Department of Mechanical Engineering
Stanford University
Principal Investigator
Kenneth E. Goodson
Books and Book Chapters
Links and PDFs are provided below only within fair use. We assume you have proper copyright permissions to access and they are supplied as a convenience only.
Current and former lab members are listed in bold.
2012
Bozorg-Grayeli, E., Reifenberg, J.P., Asheghi, M., Wong, H.-S. P., and Goodson, K.E., 2012, "Thermal Transport in Phase Change Memory Materials," Annual Review of Heat Transfer, Vol. 15, accepted and in press.
2008
Hidrovo, C., Goodson, K.E., 2008, "Active Microfluidic Cooling of Integrated Circuits," in Electrical, Optical, and Thermal Interconnections for 3D Integrated Systems, J. Meindl and M. Bakir, eds., Artech, Boston, pp. 293-330.
2005
McConnell, A.D., and Goodson, K.E., 2005, "Thermal Conduction in Silicon Micro and Nanostructures," in the Annual Review of Heat Transfer, Vol. 14, pp. 129-168.
2003
8.
L. Zhang, Goodson, K.E., and Kenny, T.W., 2003, Book: "Silicon Microchannel Heat Sinks: Theories and Phenomena," Springer-Verlag Microtechnology and MEMS Series, ISBN 3-540-40181-4.
2002
King, W.P., and Goodson, K.E., 2002, "Thermomechanical Formation and Thermal Imaging of Polymer Nanostructures" in Heat Transfer and Fluid Flow in Microscale and Nanoscale Devices, M. Faghri and B. Sunden, Eds., Southampton: WIT Press, pp. 131-171.
2000
6.
Goodson, K.E., 2000, "Thermal Conduction in Electronic Microstructures," in the Thermal Engineering Handbook, F. Kreith, ed., CRC Press, Boca Raton, Florida, pp. 4.458 - 4.504.
1999
Goodson, K.E., and Ju, Y.S., 1999, "Heat Conduction in Novel Electronic Films," in the Annual Review of Materials Science, E.N. Kaufmann et al., eds., Annual Reviews, Palo Alto, CA, Vol. 29, pp. 261-293.
4.
Ju, Y.S., and Goodson, 1999, Book: "Microscale Heat Conduction in Integrated Circuits and their Constituent Films," Kluwer Academic Publishers, Boston.
1998
3.
Goodson, K.E., Ju, Y.S., and Asheghi, M., 1998, "Thermal Phenomena in Semiconductor Devices and Interconnects," in Microscale Energy Transport, C.L. Tien et al., eds., Taylor & Francis, New York, NY, pp. 229-293.
1995
2.
Goodson, K.E., 1995, "Impact of CVD Diamond Layers on the Thermal Engineering of Electronic Systems," in the Annual Review of Heat Transfer, C.L. Tien, ed., Begell House, New York, NY, Vol. 6, pp. 323-353
1994
1.
Goodson, K.E., and Flik, M.I., 1994, "Solid-Layer Thermal-Conductivity Measurement Techniques," Applied Mechanics Reviews, Vol. 47, pp. 101-112.