies, April 5-7, Grenoble, France.

130.

Steinbrenner, J. E., Hidrovo, C. H., Wang, F.-M., Lee, E. S., Vigneron, S., Kramer, T. A., Cheng, C.-H., Eaton, J. K. and Goodson, K. E., 2005, "Measurement and Modeling of Liquid Film Thickness Evolution in Stratified Two-Phase Microchannel Flows," Heat SET 2005: Heat Transfer in Components and Systems for Sustainable Energy Technologies, April 5-7, Grenoble, France.

129.

C.H. Hidrovo, T.A. Kramer, E.N. Wang, S. Vigneron, J.E. Steinbrenner, J.-M. Koo, F.-M. Wang, D. Fogg, R. Flynn, E.S. Lee, C.-H. Cheng, T.W. Kenny, J.K. Eaton, K.E. Goodson, 2005, "Two-phase Microfluidics for Semiconductor Circuits and Fuel Cells," 3rd International Conference on Microchannels & Minichannels, Toronto, Canada, June 13-15, ICMM2005-75085.

128.

E. Pop, D. Mann, J. Reifenberg, K.E. Goodson and H. Dai, 2005, "Electro-Thermal Transport in Metallic Single-Wall Carbon Nanotubes for Interconnect Applications," International Electron Devices Meeting, Washington, DC

127.

J. Rowlette, E. Pop, S. Sinha, M. Panzer and K.E. Goodson, 2005, "Thermal Phenomena in Deeply Scaled MOSFETs," Proceedings of the International Electron Devices Meeting, Dec. 2005, Washington, DC, pp. 984-987.

126.

Rowlette, J., Pop, E., Sinha, S., Dutton, R.W., and Goodson, K.E., 2005, "Coupled Electron-Phonon Transport in Nanometer-Scale Silicon Devices," SRC TechCon, Oct. 2005, Portland OR.

125.

J. Rowlette, E. Pop, S. Sinha, R. W. Dutton and K.E. Goodson, 2005, "Coupled Electron-Phonon Transport in Nanometer-Scale Silicon Devices," Proceedings of SRC TechCon, Portland OR.

124.

E. Pop, J. Rowlette, R. W. Dutton and K. E. Goodson, 2005, "Joule Heating under Quasi-Ballistic Transport Conditions in Bulk and Strained Silicon Devices," Proceedings SISPAD, Tokyo, Japan, pp. 307-310.

123.

Hu, X., Padilla, A., and Goodson, K., 2005, "Thermal Characterization of Vertically-Oriented Carbon Nanotubes on Silicon," SEMI-THERM, March 15-17, San Jose, CA

122.

Hu, X., Goodson, K., "Lattice Boltzmann Simulation of Heat Conduction in Nanofluids," Proc. Materials Research Society Spring Meeting, March 30-April 1, 2005, San Francisco, CA.

121.

Hu, X., Prasher, R., and Goodson, K., 2005, "Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling", ASME National Heat Transfer Conference, July 17-22, San Francisco, CA

120.

Hu, X., Jain, A., Goodson, K., 2005, "Investigation of the Natural Convection Boundary Condition in Microfabricated Structures," NHTC, July 17-22, San Francisco, CA.

119.

Singaravelu, S., Hu, X., Goodson, K., 2005, "Bond Line Thickness of Thermal Interface Materials with Carbon Nanotubes," InterPack, July 17-22, 2005, San Francisco, CA.

118.

Hu, X., Panzer, M., Goodson, K., 2005, "Thermal Characterizing of Two Opposing Carbon Nanotube Arrays Using Diffraction Limited Infrared Microscopy," Proceedings of the ASME IMECE, November 5-11, 2005, Orlando, Florida.

117.

Hidrovo, C. H., Wang, E.-M., Steinbrenner, J. E., Lee, E. S., Vigneron, S., Cheng, C.-H., Eaton, J. K. and Goodson, K. E., 2005, "Water Slug Detachment in Two-Phase Hydrophobic Microchannel Flows", ICMM2005: 3rd International Conference on Microchannels and Minichannels, June 13-15, 2005, Toronto, Ontario, Canada.

2004

116.

Hidrovo, C. H., Wang, F.-M., Lee, E. S., Vigneron, S., Steinbrenner, J. E., Paidipati, J. V., Kramer, T. A., Eaton, J. K. and Goodson, K. E., "Experimental Investigation and Visualization of Two-Phase Flow and Water Transport in Microchannels", IMECE04: ASME 2004 International Mechanical Engineering Conference, November 13-19, 2004, Anaheim, CA.

115.

Vigneron, S., Hidrovo, C. H., Wang, F.-M., Lee, E. S., Steinbrenner, J. E., Paidipati, J. V., Kramer, T. A., Eaton, J. K. and Goodson, K. E., 2004, "1D Homogeneous Modeling of Microchannel Two-Phase Flow with Distributed Liquid Water Injection from Walls", IMECE04: ASME 2004 International Mechanical Engineering Conference, November 13-19, 2004, Anaheim, CA.

114.

Fogg, D., Flynn, R., Hidrovo, C., Zhang, L. and Goodson, K., "Fluorescent Imaging of Void Fraction in Two-Phase Microchannels", 3rd International Symposium on Two-Phase Flow Modeling and Experimentation, September 22-24, 2004, Pisa, Italy.

