Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures

Goodson, K.E., 1996, "Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures," ASME Journal of Heat Transfer, Vol. 118, pp. 279-286.

Download PDF

Chemical-vapor-deposited diamond layers of thickness between 0.1 and 5 microns have the potential to improve conduction cooling in electronic microstructures. However, thermal conduction in these layers is strongly impeded by phonon scattering on defects, whose concentrations can be highly nonhomogeneous, and on layer boundaries.  By assuming that defects are concentrated near grain boundaries, this work relates the internal phonon scattering rate to the local characteristic grain dimension and to the dimensionless grain boundary scattering strength, a parameter defined here that varies little within a given layer. Solutions to the Peierls-Boltzmann phonon transport equation for conduction along and normal to layers account for the nonhomogeneous internal scattering rate. Predictions for conduction along and normal to layers as thin as 0.2 microns agree well with room-temperature data. This research helps optimize diamond layer thicknesses for specific microstructures, such as silicon-on-diamond (SOD) circuits.

Related Projects

Synthetic diamond films are promising for a broad variety of engineering applications incuding wear-resistance coatings, semiconductor passivation, and high-temperature electronics. Diamond enjoys...
A variety of modern high-power electronic devices are based on high electron mobility transistors (HEMT) and generate enormous heat fluxes that can approach tens of kW/cm2. The overall power...
Interface thermal transport is arguably the leading fundamental challenge for the design and implementation of advanced nanostructure technologies for energy conversion, computation, and data storage...