Diamond Thin Films

Sponsors: 
DaimlerChrysler

Synthetic diamond films are promising for a broad variety of engineering applications incuding wear-resistance coatings, semiconductor passivation, and high-temperature electronics. Diamond enjoys the highest thermal conductivity of any standard crystalline material at room temperature, and many of the basic physical phenomena governing conduction in other dielectrics and semiconductors are amplified in this unique limiting material.

This work develops measurement techniques for the thermal conductivities along diamond films based on both electrical heating and thermometry and nanosecond laser reflectance. In addition, fundamental modeling using the Boltzmann transport equation for phonons and scanning electron microscopy data serves to predict the effective conductivities both along and normal to polycrystalline diamond films. A major focus of this work is the effective thermal resistance between diamond films and the deposition substrate, which can strongly impact the ability of this material to conduct heat in many applications. One example is the development of novel composite substrates containing diamond films, in which heat spreading in diamond can help alleviate the problem of hotspots both within transistors and near computational hotspots.

PROJECT PUBLICATIONS

Cho, J., Francis, D., Altman, D.H., Asheghi, M., and Goodson, K.E., 2017, "Phonon Conduction in GaN-Diamond Composite Substrates," Journal of Applied Physics, Vol. 121, 055105.

 

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Sood, A., Cho, J., Hobart, K.D., Feygelson, T.I., Pate, B.B., Asheghi, M., Cahill, D.G., and Goodson, K.E., 2016, "Anisotropic and Inhomogeneous Thermal Conduction in Suspended Thin-Film Polycrystalline Diamond," Journal of Applied Physics, Vol. 119, 175103.

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Bozorg-Grayeli, E., Sood, A., Asheghi, M., Gambin, V., Sandhu, R., Feygelson, T.I., Pate, B.B., Hobart, K., and Goodson, K.E., 2013, "Thermal Conduction Inhomogeneity of Nanocrystalline Diamond Films by Dual-Side Thermoreflectance," Applied Physics Letters, Vol. 102, 111907.

Erratum: http://scitation.aip.org/content/aip/journal/apl/108/17/10.1063/1.4948382

 

 

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Shelling, P., Li, S., and Goodson, K.E., 2005, "Managing Heat for Electronics," Materials Today, June, pp. 30-35.

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Touzelbaev, M.N., and Goodson, K.E, 2001, "Impact of Experimental Timescale and Geometry on Thin-Film Thermal Property Measurements," International Journal of Thermophysics, Vol. 22, pp. 243-263.

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Goodson, K.E., and Ju, Y.S., 1999, "Heat Conduction in Novel Electronic Films," in the Annual Review of Materials Science, E.N. Kaufmann et al., eds., Annual Reviews, Palo Alto, CA, Vol. 29, pp. 261-293.

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Touzelbaev, M.N., and Goodson, K.E., 1998, "Applications of Micron-Scale Passive Diamond Layers for the IC and MEMS Industries," Diamond and Related Materials, Vol. 7, pp. 1 - 14.

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Touzelbaev, M.N., and Goodson K.E., 1997, "Impact of Nucleation Density on Thermal Resistance Near Diamond-Substrate Boundaries," AIAA Journal of Thermophysics and Heat Transfer, Vol. 11, pp. 506-512.

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Goodson, K.E., Kurabayashi, K., and Pease, R.F.W., 1997, "Improved Heat Sinking for Laser-Diode Arrays using Microchannels in CVD Diamond," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. B20, pp. 104-109.

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Goodson, K.E., 1996, "Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures," ASME Journal of Heat Transfer, Vol. 118, pp. 279-286.

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Goodson, K.E., Kading, O.W., Rosler, M. and Zachai, R., 1995, "Thermal Conduction normal to Diamond-Silicon Boundaries," Applied Physics Letters, Vol. 66, pp. 3134-3136.

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Goodson, K.E., Kading, O.W., Rosler, M. and Zachai, R., 1995, "Experimental Investigation of Thermal Conduction normal to Diamond-Silicon Boundaries," Journal of Applied Physics, Vol. 77, pp. 1385-1392.

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Goodson, K.E., and Flik, M.I., 1994, "Solid-Layer Thermal-Conductivity Measurement Techniques," Applied Mechanics Reviews, Vol. 47, pp. 101-112.

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Flik, M.I., Choi, B.I., and Goodson, K.E., 1992, "Heat Transfer Regimes in Microstructures," ASME Journal of Heat Transfer, Vol. 114, pp. 666-674.

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