News

01.17.2020

Congrats to Saniya Leblanc (George Washington University) and Damena Agonafer (Washington University in St. Louis) for their 2019 awards, and to Yoonjin Won (UC Irvine) in 2018, all with great ideas for research, education, and outreach.  Saniya's research will be on additive manufacturing for thermoelectric applications, and Damena and Yoonjin are exploring aspects of phase change and two-phase flow.  Great!

01.03.2020

Project Title:  Exploring the Limits of Cooling for Extreme Heat Flux Applications: Data Centers and Power Electronics.  Collaborators:  Prof. Joe Palko, UC Merced, Dr. Sreekant Narumanchi, NREL, and Dr. Eric Dede, Toyota.  

01.08.2019

Just out in Nature Communications:  strong heatflow modulation through lithium intercalation in MoS2, in-situ scanning TDTR captures the transient physics.

05.04.2018

Aditya's Nano Letter unveils defect physics with novel scanning TDTR, wins best poster award at Electronic Materials Symposium

http://www.electronicmaterialssymposium.org/home

04.17.2018

Kenneth Goodson receives the Inaugural Richard Chu ITherm Award

The mechanical engineering department chair has been recognized for his significant contributions to thermal management in electronic systems

Kenneth Goodson, Davies Family Provostial Professor, and chair of the Mechanical Engineering Department, received the Inaugural Richard Chu ITherm Award for his contributions to thermal management of semiconductor circuits, systems and devices. The award, formerly known as the ITherm Achievement Award recognizes significant achievements in the science and art of thermal and thermo-mechanical areas of electronic devices and systems.

Initially established in 1996, the Richard Chu ITherm Award for Excellence in Thermal and Thermo-Mechanical Management of Electronics was renamed to honor its first recipient, Richard Chu. Goodson will receive the award at the 2018 ITherm Conference Banquet in San Diego.

 

 

04.17.2018

Retaining liquids that wet nanostructured interfaces is a big challenge, Damena and collaborators have shown the route forward.  J. Colloid Science & Technology is featuring our article with a cover image, and there is some nice press in IEEE Spectrum.  

03.14.2018

Chirag & Joe led a novel heat sink design for GaN power electronics and co-authored the best poster at the Applied Power Electronics Conf. in San Antonio TX

Here is the full reference for the poster, which is collaborative with the Pilawa group at UIUC:  N. Pallo, C. Kharangate, T. Modeer, J. Schaadt, M. Asheghi, K. Goodson, R.C.N. Pilawa-Podgurski, “Modular Heat Sink for Chip-Scale GaN Transistors in Multilevel Converters”, IEEE Applied Power Electronics Conference, San Antonio, Texas, 2018. 

This is supported by the NSF POETs center, and the awards are quite competitive.  Well done Chirag and Joe!