113.

E.N. Wang, J.G. Santiago, K.E. Goodson, T.W. Kenny, 2004, "Microjet Impingement Cooling with Phase Change," ASME International Mechanical Engineering Congress & Exposition, November 13-19, 2004, Anaheim, CA, USA, IMECE2004-62176.

112.

J. Rowlette, E. Pop, S. Sinha, M. Panzer, and K.E. Goodson, 2004, "Thermal Simulation Techniques for Nano-Transistors," Proceedings of the ICCAD Conference, Nov. 2005, San Jose CA, pp. 225-228.

111.

Sinha, S., and Goodson, K.E., 2004, "Thermal conduction in sub-100 nm transistors," Keynote paper, Thermal Investigations of ICs and Systems (THERMINIC), Sophia Antipolis, France.

110.

E. Pop, C. O. Chui, S. Sinha, R. W. Dutton, K. E. Goodson, 2004, "Electro-Thermal Comparison and Performance Optimization of Thin-Body SOI and GOI MOSFETs," International Electron Devices Meeting, San Francisco, CA.

109.

E.N. Wang, S. Devasenathipathy, C.H. Hidrovo, D.W. Fogg, J.-M. Koo, J.G. Santiago, K.E. Goodson, T.W. Kenny. "Liquid Velocity Fields in Two-Phase Microchannel Convection," 3rd International Symposium on Two-Phase Flow Modelling and Experimentation, September 22-24, 2004, Pisa, Italy.

108.

Wang, E.N., Devasenathipathy, S., Hidrovo, C.H., Fogg, D.W., Koo, J.M., Santiago, J.G., Goodson, K.E., T. W. Kenny, T.W., 2004, "A Quantitative Understanding of Transient Bubble Growth in Microchannels using ƒÊPIV", Proceedings 2004 Solid State Sensors and Actuators Workshop, 101.

107.

McConnell, A.D., L. Jiang, K. E. Goodson, "A Method for Measuring the Thermal Conductivity of Individual Carbon Nanotubes," manuscript prepared for the Proceedings of the NSF Design, Service and Manufacturing Grantees and Research Conference, Dallas, TX, September, 2004.

106.

Sinha, S., Schelling, P.K., Phillpot, S.R., and Goodson, K.E., "Atomistic simulations of g-type phonons in silicon devices," ASME Heat Transfer/ Fluids Engineering Summer Conference, July 11-15 2004, Charlotte, North Carolina, USA.

105.

Candler, R.N., Hopcroft, M., Park, W.T., Chandorkar, S.A., Yama, G., Goodson, K.E., Varghese, M., Duwel, A., Partridge, A., Lutz, M., and Kenny, T.W., "Reduction in Thermoelastic Dissipation in Micromechanical Resonators by Disruption of Heat Transport," Proceedings of Solid State Sensors and Actuators Workshop, pp. 45-48, 2004.

104.

Hu, X., Govindasamy, S., Goodson, K.E., "Two-medium Model for the Bond Line Thickness of Particle Filled Thermal Interface Materials", Proceedings of the ASME IMECE, November 13-19, 2004, Anaheim, CA

103.

Hu, X., Jiang, L., and Goodson, K.E., "Thermal Conductance Enhancement of Particle-Filled Thermal Interface Materials using Carbon Nanotube Inclusions", Proceedings of ITHERM, June 1-4, 2004, Las Vegas, NV

102.

Hu, X., Jiang, L., and Goodson, K., "Thermal characterization of eutectic alloy thermal interface materials with void-like inclusions", Proceedings of the IEEE SEMI-THERM Conference, March 9-11, 2004, San Jose, CA.

101.

Jain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K.E.. "Microfabrication and cell culturing on a large temperature gradient microdevice for studying nerve cell growth." Proceedings of NSF DSM Grantees and Research Conference, Dallas, TX, Jan. 5-8, 2004.

100.

Jain, A., Ness, K., Mehenti, N., Fishman, H., Goodson, K.E.. "A microheater device for study of temperature gradient effects on neurite outgrowth in retinal ganglion cells." ARVO Annual Meeting 2004, Ft. Lauderdale, FL, April 25-28, 2004.

99.

Sinha, S., Pop E., and Goodson, K.E., 2004, "A Split-Flux Model for Phonon Transport Near Hotspots," Proceedings of the International Mechanical Engineering Congress and Exposition, Anaheim, CA.

98.

Sinha, S., Schelling, P.K., Phillpot S.R., and Goodson, K.E., "Nanoscale simulation of heat conduction in semiconductor devices," The Ninth Intersociety Conference on Thermal and Thermo-mechanical Phenomena In Electronic Systems, June 1-4 2004, Las Vegas, Nevada, USA.

97.

T.A. Kramer, R.D. Flynn, D.W. Fogg, E.N. Wang, C.H. Hidrovo, R.S. Prasher, D.S. Chau, S. Narasimhan, K.E. Goodson, 2004, "Microchannel Experimental Structure for Measuring Temperature Fields During Convective Boiling," ASME International Mechanical Engineering Congress & Exposition, Anaheim, CA, USA, November 13-19, 2004, IMECE2004-61936.

