Polymer Thin Films

Sponsors: 
ONR, SRC, NSF, IBM

Heat conduction in polymer thin films and related deformation phenomena play a central role in modern manufacturing technologies, semiconductor processing, and data storage. Applications range from flexible electronics and organic light emitting devices to novel polymer-based biomedical components. Polymers have very low thermal conductivities, and typically govern the temperature differences in the engineering systems where they are found.

This work developed measurement techniques for the thermal conductivities in polymer films and studies the molecular-level physics governing heat conduction and deformation. Early work measured the thermal conductivity anisotropy using a suspended bridge structure and modeled the impact of molecular orientation on the anisotropy ratio. Subsequent studies determined the impact of localized electron-beam absorption on temperature fields in polymers, for applications in resist processing, by means of transient heat conduction analysis. In more recent work, we studied nanoscale polymer deformation during data storage using an AFM-type tip with elevated temperature. The deformation physics are highly nonlinear and the fluid mechanics non-Newtonian and are strongly coupled to the temperature distribution and heat conduction in the film.

PROJECT PUBLICATIONS

King, W.P., and Goodson, K.E., 2007, "Thermomechanical Formation of Nanoscale Polymer Indents using a Heated Silicon Tip," ASME Journal of Heat Transfer, Vol. 129, pp. 1600-1604.

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Im, S., Srivastava, N., Banerjee, K., and Goodson, K.E., 2005, "Scaling Analysis of Multilevel Interconnect Temperatures for High-Performance ICs," IEEE Transactions on Electron Devices, Vol. 52, pp. 2710-2719.

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Chu, D., Wong, W.K., Goodson, K.E., and Pease, R.F.W., 2003, "Transient Temperature Measurements of Resist Heating using Nano Thermocouples," Journal of Vacuum Science and Technology B, Vol. 21, pp. 2985-2989.

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Chu, D., Bilir, D.T., Pease, R.F.W., and Goodson, K.E., 2002, "Submicron Thermocouple Measurements of Electron-Beam Resist Heating," Journal of Applied Physics, Vol. 20, pp. 3044-3046.

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King, W.P., and Goodson, K.E., 2002, "Thermal Writing and Nanoimaging with a Heated Atomic Force Microscope Cantilever," ASME Journal of Heat Transfer, Vol. 124, p. 597.

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Chu, D.C., Touzelbaev, M., Goodson, K.E., Babin, S., and Pease, R.F., 2001, "Thermal Conductivity Measurements of Thin-Film Resist," Journal of Vacuum Science & Technology B, Vol. 19, pp. 2874-2877.

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Touzelbaev, M.N., and Goodson, K.E, 2001, "Impact of Experimental Timescale and Geometry on Thin-Film Thermal Property Measurements," International Journal of Thermophysics, Vol. 22, pp. 243-263.

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Kurabayashi, K., and Goodson, K.E., 1999, "Impact of Molecular Orientation on Thermal Conduction in Spin-Coated Polyimide Films," Journal of Applied Physics, Vol. 86, pp. 1925-1931.

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Goodson, K.E., and Ju, Y.S., 1999, "Heat Conduction in Novel Electronic Films," in the Annual Review of Materials Science, E.N. Kaufmann et al., eds., Annual Reviews, Palo Alto, CA, Vol. 29, pp. 261-293.

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Kurabayashi, K., Asheghi, M., Touzelbaev, M.N., and Goodson, K.E., 1999, "Measurement of the Thermal Conductivity Anisotropy in Polyimide Films," IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 8, pp. 180-191.

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Ju, Y.S., Kurabayashi, K., and Goodson K.E., 1999, "Thermal Characterization of Anisotropic Thin Dielectric Films using Harmonic Joule Heating," Thin Solid Films, Vol. 339, pp. 160-164.

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Ju, Y.S., Kurabayashi, K., and Goodson, K.E., 1998, "Thermal Characterization of IC Interconnect Passivation using Joule Heating and Optical Thermometry," Microscale Thermophysical Engineering, Vol. 2, pp. 101-110.

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Goodson, K.E., and Flik, M.I., 1994, "Solid-Layer Thermal-Conductivity Measurement Techniques," Applied Mechanics Reviews, Vol. 47, pp. 101-112.

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