Department of Mechanical Engineering
Kenneth E. Goodson
Goodson, K.E., Santiago, J.G., Kenny, T., Jiang, L., Zeng, S., Koo, J.M., Zhang, L., Yao, S., and Wang, E., 2002, "Electroosmotic Microchannel Cooling System for Microprocessors," Electronics Cooling, Vol. 8, pp. 46-47.
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and has serious implications for overall system performance. The large volume of existing heat sinks causes discrete memory, video, and powerdelivery components to be crowded away from the microprocessor, increasing signal delays among chips and limiting the system speed. A Stanford research team is using MEMS technology to explore the lower bound volume for the heat sink. The technology combines two-phase convection in micromachined silicon heat sinks (microchannels) with a novel electroosmotic pump to achieve minimal heat sink volume at the chip backside [1, 2]. The hermeticallysealed closed loop, depicted schematically in Figure 1, features a novel and compact electroosmotic pump, forced two-phase convection in the heat sink, and a remote heat rejecter.