90.

Ness, K., Wheeler E., Benett, W., Stratton. P., Christian, A., Chen, A., Weisgrabber, T., Goodson, K.. 2004, "Buoyancy-driven polymerase chain reaction (PCR) devices," Proceedings of ECI: Transport Phenomena in Micro and NanoDevices, Kona, Hawaii, 2004.

2003

96.

E. Pop, K. E. Goodson, R. W. Dutton, 2003, "Thermal Analysis of Ultra-Thin Body Device Scaling," Proceedings of the International Electron Devices Meeting, Dec. 2003, Washington DC.

95.

E. Pop, K. E. Goodson, R. W. Dutton, 2003, "Detailed Heat Generation Simulations via the Monte Carlo Method," Proceedings of SISPAD, Sep. 2003, Boston MA.

94.

E. Pop, K. E. Goodson, R. W. Dutton, 2003, "Monte Carlo Simulation of Heat Generation in Silicon Nano-Devices," SRC TechCon, Aug. 2003, Dallas TX (Best Paper in Session Award).

93.

E.N. Wang, S. Devasenathipathy, J.G. Santiago, K.E. Goodson, T.W. Kenny, 2003, "Nucleation and Growth of Vapor Bubbles in a Heated Silicon Microchannel," ASME International Mechanical Engineering Congress & Exposition, Washington, D.C., USA, Nov. 15-21, 2003.

92.

Sinha, S., Schelling, P.K., Phillpot S.R., and Goodson, K.E., "Atomistic simulations of non-equilibrium phonons in nanotransistors," Proceedings of the Semiconductor Research Corporation - TECHCON, August 2003, Dallas, Texas, USA.

91.

Jain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K.E., "Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth." Proceedings of IMECE-2003, Washington D.C., Nov 16-21, 2003.

89.

G. Upadhya, P. Zhou, K. Goodson, M. Munch, and T.W. Kenny, "Closed-Loop Cooling Technologies for Microprocessors," Proceedings of the 2003 International Electron Devices Meeting, Washington, (2003).

88.

Goodson K., Jiang L., Sinha S., Pop E., Im S., Fletcher D., King W., Koo, J. and Wang E., "Microscale thermal engineering of electronic systems," Invited Paper for the Proceedings of the Rohsenow Symposium on Future Trends of Heat Transfer, Massachusetts Institute of Technology, Cambridge, Massachusetts, May 16, 2003.

87.

Chu, D., Bilir, D., Goodson, K.E., and Pease, R.F.W., 2003, "Thin Film Nano Thermocouple Sensors for Applications in Laser and Electron Beam Irradiation" presented at the 12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducersf03), Boston, MA, 2003, the corresponding paper published in the conference Proceeding, Vol. 2, pp. 1112.

86.

Koo, J., Im, S., Jiang, L., Goodson, K. E., 2003 "Integrated Microchannel Network for Cooling of 3D Circuit Architectures," Proceedings of ASME International Mechanical Engineering Congress & Exposition, Washington, D.C., Nov. 16-21, IMECE2003-42280.

85.

Chu, D., Wong, W.K., Goodson, K.E., and Pease, R.F.W., 2003, "Transient Temperature Measurements of Resist Heating using Nano Thermocouples" presented at the 47th International Conference of Electron, Ion, Photon Beam Technology and Nanofabrication (EIPBN2003), Tampa, FL, 2003.

84.

W.P. King and K.E. Goodson, 2003, "Modeling and Simulation of Nanometer-Scale Thermomechanical Nano-Indentation," ASME-JSME Joint Thermal Engineering Conference, March 2003, Hawaii, HI.

2002

83.

W.P. King and K.E. Goodson, 2002, "Resolution Limits of Nanoscale Thermal Processing with the Atomic Force Microscope," ASME IMECE 2002 Symposium on Thermal Issues in Nanomaterials and Nanofabrication, November 2002, New Orleans, LA.

82.

Asheghi, M., Behkam, B., Keivan, Y., Joshi, R., and Goodson, K.E., 2002, "Thermal Conductivity Model for Silicon-on-Insulator Layers at High Temperatures," Proc. IEEE International SOI Conference, pp 51-52.

81.

Koo, J.-M., Jiang, L., Bari, A., Zhang, L., Wang, E., Kenny, W., Goodson, K.E., and Santiago, J.G., 2002, "Convective Boiling in Microchannel Heat Sinks with Spatially-varying Heat Flux," Proceedings of ITHERM 2002, San Diego, CA, USA, May, 2002.

80.

Jiang, L., Koo, J. M., Zhang, L., Wang, E., Im, S., Yao, S., Zeng, S., Goodson, K., and Bari, A., "Progress on Two-Phase Convection in Microchannel Heat Sinks," Invited Keynote Lecture, Paper appeared in the Proceedings of Forth Pacific Rim Thermal Science and Energy Engineering Workshop, Kyoto, Japan, May 31-June 2, 2002.

79.

Jiang, L., Koo, J.-M., Bari, A., Wang, E., Prasher, R.S., Maveety, J., Kenny, T.W., Goodson, K.E., and Santiago J.G., 2002, "Cross-linked Microchannels for VLSI Hotspot Cooling," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22.

78.

Koo, J.-M., Im, S., Goodson, K.E., Cho, E., Prasher, R.S., Wang, E., Jiang, L., Bari, A., Campion, D., Fogg, D., Kim, M., Kenny, T.W., and Santiago, J.G., 2002, "VLSI Hotspot Cooling Using Two-phase Microchannel Convection," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22, MEMS-1, IMECE2002-39238.

77.

Pop, E., Sinha, S., and Goodson, K.E., 2002, "Monte Carlo Modeling of Heat Generation in Electronic Nanostructures," Proc. ASME International Mechanical Engineering Congress & Exposition, New Orleans, November 17-22.

76.

Im, S., Goodson, K.E., and Banerjee, K., 2002, "Via Design and Scaling Strategy for Nanometer Scale Interconnect Technologies," Proc. IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, Dec. 9-11, pp. 587-590, 2002.

75.

Im, S., Banerjee, K., and Goodson, K.E., 2002, "Modeling and Analysis of Via Hot Spots and Implications for ULSI Interconnect Reliability," 40th IEEE Annual International Reliability Physics Symposium (IRPS), Dallas, TX, April 8-11, 2002.

74.

Jiang, L., Mikkelsen, J., Koo, J-M, Zhang, L., Huber, D., Yao, S., Bari, A., Zhou, P., Santiago, J., and Kenny, T.W. and Goodson, K.E., 2002, "Transient and Sub-atmospheric Performance of A Closed-loop Electroosmotic Microchannel Cooling System", Proceeding of Thermal Challenges in Next Generation Electronic Systems, THERMES 2002, Santa Fe, New Mexico, USA, pp. 133-139, Jan. 13-16, 2002.

73.

Wang, E.N., Zhang, L., Jiang, L., Koo, J.-M., Maveety, J., Sanchez, E.A., Goodson, K.E., Santiago, J.G., and Kenny, T.W., "Micromachined Jet Arrays for Liquid Impingement Cooling of VLSI Chips", Hilton Head 2002: Solid-State Sensors & Actuator Workshop, Hilton Head, South Carolina, June 2002.

71.

W.P. King, T.W. Kenny, K.E. Goodson, M. Despont, U. Duerig, M. Lantz, H. Rothuizen, G. Binnig, and P. Vettiger, 2002, "Microcantilevers for Thermal NanoImaging and Thermomechanical Surface Modification," Proceedings 2002 Workshop on Solid State Sensors, Actuators and Microsystems, Hilton Head, p. 210.

70.

Pop, E., Sinha S., and Dutton, R. and Goodson, K.E., 2002, "Nanoscale Heat Generation in Silicon via the Monte Carlo Method," US-Japan NANOTHERM Workshop, Berkeley, CA, 2002.

69.

Chu, D. Goodson, K.E., and Pease, F., 2002, "Modeling Resist Heating in Mask Fabrication Using A Green's Function Approach" Proc. SPIE, Vol. 4689, pp. 206.

68.

Jiang, L., Koo, J. M., Zhang, L., Wang, E., Im, S., Yao, S., Zeng, S., Goodson, K., and Bari, A., 2002, "Progress on Two-Phase Convection in Microchannel Heat Sinks," Invited Keynote Lecture, Proceedings of Forth Pacific Rim Thermal Science and Energy Engineering Workshop, Kyoto, Japan, May 31-June 2.

67.

Im, S., and Banerjee, K., and Goodson, K.E., "Modeling and Analysis of Via Hot Spots and Implications for ULSI Interconnect Reliability," Proceedings of the 40th IEEE Annual International Reliability Physics Symposium (IRPS), Dallas, TX, April 7-11, pp. 336-345, 2002.

66.

Zhang, L., Wang, E.N., Koo, J.-M., Jiang, L., Goodson, K.E., Santiago, J. G., and Kenny, T. W., 2002, "Enhanced Nucleate Boiling in Microchannels", 2002 IEEE International Conference on MicroElectroMechanical Systems, Las Vegas, NV, P. 89.

65.

King, W.P., and Goodson, K.E., 2002, "Modeling Sub-Continuum Effects on the Mechanical Properties of Ultrathin Macromolecular Layers," invited paper, Conference on the Modeling and Simulation of Microsystems, San Juan, Puerto Rico, April 20-22.

2001

72.

Laser, D., Goodson, K.E., Santiago, J.G., Kenny, T.W., 2001, "Impact of Pumping Surface Separation Distance on Micromachined Silicon Electrokinetic Pump Performance", 2001 ASME International Mechanical Engineering Congress and Exhibition, New York (2001).

64.

King, W.P., and Goodson, K.E., 2001, "Thermal Writing and Nanoimaging with Heated Atomic Force microscope Cantilevers," presented at the Heat Transfer Photogallery at the ASME International Mechanical Engineering Congress and Exposition, November 12-16.

63.

Fletcher, D.A., Webb, N.U., Kino, G.S., Quate, C.F., and Goodson, K.E., 2001, "Thermal Microscopy with a Microfabricated Solid Immersion Lens," Proc. IEEE/LEOS International Conference on Optical MEMS, Okinawa, Japan.

62.

L. Zhang, E.N. Wang, J. Koch, J.Liu, J-M. Koo, L. Jiang, K.E. Goodson, J.G. Santiago, T.W. Kenny, "Microscale Liquid Impingement Cooling", 2001 ASME International Mechanical Engineering Congress and Exhibition, New York (2001).

61.

King, W.P., and Goodson, K.E., 2001, "Modeling and Simulation of Nanometer-Scale Thermomechanical Data Bit Formation," Proceedings of the ASME National Heat Transfer Conference, Anaheim, CA, June 10-12.

60.

Zhang, L., Koo, J.-M., Jiang, L., Goodson, K.E., Santiago, J.G., and Kenny, T.W., 2001, "Study of Boiling Regimes and Transient Signal Measurements in Microchannels," Proc. Solid State Sensors and Actuators Workshop (Transducers), Munich, Germany, June, pp. 1514-1517.

59.

Jiang, L., Koo, J.M., Zeng, S., Zhang, L., Banerjee S., Zhou P., Santiago J.G., Kenny T.W., Goodson K.E., 2001, "An Electrokinetic Closed-Loop Micro Cooler for High-Power VLSI Chips," presented at SEMI-THERM, San Jose, CA, USA, March.

58.

King, W.P., and Goodson, K.E., 2001, "Thermal Writing and Nanoimaging with Heated Atomic Force microscope Cantilevers," presented at the Heat Transfer Photogallery at the ASME International Mechanical Engineering Congress and Exposition, November 12-16.

57.

Cross, G.L.W., Despont, M., Drechsler, U., Durig, U., Vettiger, P., King, W.P., and Goodson, K.E, 2001, "Thermomechanical Formation and Thermal Sensing of Nanometer-Scale Indentations in PMMA Thin Films for Parallel and Dense AFM Data Storage," Fundamentals of Nanoindentation and Nanotribology II, Materials Research Society Symposium Proceedings, 649.

56.

Chu, D., Touzelbaev, M., Goodson, K.E., Babin, S., Pease, R.F., 2001, "Thermal Conductivity Measurements for Resist Thin Film," presented at the International Symposium on Electron, Ion and Photon Beam Technology and Nanofabrication, Washington DC.

55.

Laser, D., Yao, S., Chen, C.H., Mikkelsen, J., Goodson, K.E., Santiago, J.G., and Kenny, T.W., 2001, "A Micromachined Silicon Low-Voltage Parallel-Plate Electrokinetic Pump," Proc. Solid State Sensors and Actuators Workshop (Transducers), Munich, Germany, p. 330.

49.

Koo, J.M., Jiang, L., Zhang, L., Zhou, P., Banerjee, S., Santiago, J.G., Kenny, T.W., and Goodson, K.E., 2001, "Modeling of Two-Phase Microchannel Heat Sinks for VLSI Chips", Proc. 14th IEEE Conference on MEMS 2001, Interlaken, Switzerland, Jan 21-25, pp. 422-426.

2000

54.

McConnell, A.D., Uma, S., and Goodson, K.E., 2000, "Thermal Conductivity of Doped Polysilicon Layers," Proc. International Conference on Heat Transfer and Transport Phenomena in Microscale Structures, G. P. Celata et al., eds., Begell House, New York, pp. 413-419.

53.

Zeighami, R.M., Laser, D., Zhou, P., Asheghi, M., Devasenathipathy, S., Kenny, T.W., Santiago, J.G., and Goodson, K.E., 2000, "Experimental Investigation of Flow Transition in Microchannels using Micron Resolution Particle Image Velocimetry," Proc. ITherm, Las Vegas, Nevada, May.

52.

Zhou, P., and Goodson, K.E., 2000, "Thermomechanical Diagnostics of BGA Packages using Digital Image/Speckle Correlation (DISC)," Proc. ITherm, Las Vegas, Nevada, May.

51.

Zhang, L., Koo, J.M., Jiang, L., Banerjee, S.S., Asheghi, M., Goodson, K.E., Santiago, J.G., Kenny, T.W., 2000, "Measurements and Modeling of Two-phase Flow in Mirochannels with Nearly-Constant Heat Flux Boundary Conditions," Proceedings of International Mechanical Engineering Congress & Exposition, Orlando, Florida, USA, November, pp. 129-135.

50.

Sverdrup, P. G., Banerjee, K., Dai, C., Shih, W.K., Dutton, R. W., and Goodson, K. E., 2000, "Sub-Continuum Thermal Simulations of Deep Sub-Micron Devices Under ESD Conditions," International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 54-57.

48.

Zhang L., Banerjee S.S., Koo J.M., Laser D.J., Asheghi M., Goodson K.E., Santiago J.G., Kenny T.W., 2000, "A Micro Heat Exchanger with Integrated Heaters and Thermometers," Proc. Hilton Head Solid-State Sensor & Actuator Workshop, Hilton Head, South Carolina, June 4-8.

47.

King, W.P., Kenny, T.W., Goodson, K.E., Cross, G., Despont, M., Drechsler, U., Durig, U., Haberle, W., Lutwyche, M., Rothuizen, H., Stutz, R., Widmer, R., Binnig, G.K., and Vettiger, P. "Design of AFM Cantilevers for Combined Thermomechanical Data Writing and Reading," Proc. of the Hilton Head Solid-State Sensors and Actuators Workshop, pp. 1-5, 2000.

46.

Sverdrup, P.G., Tornblad, O., Banerjee, K., Yergeau, D., Yu, Z., Dutton, R.W., and Goodson, K.E., 2000, "Advanced Electro-Thermal Modeling and Simulation Techniques for Deep Sub-Micron Devices," Proc. TechCon, Phoenix, AZ, September 21-23.

45.

Tornblad, O., Sverdrup, P. G., Yergeau, D., Yu, Z., Goodson, K. E., and Dutton, R. W., 2000, "Modeling and Simulation of Phonon Boundary Scattering in PDE-based Device Simulators," Proc. International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 58-61.

44.

Touzelbaev, M.N., and Goodson, K.E, 2000, "Impact of Experimental Timescale and Geometry on Thin-Film Thermal Property Measurements," 14th Symposium on Thermophysical Properties, June.

43.

K. Banerjee, D-Y Kim, A. Amerasekera, C. Hu, S. Wong, and K. E. Goodson, 2000, "Microanalysis of VLSI Interconnect Failure Modes under Short-Pulse Stress Conditions," Proceedings of the 38th Annual IEEE International Reliability Physics Symposium, April 10-13, San Jose, CA, pp. 283-288.

42.

K. Banerjee, A. Mehrotra, W. H. Hunter, K. C. Saraswat, K. E. Goodson, and S. Wong, 2000, "Quantitative Projections of Reliability and Performance for Low-k/Cu Interconnect Systems," Proc. of the 38th Annual IEEE International Reliability Physics Symposium, April 10-13, San Jose, CA, pp. 354-358.

41.

Fletcher, D.A., Crozier, K.B., Kino, G.S., Quate, C.F., and Goodson, K.E., 2000, "Scanning Refractive Microlens," Technical Digest of the Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 263-265.

40.

Fletcher, D.A., Simanovskii, D., Palanker, D.V., Crozier, K.B., Quate, C.F., Kino, G.S., and Goodson, K.E., 2000, "Microfabricated Solid Immersion Lens with Metal Aperture," Proc. IEEE/LEOS International Conference on Optical MEMS, Kauai, Hawaii.

1999

39.

Sverdrup, P. G., Ju, Y. S., and Goodson, K. E., 1999, "Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors," Proc. ASME IMECE, Nashville, TN, HTD-Vol. 364-3, pp. 41-49.

38.

Chui, B.W., Asheghi, M., Ju, Y.S., Mamin, H.J., Goodson, K.E., and Kenny, T.W., 1999, "Measurement and Modeling of Thermal-Electrical Runaway in Silicon Cantilevers," Proceedings 10th International Conference on Solid State Sensors and Actuators, p. 1862.

37.

King, W.P., Santiago, J.G., Kenny, T.W., and Goodson, K.E., 1999, "Modeling and Simulation of Sub-Micrometer Heat Transfer in AFM Thermomechanical Data Storage," ASME MEMS-Vol. 1, pp. 583-588.

36.

Asheghi, M., W.P. King, W.P., Chui, B.W., Kenny, T.W., and Goodson, K.E., 1999, "Thermal Engineering of Doped Single-Crystal Silicon Microcantilevers for High Density Data Storage," Proceedings 10th International Conference on Solid State Sensors and Actuators. P. 1840 (1999)

35.

Goodson, K.E., "Microscale Thermal Engineering of Integrated Circuits," Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK 99), Maui, Hawaii, June 13-19.

34.

Zhou, P., and Goodson, K.E., 1999, "Diagnostics of FLIP-CHIP/BGA Structures using Phase-Shifting Speckle-Pattern Interferometry," Proc. Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK e99), Maui, Hawaii, June 13-19.

33.

Asheghi, M., Kurabayashi, K., Goodson, K.E., Kasnavi, R., and Plummer, J.D., 1999, "Thermal Conduction in Doped Silicon Layers," accepted for the 33rd ASME/AIChE National Heat Transfer Conference, Albuquerque, NM, August 8-14.

32.

Ju, Y.S., and Goodson, K.E., 1999, "Measurements of the Thermal Conductivity of Monocrystalline Silicon Films," accepted for the 33rd ASME/AIChE National Heat Transfer Conference, Albuquerque, NM, August 8-14.

31.

Kurabayashi, K., and Goodson, K.E., 1999, "Prediction of the Thermal Conductivity Anisotropy in Linear-Chain Polymer Films," accepted for the ASME/JSME Thermal Engineering Joint Conference, San Diego, CA, March 15-19.

30.

Sverdrup, P.G., Ju, Y.S., and Goodson, K.E., 1999, "Impact of Heat Source Localization on Conduction Cooling of Silicon-on-Insulator Devices," Proc. International Conference on Modelling and Simulation of Microsystems, Puerto Rico, April 19-22.

1998

29.

Sverdrup, P.G., Kurabayashi, K., Ju, Y.S., Shieh, B.P., and Goodson, K.E., 1998, "Thermal Reliability Problems Posed by Novel Dielectrics," Proc. 15th International VLSI Multilevel Interconnection Conference (VMIC), Santa Clara, CA, June 16-18, VMIC Catalog No. 98 IMIC - 108, pp. 261-266.

28.

Kurabayashi, K., Asheghi, M., Touzelbaev, M.N., and Goodson, K.E., 1998, "Measurement of the Thermal Conductivity Anisotropy in Polymer Films," Proceedings of the 1998 International Mechanical Engineering Congress and Exposition, Anaheim, California, November 15-20, S. Liu et al., eds.

27.

Kurabayashi, K., Touzelbaev, M.N, Asheghi, M., Ju, Y.S., and Goodson, K. E., 1998, "Measurement of the Anisotropic Thermal Conductivities in Polymer Films," Proceedings of the 7th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, Albuquerque, NM, June 14-18, B.F. Armaly et al., eds., Vol. 3, pp.187-194.

1997

26.

Ju, Y.S., and Goodson, K.E., 1997, "Impact of Phonon Dispersion upon the Size Effect on Thermal Conduction along Thin Semiconductor Films," Proceedings of the 1997 International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, in Microscale Energy Transport, K.E. Goodson et al., eds., HTD-Vol. 354, pp. 181-190.

25.

Schuder, R.G., and Goodson, K.E., 1997, "Integrated Circuits and MicroElectroMechanical Systems in the Heat Transfer Teaching Laboratory," ASME Proceedings of the 32nd National Heat Transfer Conference, Baltimore, Maryland, August 7-10, in Innovations in Heat Transfer Education, HTD-Vol. 344, M. Bianchi et al., eds., pp. 83-92.

24.

Kurabayashi, K., and Goodson, K.E., 1997, "Precision Measurement and Mapping of Die-Attach Thermal Resistance," Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, Kohala Coast, Hawaii, June 15-19, in Advances in Electronic Packaging, EEP Vol. 19-1, E. Suhir et al., eds., pp. 2023-2030.

23.

Kurabayashi, K., Touzelbaev, M.N., Asheghi, M., Ju, Y.S., and Goodson, K.E., 1997, "Measurement of the Anisotropic Thermal Conductivity in Polymer Thin Films for Low-Dielectric-Constant Passivation," Proc. 3rd International Workshop on Thermal Investigations of ICs and Microstructures, Cannes, France, September 21-23.

22.

Asheghi, M., Ju, Y.S., and Goodson, K.E., 1997, "Thermal Conductivity of SOI Device Layers," Proceedings of the IEEE International SOI Conference, Tenaya Lodge at Yosemite, Fish Camp, California, October 6-9, IEEE Vol. 97CH36069, pp. 134-135.

21.

Chui, B.W., Goodson, K.E., Kenny, T.W., Mamin, H.J., Terris, B.D, and Rugar, D. "Micromachined heaters with 1-us thermal time constants for AFM thermomechanical data storage," Proceedings of the International Conference on Solid-state Sensors and Actuators, Transducers, Chicago, Illinois, June, 1997.

20.

Ju, Y.S., and Goodson, K.E., 1997, "Short-Timescale Thermal Mapping of Interconnects," Proceedings of the 35th IEEE International Reliability Physics Symposium, Denver, Colorado, April 8-10, IEEE Catalog No. 97CH35983, pp. 320-324.

1996

19.

Chui, B.W., Stowe, T.D., Ju, Y. S., Soh, H.T., Minne, S.C., Goodson, K.E., Quate, C.F., Kenny, T.W., Mamin, H.J., Terris, B.D., Ried, R.P., and Rugar, D., 1996, "Improved Cantilevers for AFM Thermomechanical Data Storage," Proceedings of the Solid-State Sensor and Actuator Workshop, Hilton Head, South Carolina, June 2-6, pp. 219-224.

16.

Ju, Y.S., and Goodson, K.E., 1996, "Short-Timescale Thermometry and Reliability Studies of Metal Interconnects in VLSI Circuits," Proceedings of the International Mechanical Engineering Congress and Exposition, Atlanta, GA, November 17-22, in Micro-Electro-Mechanical Systems (MEMS), DSC-Vol. 59, C. T. Avedisian et al., eds., pp. 31-36.

15.

Asheghi, M., Touzelbaev, M.N., Goodson, K.E., Leung, Y.K., and Wong, S.S., 1996, "Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates," Proceedings of the International Mechanical Engineering Congress and Exposition, Atlanta, GA, November 17-22, DSC-Vol. 59, in Micro-Electro-Mechanical Systems (MEMS), C. T. Avedisian et al., eds., pp. 83-91.

14.

Touzelbaev, M.N., and Goodson K.E., 1996, "Impact of Nucleation Density on the Thermal Resistance near Diamond-Substrate Boundaries," Proceedings of the ASME/AIChE National Heat Transfer Conference, Houston, Texas, August 3-6, Vol. 5, R. L. Mahajan et al., eds., pp. 193-200.

13.

Goodson, K.E., Ju., Y.S., Asheghi, M., Kading, O.W., Touzelbaev, M.N., Leung, Y.K., and Wong, S.S., 1996, "Microscale Thermal Characterization of High-Power Silicon-on-Insulator Transistors," Proceedings of the 31st ASME National Heat Transfer Conference, Houston, Texas, August 3-6,
Vol. 5, R. L. Mahajan et al., eds., pp. 1-9.

1995

18.

Goodson, K.E., and Cooper P.T., 1995, "The Effect of High-Energy Electrons on Lattice Conduction in Semiconductor Devices," Proceedings of the Symposium on Thermal Science and Engineering in Honor of Chancellor Chang-Lin Tien, Berkeley, California, November 14, R. Buckius, ed., pp. 153-159.

17.

Leung, Y.-K., Suzuki, Y., Goodson, K.E., and Wong, S.S., 1995, "Self-Heating Effect in Lateral DMOS on SOI," Proceedings of the Seventh International Symposium on Power Devices and Integrated Circuits, H. Ahashi, Y. Uchida, and Y. Sugawara, eds., Yokohama, Japan, May 23-25, pp. 136-140.

12.

Goodson, K.E., and Touzelbaev, M. N., 1995, "Effective Thermal Resistance at Diamond Boundaries in MEMS," presented at the Micromechanical Systems Panel Symposium at the ASME International Congress and Exposition, San Francisco, California, November 12-17, in Proceedings of the ASME Dynamic Systems and Control Division, DSC-Vol. 57-2, T.E. Alberts, ed., ASME Press., New York, pp. 925-930.

11.

Goodson, K.E., Kurabayashi, K., and Pease, R.F.W., 1995, "Improved Heat Sinking for Laser-Diode Arrays using Microchannels in CVD Diamond," Proceedings of the 1995 National Heat Transfer Conference, Portland, Oregon, August 5-9, ASME HTD-Vol. 305, S. S. Sadhal et al., eds, pp. 187-192.

10.

Goodson, K.E., 1995, "Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures," Proceedings of the Fourth ASME/JSME Thermal Engineering Joint Conference, Maui, Hawaii, March 19-24, L. S. Fletcher and T. Aihara, eds., Vol. 4., pp. 175-182.

1994

9.

Goodson, K.E., Kading, O.W., and Zachai, R., 1994, "Thermal Resistances at the Boundaries of CVD Diamond Layers in Electronic Systems," Proceedings of the ASME International Mechanical Engineering Conference and Exposition, Chicago, Illinois, November 7-11, in Heat Transfer in Electronic Systems, R. A. Wirtz et al., eds., ASME HTD-Vol. 292, pp. 83-94.

1993

8.

Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1993, "Annealing-Temperature Dependence of the Thermal Conductivity of CVD Silicon-Dioxide Layers," Proceedings of the 29th ASME National Heat Transfer Conference, Atlanta, GA, August 8-11, in Heat Transfer on the Microscale, F. M. Gerner and K. S. Udell, eds., ASME HTD-Vol. 253, pp. 21-28.

7.

Goodson, K.E., Flik, M.I., Su, L.T., and Antoniadis, D.A., 1993, "Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits," Proceedings of the 29th ASME National Heat Transfer Conference, Atlanta, GA, August 8-11, in Solutions to CFD Benchmark Problems in Electronic Packaging, D. Agonafer, ed., ASME HTD-Vol. 255, pp. 11-19.

1992

6.

Goodson, K. E., and Flik, M. I., 1992, "Effect of Microscale Thermal Conduction on the Packing Limit of Silicon-on-Insulator Electronics," Proceedings of the Third Intersociety Conference on Thermal Phenomena in Electronic Systems, Austin, TX, February 5-8, A. Ortega and S. Oktay, eds., IEEE Catalog Number 92CH3096-5, pp. 122-126.

5.

Flik, M.I., and Goodson, K.E., 1992, "Impact of Microscale Heat Conduction on the Design of Silicon-on-Insulator Electronic Circuits," Proceedings of the NSF/DITAC Collaborative Workshop on Thermal Conductance Enhancement in Microelectronics, Clayton, Australia, May 4-7, T.N. Veziroglu et al., eds., pp. 79-86.

4.

Goodson, K.E., and Flik, M.I., 1992, "Microscale Phonon Transport in Dielectrics and Intrinsic Semiconductors," Proceedings of the ASME Winter Annual Meeting, Anaheim, CA, November 8-13, in Fundamental Issues in Small Scale Heat Transfer, Y. Bayazitoglu and G.P. Peterson, eds., HTD-Vol. 227, pp. 29-36.

1991

3.

Flik, M.I., Choi, B. I., and Goodson, K.E., 1991, "Heat Transfer Regimes in Microstructures," Proceedings of the ASME Winter Annual Meeting, December 1-6, Atlanta, GA, in Micromechanical Sensors, Actuators, and Systems, D. Cho et al., eds., pp. 31-47.

2.

Goodson, K.E., and Flik, M.I., 1991, "Electron and Phonon Thermal Conduction in Epitaxial High-Tc Superconducting Films," Proceedings of the ASME National Heat Transfer Conference, Minneapolis, MN, July 28-31, in Cryogenic Heat Transfer, A. S., Adorjan, ed., pp. 76-89.

1.

Flik, M.I., and Goodson, K.E., 1991, "Thermal Analysis of Electron-Beam Absorption in Low-Temperature Superconducting Films," Proceedings of the Third ASME/JSME Joint Thermal Engineering Conference, Reno, Nevada, March 17-22, Vol. 2., pp. 29-42.